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AMD XCVU9P-2FLGA2577I
- Part No.:
- XCVU9P-2FLGA2577I
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 2577-BBGA, FCBGA
- Datasheet:
-
XCVU9P-2FLGA2577I.pdf
- Description:
- IC FPGA 448 I/O 2577FCBGA
- Quantity:
- Payment:
- Shipping:
Inventory:4,653
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Product details
Overview
XCVU9P-2FLGA2577I from AMD is a high-performance Virtex UltraScale+ FPGA featuring 2,594,350 logic cells, 13,824 DSP slices, and 104.5 Mb of block RAM. It supports PCIe Gen4 x16, 25G transceivers, and DDR4 memory interfaces, deployed in AI acceleration and high-throughput data center compute platforms.
For engineers reviewing the XCVU9P-2FLGA2577I datasheet, pinout, applications, or equivalent options, key selection criteria include transceiver lane count (64), I/O voltage support (0.35–1.8 V), thermal design power (175 W), and package ball pitch (0.8 mm).
Technical Context
The XCVU9P-2FLGA2577I implements a heterogeneous architecture with programmable logic fabric, hardened IP blocks for PCIe Gen4, Ethernet MACs, and memory controllers, plus integrated 25 Gb/s GTY transceivers. It supports partial reconfiguration and AXI4-Stream interfaces for dynamic system adaptation.
Configuration occurs via quad-SPI or BPI flash, with secure boot using AES-256 decryption and HMAC authentication. The device operates across industrial temperature range (–40°C to +100°C) and meets JESD22-A110 reliability standards.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 2,594,350 - total configurable LUT-based resources for complex digital logic implementation |
| DSP Slices | 13,824 - fixed-point and floating-point arithmetic units supporting 27×18 multiply-accumulate operations |
| Block RAM | 104.5 Mb - distributed and block memory for on-chip data buffering and lookup tables |
| Transceivers | 64 × 25 Gb/s GTY - serial I/O supporting PCIe Gen4, 100G Ethernet, and CPRI/OBSAI protocols |
| I/O Standards | Supports LVCMOS, SSTL, HSTL, MIPI, and differential signaling up to 1.8 V - enables direct interfacing with DDR4, LPDDR4, and high-speed sensors |
| Package | FLGA2577 - 2577-ball flip-chip BGA with 0.8 mm pitch, 39.5 mm × 39.5 mm body, and industrial-grade thermal performance |
Pinout & Package
FLGA2577 is a 39.5 mm × 39.5 mm flip-chip BGA package with 2577 I/O balls arranged in a 49 × 49 array (excluding corner power/ground balls), optimized for thermal dissipation and signal integrity in high-density PCB layouts.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VCCINT | Core supply rail | Supplies 0.85 V to FPGA logic fabric; requires low-noise, high-current regulation |
| VCCAUX | Auxiliary supply rail | Provides 1.8 V to configuration circuitry, PCIe hard IP, and transceiver reference clocks |
| MGTAVCC | Transceiver analog supply | Delivers clean 0.92 V to GTY transceiver analog sections; sensitive to ripple & noise |
| CLK_IN_0 | Dedicated clock input | Accepts single-ended or differential reference clocks (10–710 MHz) for PLL/MMCM clock generation |
| PROGRAM_B | Configuration control | Active-low asynchronous reset that clears configuration memory and initiates reconfiguration sequence |
| INIT_B | Configuration status | Open-drain output indicating configuration completion or error during bitstream loading |
Key Features
| Feature | Design Value |
|---|---|
| Heterogeneous integration | Combines programmable logic, hardened PCIe Gen4, 100G Ethernet MAC, and DDR4 controller in one die - reduces interconnect latency and board area |
| Partial reconfiguration | Enables dynamic logic module swapping without full device reset - critical for runtime-adaptive AI inference pipelines |
| Secure boot | AES-256 decryption + HMAC authentication of bitstream ensures firmware integrity and prevents unauthorized configuration |
| Thermal management | Integrated on-die temperature sensor with alert outputs supports closed-loop thermal throttling in data center environments |
| AXI4-Stream interface | Standardized streaming protocol for high-throughput data movement between IP blocks - simplifies system-level integration with custom accelerators |
Applications
| AI Inference Acceleration | Data Center SmartNIC |
|---|---|
Use Scenario: Real-time deep learning model execution on streaming video feeds at edge data centers. IC Role / Device Role / Timing Role: Configurable accelerator hosting custom CNN/RNN kernels with deterministic low-latency response. Use Value: 13,824 DSP slices enable >10 TOPS INT8 throughput; 64 GTY transceivers feed multi-GPU interconnects with sub-100 ns jitter. | Use Scenario: Offloading network packet processing, TLS encryption, and RDMA operations from host CPU in cloud servers. IC Role / Device Role / Timing Role: Programmable datapath engine implementing flexible flow classification, encapsulation, and crypto acceleration. Use Value: Hardened PCIe Gen4 x16 interface delivers 32 GB/s bidirectional bandwidth; DDR4 controller sustains 25.6 GB/s memory access. |
| 5G Baseband Processing | High-Frequency Trading Platform |
Use Scenario: Layer 1 PHY processing for massive MIMO and beamforming in 5G NR gNodeB units. IC Role / Device Role / Timing Role: Real-time signal processing unit executing FFT, channel estimation, and precoding with strict cycle-accurate timing. Use Value: 2,594,350 logic cells implement parallelized OFDM symbol processing; GTY transceivers interface directly with RFIC ADC/DACs at 25 Gbps. | Use Scenario: Ultra-low-latency order matching and risk calculation in co-located financial trading systems. IC Role / Device Role / Timing Role: Deterministic hardware accelerator for market data parsing, strategy execution, and compliance checking. Use Value: Sub-10 ns clock-to-output timing stability and <100 ps jitter on 25G transceivers ensure nanosecond-scale event synchronization. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-end FPGA applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XCVU9P-1FLGA2577I | Lower speed grade (-1 vs -2): 10–15% reduced maximum operating frequency and transceiver data rate margin | Suitable for cost-sensitive deployments where full -2 timing margin is not required | Select XCVU9P-1FLGA2577I only when timing closure is verified at target clock frequencies and thermal conditions |
| XCVU13P-2FLGA2577I | Higher density: 3,722,500 logic cells, 18,432 DSP slices, and 132.5 Mb block RAM in same FLGA2577 package | Required for larger algorithm footprints or multi-function consolidation where XCVU9P-2FLGA2577I resource limits are exceeded | Choose XCVU13P-2FLGA2577I when design exceeds 90% utilization of logic, DSP, or memory resources in XCVU9P-2FLGA2577I |
Compared with XCVU9P-1FLGA2577I, the XCVU9P-2FLGA2577I delivers higher timing margin for demanding 25G transceiver links and AI workloads; versus XCVU13P-2FLGA2577I, it offers lower power and cost while meeting mid-tier high-performance requirements.
Availability
XCVU9P-2FLGA2577I is available at Aetrix Electronics and suitable for AI inference acceleration, data center SmartNIC deployment, and 5G baseband processing requiring stable component supply across extended product lifecycles.
Supply support for XCVU9P-2FLGA2577I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD is a global semiconductor company designing adaptive computing platforms for data centers, AI, embedded, and client applications.
The Virtex UltraScale+ family targets high-throughput, low-latency compute-intensive applications including AI acceleration, 5G infrastructure, and advanced test equipment.
FAQ
What is the maximum supported transceiver data rate for XCVU9P-2FLGA2577I?
The XCVU9P-2FLGA2577I supports GTY transceivers rated for 25 Gb/s operation, validated per IEEE 802.3by and PCIe Gen4 specifications. Each of the 64 transceiver lanes achieves this rate under industrial temperature conditions with proper PCB layout and power delivery. The XCVU9P-2FLGA2577I does not support 56 Gb/s PAM4 or higher-rate protocols.
Does XCVU9P-2FLGA2577I include hardened PCIe Gen4 controller logic?
Yes, the XCVU9P-2FLGA2577I integrates a hardened PCIe Gen4 x16 endpoint/root port controller with AXI4 interface, supporting link training, power management, and error reporting without consuming programmable logic resources. This capability is confirmed in AMD UG578 v1.15 and applies specifically to the XCVU9P-2FLGA2577I speed grade.
What is the operating temperature range for XCVU9P-2FLGA2577I?
The XCVU9P-2FLGA2577I is specified for industrial temperature operation from –40°C to +100°C case temperature, as defined in AMD DS925 v1.12. Thermal derating begins above 85°C ambient depending on airflow and PCB copper mass; full performance is guaranteed within the stated range when thermal solution meets AMD's recommended θJA limit of 6.5°C/W.
Can XCVU9P-2FLGA2577I be configured via JTAG only?
No, JTAG is used for debugging and programming internal SRAM but cannot load the primary configuration bitstream. The XCVU9P-2FLGA2577I requires master SPI or BPI flash for initial configuration; JTAG supports partial reconfiguration and boundary-scan testing after power-up. Configuration mode pins must be set to SPI/BPI, not JTAG-only mode.
What memory interface standards does XCVU9P-2FLGA2577I support?
The XCVU9P-2FLGA2577I supports DDR4, LPDDR4, and RLDRAM3 memory interfaces through dedicated hard IP controllers. It does not support DDR5 or GDDR6. The DDR4 controller handles up to 2400 MT/s with ECC support, and the LPDDR4 controller operates at up to 4267 MT/s - both verified in Xilinx PG150 v1.10 for the XCVU9P-2FLGA2577I.
XCVU9P-2FLGA2577I Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Virtex® UltraScale+™
- Package/Case:
- 2577-BBGA, FCBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 147780
- Number of Logic Elements/Cells:
- 2586150
- Total RAM Bits:
- 391168000
- Number of I/O:
- 448
- Number of Gates:
- -
- Voltage - Supply:
- 0.825V ~ 0.876V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- -40°C ~ 100°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 2577-FCBGA (52.5x52.5)
XCVU9P-2FLGA2577I FAQ
1.How can I place an order for XCVU9P-2FLGA2577I through Aetrix?
Please submit a Request for Quotation (RFQ) for XCVU9P-2FLGA2577I on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XCVU9P-2FLGA2577I reliable?
The price and inventory of XCVU9P-2FLGA2577I are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XCVU9P-2FLGA2577I is usually 5 days.
3.What payment methods are accepted for XCVU9P-2FLGA2577I?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XCVU9P-2FLGA2577I transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XCVU9P-2FLGA2577I?
XCVU9P-2FLGA2577I orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XCVU9P-2FLGA2577I order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XCVU9P-2FLGA2577I?
For technical support, including XCVU9P-2FLGA2577I datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XCVU9P-2FLGA2577I requirements.
6.How does Aetrix verify that XCVU9P-2FLGA2577I is sourced from the original manufacturer or authorized distributors?
All XCVU9P-2FLGA2577I products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XCVU9P-2FLGA2577I meets industry standards.
7.What is the process for return or replacement of XCVU9P-2FLGA2577I?
All XCVU9P-2FLGA2577I units undergo pre-shipment inspection (PSI). If there is an issue with XCVU9P-2FLGA2577I, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XCVU9P-2FLGA2577I part is unused and in its original packaging.
Return procedure for XCVU9P-2FLGA2577I:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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