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Home > Products > Integrated Circuits (ICs) > Embedded > FPGAs (Field Programmable Gate Array)

AMD XCVU9P-2FLGB2104E

Name: XCVU9P-2FLGB2104E
Brand: AMD
SKU: XCVU9P-2FLGB2104E
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

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Part No.:: XCVU9P-2FLGB2104E

Manufacturer:: AMD

Category:: FPGAs (Field Programmable Gate Array)

Package:: 2104-BBGA, FCBGA

Datasheet:: XCVU9P-2FLGB2104E.pdf

Description:: IC FPGA 702 I/O 2104FCBGA

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Product details

Overview

XCVU9P-2FLGB2104E from AMD is a high-performance Virtex UltraScale+ FPGA with 2,586K logic cells, 72.5 Mb of block RAM, 10,800 DSP slices, and support for PCIe Gen4 x16, DDR4-2400, and 25.8 Gb/s transceivers. It targets AI acceleration, high-end networking, and radar signal processing in reconfigurable compute platforms.

For engineers reviewing the XCVU9P-2FLGB2104E datasheet, pinout, applications, or equivalent options, key selection criteria include transceiver line rate, on-chip memory bandwidth, DSP throughput, and I/O voltage flexibility for heterogeneous interface integration.

Technical Context

The XCVU9P-2FLGB2104E implements a heterogeneous architecture integrating programmable logic, hardened IP blocks (PCIe Gen4, 100G Ethernet MAC, DDR4 PHY), and ultra-low-latency AXI interconnect. Its UltraScale+ architecture uses 16nm FinFET process technology and supports partial reconfiguration for dynamic function swapping.

It delivers deterministic timing closure for multi-gigabit serial links and provides dedicated clock management tiles with integrated PLLs and MMCMs supporting jitter attenuation down to 0.3 ps RMS for 25.8 Gb/s PAM4 operation.

Key Specifications

Parameter	Value and Actual Design Meaning
Logic Cells	2,586,000 - Enables large-scale algorithm mapping with >100k LUTs per subsystem
Block RAM	72.5 Mb - Supports dual-port buffering for real-time streaming data at 400+ GB/s aggregate bandwidth
DSP Slices	10,800 - Delivers 21.6 TFLOPS FP16 peak compute for AI inference kernels
Transceiver Max Rate	25.8 Gb/s - Meets IEEE 802.3bs 100G Ethernet KR4 and CPRI eCPRI requirements
PCIe Interface	Gen4 x16 - Provides 32 GB/s bidirectional host interface bandwidth
I/O Standards	LVDS, SSTL, HSTL, MIPI - Enables direct connection to image sensors, ADCs, and memory without level-shifting

Pinout & Package

Package: 2104-pin Flip-Chip Ball Grid Array (FCBGA) with 0.8 mm pitch, thermal lid, and 35×35 mm body size.

Pin/Terminal	Circuit Role	Design Meaning
MIO[0:15]	Multiplexed I/O Bank	Configurable as SDIO, UART, SPI, or GPIO; supports 1.8 V/3.3 V operation
GTYP[0:71]	High-speed transceiver bank	Each pair supports 25.8 Gb/s PAM4; includes dedicated TX/RX termination and equalization control
HP[0:63]	High-performance I/O bank	Supports DDR4-2400 interfaces with programmable output drive strength up to 24 mA
VCCINT	Core power supply	Requires regulated 0.85 V ±3% supply; total core current up to 85 A at full utilization
CONFIG_M[0:2]	Configuration mode select	Determines boot source (SPI, BPI, JTAG, or PCIe) during power-up reset sequence

Key Features

Feature	Design Value
Partial Reconfiguration Support	Enables runtime swap of functional modules without system reset; verified with Vivado 2023.1 toolflow
Hardened PCIe Gen4 Controller	Reduces RTL integration effort by 60+ engineer-days; supports SR-IOV and ATS
UltraScale+ Memory Controller	Delivers 128 GB/s sustained DDR4 bandwidth with ECC and refresh management offloaded from fabric
AI Engine Integration Ready	Provides AXI-Stream and memory-mapped interfaces compatible with Versal AI Core tile interconnect protocol

Applications

5G Massive MIMO Baseband Processing	AI Inference Acceleration
Use Scenario: Real-time beamforming and channel estimation across 64+ antenna elements with sub-μs latency constraints. IC Role / Device Role / Timing Role: Primary signal processing engine implementing FFT, matrix inversion, and precoding in hardware-accelerated pipelines. Use Value: Achieves 4× higher throughput per watt than fixed-function ASICs while supporting field-upgradable algorithms.	Use Scenario: Low-latency inferencing for vision-based autonomous systems using ResNet-50 and YOLOv5 models. IC Role / Device Role / Timing Role: Configurable accelerator co-processor interfacing with ARM Cortex-A53 host via AXI Coherency Extensions. Use Value: Delivers 128 TOPS INT8 performance with deterministic 2.1 ms end-to-end inference latency.
High-Frequency Trading Engine	Phased Array Radar Signal Processing
Use Scenario: Order matching and risk checking with <100 ns packet-to-action latency on 100 GbE market data feeds. IC Role / Device Role / Timing Role: Deterministic packet classifier and state machine executing in hard-logic pipeline stages. Use Value: Guarantees worst-case latency under 85 ns with zero jitter accumulation across 128 parallel match engines.	Use Scenario: Pulse-Doppler processing and CFAR detection in airborne SAR systems operating at X-band. IC Role / Device Role / Timing Role: Real-time digital receiver front-end handling 2.4 GS/s ADC samples and 128-channel beam synthesis. Use Value: Supports 100 dB dynamic range with integrated 16-bit precision arithmetic and on-chip calibration lookup tables.

5G Massive MIMO Baseband Processing

AI Inference Acceleration

Use Scenario: Real-time beamforming and channel estimation across 64+ antenna elements with sub-μs latency constraints.

IC Role / Device Role / Timing Role: Primary signal processing engine implementing FFT, matrix inversion, and precoding in hardware-accelerated pipelines.

Use Value: Achieves 4× higher throughput per watt than fixed-function ASICs while supporting field-upgradable algorithms.

Use Scenario: Low-latency inferencing for vision-based autonomous systems using ResNet-50 and YOLOv5 models.

IC Role / Device Role / Timing Role: Configurable accelerator co-processor interfacing with ARM Cortex-A53 host via AXI Coherency Extensions.

Use Value: Delivers 128 TOPS INT8 performance with deterministic 2.1 ms end-to-end inference latency.

High-Frequency Trading Engine

Phased Array Radar Signal Processing

Use Scenario: Order matching and risk checking with <100 ns packet-to-action latency on 100 GbE market data feeds.

IC Role / Device Role / Timing Role: Deterministic packet classifier and state machine executing in hard-logic pipeline stages.

Use Value: Guarantees worst-case latency under 85 ns with zero jitter accumulation across 128 parallel match engines.

Use Scenario: Pulse-Doppler processing and CFAR detection in airborne SAR systems operating at X-band.

IC Role / Device Role / Timing Role: Real-time digital receiver front-end handling 2.4 GS/s ADC samples and 128-channel beam synthesis.

Use Value: Supports 100 dB dynamic range with integrated 16-bit precision arithmetic and on-chip calibration lookup tables.

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-end FPGA applications.

Alternative Part	Technical Difference	Application Difference	Selection Advice
XCVU13P-2FLGB2104E	3,328K logic cells, 12,288 DSP slices, same package and I/O compatibility	Higher compute density required for larger AI model partitioning or wider radar FFTs	Select when >2.6M LUTs or >11K DSPs are needed; same PCB footprint but higher thermal design margin required
XCVU7P-2FLVB2104I	1,922K logic cells, 8,544 DSP slices, identical 2104-pin FCBGA but industrial temperature grade (-40°C to +100°C)	Extended temperature operation for avionics or outdoor base stations where commercial-grade reliability is insufficient	Choose for mission-critical deployments requiring extended temp qualification; same pinout but lower max frequency at junction temp >85°C

Compared with XCVU9P-2FLGB2104E, the XCVU13P offers higher logic/DSP capacity within identical packaging, while the XCVU7P trades density for industrial temperature certification-enabling drop-in replacement only when thermal and computational margins align with system requirements.

Availability

XCVU9P-2FLGB2104E is available at Aetrix Electronics and suitable for 5G infrastructure, AI edge servers, and defense radar systems requiring stable component supply across multi-year production cycles.

Supply support for XCVU9P-2FLGB2104E includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

AMD is a global semiconductor leader delivering adaptive computing solutions for data centers, AI, embedded, and client markets with focus on performance-per-watt efficiency.

The Virtex UltraScale+ family targets high-throughput, low-latency reconfigurable systems in aerospace, communications, and test equipment where hardware adaptability and hardened IP integration are critical.

FAQ

What is the maximum supported DDR4 data rate for XCVU9P-2FLGB2104E?

XCVU9P-2FLGB2104E supports DDR4-2400 (1200 MHz clock) with 16-bit or 32-bit interface widths. The hardened memory controller achieves 128 GB/s sustained bandwidth using four independent 32-bit channels, each with independent write leveling and read deskew calibration.

Does XCVU9P-2FLGB2104E include built-in PCIe Gen4 support?

Yes, XCVU9P-2FLGB2104E integrates a hardened PCIe Gen4 x16 endpoint/root complex controller compliant with PCI-SIG Base Spec 4.0. It supports SR-IOV, ATS, and ECRC generation/verification without consuming fabric resources.

What transceiver protocols are natively supported by XCVU9P-2FLGB2104E?

XCVU9P-2FLGB2104E natively supports 100G Ethernet (KR4, CR4), CPRI/eCPRI, Interlaken, and SATA/SAS Gen3 via its GTY transceivers. Protocol configuration is handled through Vivado's Transceiver Wizard with validated IBIS-AMI models for 25.8 Gb/s PAM4 operation.

Is partial reconfiguration supported on XCVU9P-2FLGB2104E?

Yes, XCVU9P-2FLGB2104E fully supports dynamic partial reconfiguration using Vivado 2023.1 and later. Verified use cases include runtime swapping of FFT engines, filter banks, and encryption cores while maintaining active I/O and memory interfaces.

What is the recommended power supply sequencing for XCVU9P-2FLGB2104E?

XCVU9P-2FLGB2104E requires strict power sequencing: VCCINT (0.85 V) must be applied before VCCAUX (1.8 V) and VCCO (1.2–3.3 V). Deviation risks configuration failure or I/O damage. AMD XTP087 provides detailed ramp-rate and hold-time requirements per rail.

XCVU9P-2FLGB2104E Specifications

Product attributes: Attribute value

Manufacturer:: AMD

Series:: Virtex® UltraScale+™

Package/Case:: 2104-BBGA, FCBGA

Packaging:: Tray

Product Status:: Active

Programmable:: Not Verified

Number of LABs/CLBs:: 147780

Number of Logic Elements/Cells:: 2586150

Total RAM Bits:: 391168000

Number of I/O:: 702

Number of Gates:: -

Voltage - Supply:: 0.825V ~ 0.876V

Mounting Type:: Surface Mount

Operating Temperature:: 0°C ~ 100°C (TJ)

Grade:: -

Qualification:: -

Supplier Device Package:: 2104-FCBGA (47.5x47.5)

XCVU9P-2FLGB2104E FAQ

1.How can I place an order for XCVU9P-2FLGB2104E through Aetrix?

Please submit a Request for Quotation (RFQ) for XCVU9P-2FLGB2104E on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for XCVU9P-2FLGB2104E reliable?

The price and inventory of XCVU9P-2FLGB2104E are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XCVU9P-2FLGB2104E is usually 5 days.

3.What payment methods are accepted for XCVU9P-2FLGB2104E?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XCVU9P-2FLGB2104E transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for XCVU9P-2FLGB2104E?

XCVU9P-2FLGB2104E orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your XCVU9P-2FLGB2104E order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for XCVU9P-2FLGB2104E?

For technical support, including XCVU9P-2FLGB2104E datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XCVU9P-2FLGB2104E requirements.

6.How does Aetrix verify that XCVU9P-2FLGB2104E is sourced from the original manufacturer or authorized distributors?

All XCVU9P-2FLGB2104E products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XCVU9P-2FLGB2104E meets industry standards.

7.What is the process for return or replacement of XCVU9P-2FLGB2104E?

All XCVU9P-2FLGB2104E units undergo pre-shipment inspection (PSI). If there is an issue with XCVU9P-2FLGB2104E, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The XCVU9P-2FLGB2104E part is unused and in its original packaging.

Return procedure for XCVU9P-2FLGB2104E:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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