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Home > Products > Integrated Circuits (ICs) > Embedded > FPGAs (Field Programmable Gate Array)

AMD XCVU9P-2FLGB2104I

Name: XCVU9P-2FLGB2104I
Brand: AMD
SKU: XCVU9P-2FLGB2104I
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

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Part No.:: XCVU9P-2FLGB2104I

Manufacturer:: AMD

Category:: FPGAs (Field Programmable Gate Array)

Package:: 2104-BBGA, FCBGA

Datasheet:: XCVU9P-2FLGB2104I.pdf

Description:: IC FPGA 702 I/O 2104FCBGA

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Product details

Overview

XCVU9P-2FLGB2104I from AMD is a high-performance Virtex UltraScale+ FPGA featuring 2,586K logic cells, 72.5 Mb of block RAM, 6,840 DSP slices, and support for PCIe Gen4 x16, DDR4-2400, and 25.8 Gb/s transceivers. It targets AI acceleration, high-speed networking, and radar signal processing in aerospace and defense systems.

For engineers reviewing the XCVU9P-2FLGB2104I datasheet, pinout, applications, or equivalent options, key selection criteria include transceiver line rate, on-chip memory depth, DSP resource count, and thermal design power under sustained compute load.

Technical Context

The XCVU9P-2FLGB2104I implements a heterogeneous architecture with programmable logic fabric, hardened ARM Cortex-A53 processor subsystems (in ZU+ variants), and dedicated RFSoC data converters (not present in this variant). It uses 16nm FinFET process technology and supports partial reconfiguration.

This device integrates 96 GTY transceivers operating up to 25.8 Gb/s, 480 user I/Os in FLGB2104 package, and supports JTAG, SelectMAP, and QSPI configuration modes. It complies with IEEE 1149.1 and includes internal configuration security features.

Key Specifications

Parameter	Value and Actual Design Meaning
Logic Cells	2,586,000 - total configurable LUT-based resources for complex digital logic implementation
Block RAM	72.5 Mb - on-die memory for FIFOs, buffers, and lookup tables without external DRAM
DSP Slices	6,840 - fixed-point and floating-point arithmetic units optimized for filtering and matrix operations
Transceiver Max Rate	25.8 Gb/s - supports 100G/200G Ethernet, CPRI, and JESD204B/C interfaces
User I/O Count	480 - single-ended or differential signaling capability across multiple I/O banks
Configuration Interface	QSPI, SelectMAP, JTAG - enables flexible boot and field update options
Thermal Design Power	55 W (typical) - defines heatsink and airflow requirements for sustained operation

Pinout & Package

The XCVU9P-2FLGB2104I is housed in a 2104-pin Flip-Chip Ball Grid Array (FC-BGA) package with 35 mm × 35 mm body size, 0.8 mm ball pitch, and thermal lid for enhanced heat dissipation.

Pin/Terminal	Circuit Role	Design Meaning
MIO[0:15]	Multiplexed I/O	Configurable as GPIO, SDIO, UART, SPI, or I2C interface pins for PS-to-PL communication
GTYP/GTYN	High-speed transceiver differential pair	Supports 25.8 Gb/s serial protocols including PCIe Gen4 and 100G Ethernet KR4
HR Bank Pins	High-range I/O	Operate at 1.8 V/2.5 V/3.3 V with programmable slew rate and drive strength
VCCINT/VCCAUX/VCCO	Power supply rails	Separate domains for core logic (0.85 V), auxiliary circuitry (1.8 V), and I/O banks (1.2–3.3 V)
PROGRAM_B	Configuration control	Active-low input that initiates FPGA reconfiguration from external flash or host processor

Key Features

Feature	Design Value
Partial Reconfiguration Support	Enables dynamic logic swapping without full device reset, reducing system downtime in mission-critical applications
UltraScale+ Architecture	Delivers 2× higher performance per watt than 28nm Virtex-7, verified in real-world radar beamforming workloads
Integrated Security Engine	Provides AES-256 bitstream encryption, HMAC authentication, and secure boot for tamper-resistant deployment
PCIe Gen4 x16 Hard IP	Reduces latency and FPGA resource usage versus soft-core implementations, enabling direct CPU-FPGA coherency
DDR4 Memory Controller	Supports dual-channel DDR4-2400 with ECC, delivering 38.4 GB/s peak bandwidth for AI inference buffering

Applications

Radar Signal Processing	5G Massive MIMO Baseband
Use Scenario: Real-time beamforming and pulse-Doppler processing in ground-based phased-array radar systems. IC Role / Device Role / Timing Role: FPGA fabric executes time-critical FFTs and CFAR detection; GTY transceivers interface with ADC/DAC FMC modules. Use Value: 25.8 Gb/s transceivers enable direct sampling of IF signals up to 6 GHz, eliminating analog downconversion stages.	Use Scenario: Digital pre-distortion (DPD) and uplink channel estimation in 5G NR macro base stations. IC Role / Device Role / Timing Role: Configurable logic implements adaptive DPD algorithms; PCIe Gen4 x16 connects to host server for real-time parameter updates. Use Value: 6,840 DSP slices sustain >200 GOPS of fixed-point computation required for wideband 5G carrier aggregation.
AI Acceleration at Edge	High-Performance Computing Interconnect
Use Scenario: Low-latency object detection and classification on unmanned aerial vehicle (UAV) platforms with SWaP constraints. IC Role / Device Role / Timing Role: Logic fabric runs quantized CNN inference kernels; DDR4-2400 controller manages feature map buffering with ECC protection. Use Value: 72.5 Mb block RAM eliminates need for external LPDDR4, reducing PCB layer count and EMI emissions.	Use Scenario: Coherent inter-FPGA communication in multi-node HPC clusters using custom RDMA-over-Fabric protocol. IC Role / Device Role / Timing Role: GTY transceivers operate in backplane mode with deterministic latency; partial reconfiguration loads protocol stacks on-demand. Use Value: 480 user I/Os support 24× 10 Gb/s SerDes lanes plus control/status buses, enabling scalable topology expansion.

Radar Signal Processing

5G Massive MIMO Baseband

Use Scenario: Real-time beamforming and pulse-Doppler processing in ground-based phased-array radar systems.

IC Role / Device Role / Timing Role: FPGA fabric executes time-critical FFTs and CFAR detection; GTY transceivers interface with ADC/DAC FMC modules.

Use Value: 25.8 Gb/s transceivers enable direct sampling of IF signals up to 6 GHz, eliminating analog downconversion stages.

Use Scenario: Digital pre-distortion (DPD) and uplink channel estimation in 5G NR macro base stations.

IC Role / Device Role / Timing Role: Configurable logic implements adaptive DPD algorithms; PCIe Gen4 x16 connects to host server for real-time parameter updates.

Use Value: 6,840 DSP slices sustain >200 GOPS of fixed-point computation required for wideband 5G carrier aggregation.

AI Acceleration at Edge

High-Performance Computing Interconnect

Use Scenario: Low-latency object detection and classification on unmanned aerial vehicle (UAV) platforms with SWaP constraints.

IC Role / Device Role / Timing Role: Logic fabric runs quantized CNN inference kernels; DDR4-2400 controller manages feature map buffering with ECC protection.

Use Value: 72.5 Mb block RAM eliminates need for external LPDDR4, reducing PCB layer count and EMI emissions.

Use Scenario: Coherent inter-FPGA communication in multi-node HPC clusters using custom RDMA-over-Fabric protocol.

IC Role / Device Role / Timing Role: GTY transceivers operate in backplane mode with deterministic latency; partial reconfiguration loads protocol stacks on-demand.

Use Value: 480 user I/Os support 24× 10 Gb/s SerDes lanes plus control/status buses, enabling scalable topology expansion.

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-end FPGA applications.

Alternative Part	Technical Difference	Application Difference	Selection Advice
XCVU13P-2FLGA2577I	Higher logic density (3,725K cells), larger package (2577-ball), 10% higher TDP	Better suited for multi-tenancy AI training workloads requiring >100 TOPS INT8 throughput	Select when additional DSP and BRAM resources justify increased board area and cooling complexity
XCVU7P-2FLVA2104I	Fewer GTY transceivers (60 vs. 96), same FLGA2104 footprint but lower I/O count (420 vs. 480)	Targeted at cost-sensitive 100G optical transport where full transceiver count is unused	Choose for designs where 25.8 Gb/s line rate is needed but aggregate bandwidth demand is ≤600 Gb/s

Compared with XCVU13P-2FLGA2577I and XCVU7P-2FLVA2104I, the XCVU9P-2FLGB2104I delivers optimal balance of transceiver count, DSP density, and thermal envelope for radar and 5G baseband applications requiring deterministic low-latency execution.

Availability

XCVU9P-2FLGB2104I is available at Aetrix Electronics and suitable for radar signal processing, 5G massive MIMO baseband, and AI acceleration at edge requiring stable component supply across extended product lifecycles.

Supply support for XCVU9P-2FLGB2104I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

AMD is a global semiconductor company designing adaptive computing solutions for data centers, AI, embedded, and client markets, with leadership in FPGA, CPU, GPU, and adaptive SoC technologies.

The Virtex UltraScale+ family targets high-throughput, low-latency applications in aerospace, defense, wired/wireless infrastructure, and test & measurement, emphasizing signal integrity, security, and long-term obsolescence management.

FAQ

What is the maximum supported data rate for transceivers on the XCVU9P-2FLGB2104I?

The XCVU9P-2FLGB2104I integrates GTY transceivers rated for up to 25.8 Gb/s per lane. This enables compliance with PCIe Gen4, 100G Ethernet KR4, and JESD204C standards. Actual achievable line rate depends on PCB stackup, reference clock stability, and equalization settings configured via Vivado tools. The XCVU9P-2FLGB2104I transceiver specification is validated across temperature and voltage corners per AMD DS924.

Does the XCVU9P-2FLGB2104I include a hard ARM processor subsystem?

No, the XCVU9P-2FLGB2104I does not integrate a hard ARM processor subsystem. That feature is exclusive to Zynq UltraScale+ MPSoC devices (e.g., ZU+ series). The XCVU9P-2FLGB2104I is a pure FPGA fabric device optimized for programmable logic, DSP, and high-speed I/O-no integrated application processors or real-time cores are present in the XCVU9P-2FLGB2104I.

What configuration modes are supported by the XCVU9P-2FLGB2104I?

The XCVU9P-2FLGB2104I supports three primary configuration modes: Master SPI (via QSPI flash), Slave SelectMAP (parallel interface with external processor), and JTAG (for debugging and programming). Configuration is initiated by the PROGRAM_B pin and completed through dedicated configuration logic. All modes are fully supported in the XCVU9P-2FLGB2104I and documented in UG570 v1.14.

Is partial reconfiguration supported on the XCVU9P-2FLGB2104I?

Yes, partial reconfiguration is fully supported on the XCVU9P-2FLGB2104I using Vivado Design Suite 2023.1+. It allows dynamic swapping of logical partitions without resetting the entire device, preserving state in unmodified regions. This capability is verified in XCVU9P-2FLGB2104I silicon and used in radar ECM systems where waveform agility requires runtime logic updates.

What is the thermal design power (TDP) of the XCVU9P-2FLGB2104I under typical operating conditions?

The XCVU9P-2FLGB2104I has a typical thermal design power of 55 W, measured under worst-case utilization of logic, DSP, and transceivers at junction temperature of 85°C and VCCINT = 0.85 V. This value guides heatsink sizing and airflow requirements. Actual power consumption varies with design utilization and voltage scaling; the XCVU9P-2FLGB2104I power estimator tool provides accurate modeling based on implemented netlist.

XCVU9P-2FLGB2104I Specifications

Product attributes: Attribute value

Manufacturer:: AMD

Series:: Virtex® UltraScale+™

Package/Case:: 2104-BBGA, FCBGA

Packaging:: Tray

Product Status:: Active

Programmable:: Not Verified

Number of LABs/CLBs:: 147780

Number of Logic Elements/Cells:: 2586150

Total RAM Bits:: 391168000

Number of I/O:: 702

Number of Gates:: -

Voltage - Supply:: 0.825V ~ 0.876V

Mounting Type:: Surface Mount

Operating Temperature:: -40°C ~ 100°C (TJ)

Grade:: -

Qualification:: -

Supplier Device Package:: 2104-FCBGA (47.5x47.5)

XCVU9P-2FLGB2104I FAQ

1.How can I place an order for XCVU9P-2FLGB2104I through Aetrix?

Please submit a Request for Quotation (RFQ) for XCVU9P-2FLGB2104I on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for XCVU9P-2FLGB2104I reliable?

The price and inventory of XCVU9P-2FLGB2104I are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XCVU9P-2FLGB2104I is usually 5 days.

3.What payment methods are accepted for XCVU9P-2FLGB2104I?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XCVU9P-2FLGB2104I transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for XCVU9P-2FLGB2104I?

XCVU9P-2FLGB2104I orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your XCVU9P-2FLGB2104I order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for XCVU9P-2FLGB2104I?

For technical support, including XCVU9P-2FLGB2104I datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XCVU9P-2FLGB2104I requirements.

6.How does Aetrix verify that XCVU9P-2FLGB2104I is sourced from the original manufacturer or authorized distributors?

All XCVU9P-2FLGB2104I products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XCVU9P-2FLGB2104I meets industry standards.

7.What is the process for return or replacement of XCVU9P-2FLGB2104I?

All XCVU9P-2FLGB2104I units undergo pre-shipment inspection (PSI). If there is an issue with XCVU9P-2FLGB2104I, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The XCVU9P-2FLGB2104I part is unused and in its original packaging.

Return procedure for XCVU9P-2FLGB2104I:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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