AMD XCVU9P-2FLGC2104E

Overview

XCVU9P-2FLGC2104E from AMD is a high-performance Virtex UltraScale+ FPGA featuring 2,586,000 logic cells, 128.5 GB/s transceiver bandwidth (32×25.78125 Gb/s GTY), and integrated HBM2 memory delivering 256 GB/s memory bandwidth. It targets AI acceleration, 5G baseband processing, and high-throughput data center offload.

For engineers reviewing the XCVU9P-2FLGC2104E datasheet, pinout, applications, or equivalent options, key selection criteria include HBM2 interface support, GTY transceiver count and rate, logic cell capacity, thermal design power (250 W), and FLGC2104 package compatibility with high-density interconnect PCBs.

Technical Context

The XCVU9P-2FLGC2104E implements a heterogeneous architecture integrating programmable logic, hardened IP blocks (PCIe Gen4 x16, 100G Ethernet MAC, DDR4 controller), and two stacks of 4-Hi HBM2 DRAM (8 GB total). Its GTY transceivers support PAM4 and NRZ modulation up to 25.78125 Gb/s with built-in FEC.

Configuration occurs via dual BPI NOR flash or JTAG, with bitstream encryption using AES-256 and HMAC-SHA256. The device supports partial reconfiguration and dynamic function exchange for runtime hardware adaptation in compute-intensive workloads.

Key Specifications

Pinout & Package

The XCVU9P-2FLGC2104E uses a 2104-ball flip-chip BGA (FLGC2104) with 35 mm × 35 mm body size and 0.8 mm ball pitch. Ball map includes dedicated VCCINT/VCCAUX/VCCO banks, GTY differential pairs grouped by quad, HBM2 channel interfaces (CK/CS/CA/DQ/DM), and configuration pins (INIT_B, PROGRAM_B, CCLK).

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-end FPGA applications.

Compared with XCVU9P-2FLGC2104E, the XCVU13P offers higher scalability at the cost of footprint and power, while the XCVU7P trades HBM2 and transceiver count for industrial-grade operation and smaller form factor-enabling differentiated deployment across AI, telecom, and embedded domains.

Availability

XCVU9P-2FLGC2104E is available at Aetrix Electronics and suitable for AI inference acceleration, 5G baseband processing, and data center offload requiring stable component supply across multi-year production cycles.

Supply support for XCVU9P-2FLGC2104E includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

AMD is a global semiconductor company designing adaptive computing platforms including FPGAs, adaptive SoCs, and AI accelerators for data center, communications, and embedded markets.

The Virtex UltraScale+ family delivers heterogeneous compute combining programmable logic, hardened IP, and stacked memory for demanding infrastructure applications where performance-per-watt and memory bandwidth are critical.

FAQ

What is the maximum supported data rate for GTY transceivers on the XCVU9P-2FLGC2104E?

The XCVU9P-2FLGC2104E supports GTY transceivers up to 25.78125 Gb/s per lane using NRZ signaling, and up to 51.5625 Gb/s with PAM4 modulation. These rates are validated per AMD UG578 v1.14 and apply to all 32 GTY quads in the FLGC2104 package. System-level margin depends on PCB interconnect quality and reference clock jitter.

Does the XCVU9P-2FLGC2104E include on-die HBM2 memory, and how is it organized?

Yes, the XCVU9P-2FLGC2104E integrates two 4-Hi HBM2 stacks totaling 8 GB, arranged as two independent 128-bit-wide channels each delivering 128 GB/s. This configuration is fixed and not user-configurable. The HBM2 interface uses dedicated silicon interposer connections, eliminating external memory traces and reducing latency by >70% versus DDR4.

What configuration modes does the XCVU9P-2FLGC2104E support?

The XCVU9P-2FLGC2104E supports master SPI, slave SPI, BPI x16, and JTAG configuration modes. Bitstream loading can be initiated via PROGRAM_B assertion or power-on reset. Configuration security includes AES-256 encryption and HMAC-SHA256 authentication, both enforced during every boot cycle for the XCVU9P-2FLGC2104E.

Is partial reconfiguration supported on the XCVU9P-2FLGC2104E, and what tools enable it?

Yes, partial reconfiguration is fully supported on the XCVU9P-2FLGC2104E using Vivado Design Suite 2023.2+. It allows dynamic replacement of logical partitions (e.g., different AI kernel modules) without resetting the entire device. PR implementation requires floorplanning with Pblock constraints and checkpoint-based incremental compilation for the XCVU9P-2FLGC2104E.

What thermal management guidance applies to the XCVU9P-2FLGC2104E in continuous operation?

The XCVU9P-2FLGC2104E has a 250 W thermal design power (TDP) under worst-case operating conditions. AMD recommends a vapor chamber heatsink with ≥0.15 W/(cm²·°C) thermal resistance and forced airflow ≥150 LFPM across the FLGC2104 package. Thermal vias must be placed under the die area with ≥12x 10-mil vias per mm² for effective heat transfer from the XCVU9P-2FLGC2104E to internal ground planes.