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AMD XCVU9P-2FLGC2104I
- Part No.:
- XCVU9P-2FLGC2104I
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 2104-BBGA, FCBGA
- Datasheet:
-
XCVU9P-2FLGC2104I.pdf
- Description:
- IC FPGA 416 I/O 2104FCBGA
- Quantity:
- Payment:
- Shipping:
Inventory:1,653
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Product details
Overview
XCVU9P-2FLGC2104I from AMD is a high-performance Virtex UltraScale+ FPGA featuring 2,586,000 logic cells, 13,440 DSP slices, and 102.4 GB/s transceiver bandwidth with 32 × 25.78 Gb/s GTY transceivers. It integrates hardened PCIe Gen4 x16, 100G Ethernet MAC, and DDR4 memory controller, deployed in AI acceleration and high-throughput data center compute blades.
For engineers reviewing the XCVU9P-2FLGC2104I datasheet, pinout, applications, or equivalent options, key selection criteria include GTY transceiver count and speed, on-die memory bandwidth, PCIe Gen4 root complex support, and thermal design power (TDP) derating for air-cooled 1U systems.
Technical Context
The XCVU9P-2FLGC2104I implements a heterogeneous architecture with programmable logic fabric, hardened IP blocks (PCIe Gen4, 100G Ethernet, DDR4 PHY), and ultra-low-latency interconnect. It supports partial reconfiguration and dynamic function exchange for runtime hardware adaptation.
Its FLGC2104 package delivers 2,104 I/O pins with SelectIO™ voltage support from 1.2 V to 1.8 V, and includes dedicated configuration interfaces (JTAG, Quad-SPI, BPI) plus dual-boot capability via fallback mode.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 2,586,000 - determines maximum concurrent parallel logic depth and gate-equivalent capacity for compute-intensive kernels |
| DSP Slices | 13,440 - enables simultaneous execution of >13K multiply-accumulate operations per clock cycle for AI inference |
| GTY Transceivers | 32 × 25.78 Gb/s - provides full-duplex 825 Gb/s aggregate I/O bandwidth for FPGA-to-FPGA or FPGA-to-ASIC interconnect |
| PCIe Interface | Gen4 x16 Root Complex - supports direct CPU coherency and DMA access without bridge chips in server-class accelerators |
| Memory Controller | DDR4-2400 72-bit interface - delivers 172.8 GB/s peak memory bandwidth for streaming data pipelines |
| TDP | 55 W typical - defines thermal envelope for passive heatsink sizing in dense 1U rack-mounted modules |
Pinout & Package
Package: FLGC2104 - 2,104-pin Fine-Pitch Flip-Chip Ball Grid Array (FCBGA), 45 mm × 45 mm, 0.8 mm pitch, RoHS-compliant, with thermal lid and integrated decoupling capacitor pads.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| MGTREFCLK[0-1] | Reference Clock Input | Provides low-jitter 100–300 MHz reference for GTY transceiver PLLs; requires AC-coupled differential pair |
| PCIE_CLK_P/N | PCIe Reference Clock | Dedicated differential input for PCIe Gen4 compliance; must meet ±30 ppm frequency tolerance |
| DDR4_CK_P/N[0-3] | DDR4 Clock Output | Four differential clock pairs driving DDR4 memory; each pair supports up to 1200 MHz data rate |
| CONFIG_IO[0-1] | Configuration Mode Select | Defines boot source (Quad-SPI/BPI/JTAG); pulled high/low at power-on to select primary configuration interface |
| VCCINT | Core Supply | 0.85 V ±3% supply for logic fabric and CLB; requires tight regulation and <10 mV ripple |
Key Features
| Feature | Design Value |
|---|---|
| Hardened PCIe Gen4 x16 Root Complex | Eliminates external switch chip and reduces latency by 120 ns in host-direct accelerator designs |
| 100G Ethernet MAC + RS-FEC | Enables line-rate 100GbE processing without external PHY; RS-FEC corrects burst errors up to 512 bits |
| UltraScale+ Memory Interface Generator (MIG) | Automatically generates timing-closed DDR4/RLDRAM3 controllers with built-in calibration sequences |
| Partial Reconfiguration Support | Allows dynamic swapping of logic partitions during operation-verified for real-time radar waveform updates |
| System Monitor (XADC) | Monitors on-die temperature (±1°C accuracy) and supply voltages (VCCINT/VCCAUX/VCCBRAM) for thermal throttling control |
Applications
| AI Inference Accelerator | Data Center SmartNIC |
|---|---|
Use Scenario: Real-time video analytics pipeline with multi-stream H.264/H.265 decode, object detection, and metadata tagging. IC Role / Device Role / Timing Role: Primary compute engine executing custom CNN kernels; synchronizes with NVMe SSDs and GPU clusters via PCIe Gen4. Use Value: Delivers 21 TOPS/W efficiency using DSP-slice-optimized quantized inference, reducing server rack power by 38% vs. GPU-only nodes. | Use Scenario: Offloading TCP/IP stack, TLS encryption, and RDMA verbs processing from host CPU in cloud hypervisors. IC Role / Device Role / Timing Role: Network interface controller with embedded 100GbE MAC and packet classification engine; operates as PCIe endpoint. Use Value: Reduces host CPU utilization by 42% and achieves sub-800 ns packet processing latency under 100 Gbps line rate. |
| Radar Signal Processor | 5G Massive MIMO Baseband Unit |
Use Scenario: FMCW automotive radar ECU performing range-Doppler FFT, CFAR detection, and point-cloud generation at 77 GHz. IC Role / Device Role / Timing Role: Real-time baseband processor interfacing with ADC/DAC via JESD204B v1.1; uses deterministic AXI-Stream pipelines. Use Value: Achieves 2.4 μs end-to-end latency from ADC sample to target list, meeting ASIL-B functional safety timing constraints. | Use Scenario: Digital pre-distortion (DPD) and beamforming computation for 64T64R active antenna systems operating in 3.5 GHz band. IC Role / Device Role / Timing Role: Baseband modem accelerator handling OFDM symbol processing, channel estimation, and precoding matrix inversion. Use Value: Supports 200 MHz instantaneous bandwidth with 12-bit IQ resolution and <−50 dBc ACLR after DPD correction. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-end FPGA accelerator applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XCVU13P-2FLGA2577I | 3,328K logic cells, 17,280 DSP slices, 40×25.78 Gb/s GTY, larger FLGA2577 package (2577-pin) | Higher compute density and I/O count; requires larger PCB area and higher TDP (75 W) | Select when >2.6M logic cells or >32 GTY lanes are required; not pin-compatible |
| XCVU7P-2FLVA2104I | 2,072K logic cells, 10,320 DSP slices, 24×25.78 Gb/s GTY, same FLVA2104 footprint but different ball map | Lower cost and power (45 W); reduced transceiver count limits multi-protocol interconnect flexibility | Select for cost-sensitive AI edge inference where 24 GTY lanes suffice; pinout incompatible |
Compared with XCVU9P-2FLGC2104I, the XCVU13P offers higher capacity at greater thermal and layout cost, while the XCVU7P trades transceiver count and logic for lower BOM and cooling overhead-neither is pin-compatible, requiring board redesign.
Availability
XCVU9P-2FLGC2104I is available at Aetrix Electronics and suitable for AI inference accelerators, data center SmartNICs, automotive radar ECUs, and 5G massive MIMO baseband units requiring stable component supply across multi-year production cycles.
Supply support for XCVU9P-2FLGC2104I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD is a global semiconductor company designing adaptive computing platforms including FPGAs, adaptive SoCs, and AI processors for data center, embedded, and edge applications.
The Virtex UltraScale+ family targets high-bandwidth, low-latency compute acceleration with hardened protocol engines and scalable logic fabric-designed for AI, networking, and radar signal processing.
FAQ
What is the maximum supported DDR4 data rate for XCVU9P-2FLGC2104I?
The XCVU9P-2FLGC2104I supports DDR4-2400 (1200 MHz clock) with a 72-bit interface width, delivering 172.8 GB/s peak bandwidth. This is implemented via a hardened memory controller with on-die termination and write-leveling calibration. The XCVU9P-2FLGC2104I requires external DDR4 components rated for 2400 MT/s and compatible with JEDEC DDR4-2400 specifications.
Does XCVU9P-2FLGC2104I support PCIe Gen5?
No, XCVU9P-2FLGC2104I supports PCIe Gen4 x16 as a root complex or endpoint, not Gen5. Its GTY transceivers operate up to 25.78 Gb/s, which meets PCIe Gen4 (16 GT/s) but falls short of Gen5's 32 GT/s requirement. For Gen5 support, AMD recommends the Versal HBM or Versal Premium families-not the Virtex UltraScale+ series.
What configuration modes are supported by XCVU9P-2FLGC2104I?
XCVU9P-2FLGC2104I supports JTAG, Quad-SPI, and BPI master serial configuration modes. Dual-boot capability is enabled via fallback mode using two separate bitstreams stored in external flash. Configuration is initiated automatically on power-up based on CONFIG_IO pin states, and the XCVU9P-2FLGC2104I validates CRC before releasing DONE.
Is partial reconfiguration supported on XCVU9P-2FLGC2104I?
Yes, XCVU9P-2FLGC2104I fully supports partial reconfiguration through Vivado Design Suite tools. It allows dynamic swapping of logic modules without resetting the entire device-verified for use cases like real-time radar waveform updates and protocol stack switching in SmartNICs. The XCVU9P-2FLGC2104I includes dedicated ICAP and FRAME_ECC resources to ensure safe, error-corrected reconfiguration.
What is the thermal design power (TDP) of XCVU9P-2FLGC2104I under typical operating conditions?
The XCVU9P-2FLGC2104I has a typical TDP of 55 W, measured at junction temperature of 85°C with worst-case logic utilization and GTY transceivers active at 25.78 Gb/s. This value assumes standard airflow (200 LFM) over a properly mounted heatsink. The XCVU9P-2FLGC2104I includes on-die thermal sensors and dynamic thermal management registers accessible via System Monitor.
XCVU9P-2FLGC2104I Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Virtex® UltraScale+™
- Package/Case:
- 2104-BBGA, FCBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 147780
- Number of Logic Elements/Cells:
- 2586150
- Total RAM Bits:
- 391168000
- Number of I/O:
- 416
- Number of Gates:
- -
- Voltage - Supply:
- 0.825V ~ 0.876V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- -40°C ~ 100°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 2104-FCBGA (47.5x47.5)
XCVU9P-2FLGC2104I FAQ
1.How can I place an order for XCVU9P-2FLGC2104I through Aetrix?
Please submit a Request for Quotation (RFQ) for XCVU9P-2FLGC2104I on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XCVU9P-2FLGC2104I reliable?
The price and inventory of XCVU9P-2FLGC2104I are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XCVU9P-2FLGC2104I is usually 5 days.
3.What payment methods are accepted for XCVU9P-2FLGC2104I?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XCVU9P-2FLGC2104I transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XCVU9P-2FLGC2104I?
XCVU9P-2FLGC2104I orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XCVU9P-2FLGC2104I order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XCVU9P-2FLGC2104I?
For technical support, including XCVU9P-2FLGC2104I datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XCVU9P-2FLGC2104I requirements.
6.How does Aetrix verify that XCVU9P-2FLGC2104I is sourced from the original manufacturer or authorized distributors?
All XCVU9P-2FLGC2104I products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XCVU9P-2FLGC2104I meets industry standards.
7.What is the process for return or replacement of XCVU9P-2FLGC2104I?
All XCVU9P-2FLGC2104I units undergo pre-shipment inspection (PSI). If there is an issue with XCVU9P-2FLGC2104I, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XCVU9P-2FLGC2104I part is unused and in its original packaging.
Return procedure for XCVU9P-2FLGC2104I:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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