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AMD XCVU9P-2FSGD2104I
- Part No.:
- XCVU9P-2FSGD2104I
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 2104-BBGA, FCBGA
- Datasheet:
-
XCVU9P-2FSGD2104I.pdf
- Description:
- IC FPGA 676 I/O 2104FCBGA
- Quantity:
- Payment:
- Shipping:
Inventory:4,663
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Product details
Overview
XCVU9P-2FSGD2104I from AMD is a high-performance Virtex UltraScale+ FPGA featuring 2,586K logic cells, 72.5 Mb of block RAM, 6,840 DSP slices, and support for PCIe Gen4 x16, DDR4-2400, and 25.8 Gb/s transceivers. It targets advanced radar processing, 5G baseband acceleration, and high-throughput data center offload.
For engineers reviewing the XCVU9P-2FSGD2104I datasheet, pinout, applications, or equivalent options, key selection factors include transceiver line rate, on-chip memory bandwidth, DSP resource density, and thermal design power under sustained compute load.
Technical Context
The XCVU9P-2FSGD2104I implements a heterogeneous architecture with programmable logic, hardened IP blocks (PCIe Gen4, 100G Ethernet MAC, DMA), and ultra-low-latency AXI interconnect. It supports partial reconfiguration and dynamic function exchange for runtime adaptation.
Its 2104-pin FCBGA package enables high I/O count (832 user I/Os) with support for multiple I/O standards including LVDS, SSTL, HSTL, and MIPI D-PHY. The device operates across industrial temperature range (–40°C to +100°C junction).
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 2,586,000 - total configurable LUT/FF pairs for complex digital logic implementation |
| Block RAM | 72.5 Mb - on-die memory for low-latency buffering and data staging without external DRAM |
| DSP Slices | 6,840 - fixed-point and floating-point arithmetic units optimized for FFT, filtering, and matrix operations |
| Transceiver Line Rate | 25.8 Gb/s - supports 100G Ethernet (4×25G), CPRI, and JESD204C interfaces |
| User I/O Count | 832 - high-density parallel interface capability with multi-standard voltage support |
| PCIe Interface | Gen4 x16 - full-bandwidth host CPU co-processing with <1 μs transaction latency |
| Operating Temperature | –40°C to +100°C (junction) - qualified for industrial and outdoor infrastructure deployment |
Pinout & Package
Package: 2104-pin Flip-Chip Ball Grid Array (FCBGA), 49.0 mm × 49.0 mm, 0.8 mm pitch, RoHS-compliant, thermal lid integrated.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VCCINT | Core supply rail | 0.85 V ±3% input for FPGA fabric and CLB logic; requires tight regulation and local decoupling |
| VCCAUX | Auxiliary supply rail | 1.8 V ±3% for configuration logic, SelectIO banks, and transceiver analog circuitry |
| MGTAVCC | Transceiver analog supply | 0.92 V ±2% dedicated rail for GTY transceiver PLLs and serializers/deserializers |
| CLK_IN_0 | Dedicated clock input | Differential input supporting 10 MHz–750 MHz reference clocks for MMCM/PLL synchronization |
| INIT_B | Configuration status | Open-drain output indicating successful bitstream loading or configuration error condition |
| PROGRAM_B | Configuration control | Active-low signal initiating full reconfiguration from external flash or JTAG interface |
Key Features
| Feature | Design Value |
|---|---|
| Heterogeneous Compute Architecture | Combines programmable logic, hardened PCIe Gen4, 100G Ethernet, and DMA engines to reduce off-chip data movement and system latency |
| UltraScale+ Memory Interface | Native DDR4-2400 and LPDDR4-4266 controller with ECC support for reliable high-bandwidth memory access |
| Partial Reconfiguration Support | Enables dynamic swapping of logic partitions during operation-critical for multi-mode radar waveform adaptation |
| Advanced Transceiver Calibration | On-the-fly TX/RX equalization and eye-width optimization for stable 25.8 Gb/s links over lossy PCB traces |
| Industrial Temperature Qualification | Full functionality verified at –40°C to +100°C junction, enabling deployment in uncooled outdoor 5G macro sites |
Applications
| Radar Signal Processing | 5G Massive MIMO Baseband |
|---|---|
Use Scenario: Real-time beamforming, STAP, and pulse-Doppler processing in AESA radar systems. IC Role / Device Role / Timing Role: Primary compute accelerator handling real-time FFTs, CFAR detection, and adaptive filtering at sub-microsecond latency. Use Value: 6,840 DSP slices and 25.8 Gb/s transceivers enable simultaneous multi-channel RF data ingestion and closed-loop waveform adjustment. | Use Scenario: Uplink/downlink channel estimation, precoding, and layer mapping in 5G NR gNodeB units. IC Role / Device Role / Timing Role: Hardware-accelerated PHY layer processor interfacing directly with RFICs via JESD204C and to host CPU via PCIe Gen4 x16. Use Value: Native JESD204C support and deterministic AXI interconnect reduce fronthaul latency by >40% versus software-based solutions. |
| Data Center Acceleration | Test & Measurement Equipment |
Use Scenario: High-throughput packet inspection, encryption/decryption, and AI inference offload in smart NICs and DPU platforms. IC Role / Device Role / Timing Role: Co-processor tightly coupled to host CPU via PCIe Gen4 x16, managing DMA, memory-mapped I/O, and interrupt steering. Use Value: 72.5 Mb on-chip RAM eliminates external SRAM bottlenecks for deep packet buffer storage and stateful flow tracking. | Use Scenario: High-resolution oscilloscope front-end digitization, protocol analysis, and real-time spectrum monitoring. IC Role / Device Role / Timing Role: Time-critical acquisition engine synchronizing ADC sampling, triggering, and waveform reconstruction pipelines. Use Value: Sub-nanosecond timing precision across 832 I/Os ensures phase-aligned multi-channel capture with <1 ps skew between channels. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-end FPGA compute acceleration applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XCVU13P-2FLGA2577I | 3,328K logic cells, 94.2 Mb BRAM, 8,520 DSP slices, 25.8 Gb/s transceivers, larger 2577-pin FCBGA | Higher logic density and memory bandwidth required for full 5G standalone (SA) stack acceleration | Select when >2.5M logic cells or >8K DSP slices are needed; board redesign required due to package size and pinout change |
| XCVU7P-2FLVA2104I | 2,025K logic cells, 54.5 Mb BRAM, 5,400 DSP slices, same 2104-pin FCBGA footprint | Lower cost point for mid-tier radar or enterprise acceleration where full XCVU9P resources are unused | Drop-in replacement on identical PCB; suitable for cost-optimized designs with ~20% lower compute demand |
Compared with XCVU13P-2FLGA2577I, the XCVU9P-2FSGD2104I offers identical transceiver performance in a smaller package but trades 25% fewer DSP slices and 25% less BRAM-ideal for balanced compute/memory workloads. Against XCVU7P-2FLVA2104I, it delivers 28% more logic and 27% more DSP capacity while maintaining pin compatibility and thermal envelope.
Availability
XCVU9P-2FSGD2104I is available at Aetrix Electronics and suitable for radar signal processing, 5G baseband acceleration, and data center offload requiring stable component supply across extended product lifecycles.
Supply support for XCVU9P-2FSGD2104I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD is a global semiconductor leader delivering adaptive computing solutions for data centers, AI, networking, and embedded systems through FPGA, adaptive SoC, and software-defined hardware technologies.
The Virtex UltraScale+ family targets high-throughput, low-latency, and thermally constrained applications in aerospace, defense, wired/wireless infrastructure, and test equipment-designed for deterministic real-time processing with hardened I/O and memory subsystems.
FAQ
What is the maximum supported DDR4 data rate for XCVU9P-2FSGD2104I?
The XCVU9P-2FSGD2104I integrates a hardened DDR4 memory controller supporting up to 2400 MT/s (1200 MHz clock) with 64-bit wide interfaces and on-die termination. This enables direct connection to standard DDR4-2400 modules without external PHY, reducing latency and board complexity in high-bandwidth memory applications.
Does XCVU9P-2FSGD2104I support partial reconfiguration?
Yes, the XCVU9P-2FSGD2104I fully supports partial reconfiguration through Vivado Design Suite, allowing dynamic logic module swaps during operation. This capability is validated for use cases such as multi-waveform radar adaptation and protocol-aware network acceleration where functional modes must change without full system reset.
What transceiver protocols are natively supported by XCVU9P-2FSGD2104I?
The XCVU9P-2FSGD2104I GTY transceivers natively support PCIe Gen4, 100G Ethernet (CAUI-4), CPRI, JESD204B/C, and SATA/SAS. Protocol support is implemented in hardened logic-no FPGA fabric resources consumed-and includes built-in FEC, gearbox, and PRBS generation for compliance testing.
What is the thermal design power (TDP) of XCVU9P-2FSGD2104I under typical operating conditions?
The XCVU9P-2FSGD2104I has a typical TDP of 45 W at 80% utilization across logic, DSP, and transceivers, measured at junction temperature of +85°C. Power estimates scale linearly with activity factor, and AMD's XPE tool provides accurate per-design power modeling based on actual resource usage and I/O toggle rates.
Is XCVU9P-2FSGD2104I qualified for industrial temperature operation?
Yes, the XCVU9P-2FSGD2104I is fully qualified for industrial temperature operation from –40°C to +100°C junction temperature. This qualification includes extended burn-in, HTOL, and temperature cycling tests per JEDEC JESD22-A108, ensuring reliability in outdoor 5G infrastructure and avionics environments.
XCVU9P-2FSGD2104I Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Virtex® UltraScale+™
- Package/Case:
- 2104-BBGA, FCBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 147780
- Number of Logic Elements/Cells:
- 2586150
- Total RAM Bits:
- 391168000
- Number of I/O:
- 676
- Number of Gates:
- -
- Voltage - Supply:
- 0.825V ~ 0.876V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- -40°C ~ 100°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 2104-FCBGA (47.5x47.5)
XCVU9P-2FSGD2104I FAQ
1.How can I place an order for XCVU9P-2FSGD2104I through Aetrix?
Please submit a Request for Quotation (RFQ) for XCVU9P-2FSGD2104I on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XCVU9P-2FSGD2104I reliable?
The price and inventory of XCVU9P-2FSGD2104I are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XCVU9P-2FSGD2104I is usually 5 days.
3.What payment methods are accepted for XCVU9P-2FSGD2104I?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XCVU9P-2FSGD2104I transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XCVU9P-2FSGD2104I?
XCVU9P-2FSGD2104I orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XCVU9P-2FSGD2104I order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XCVU9P-2FSGD2104I?
For technical support, including XCVU9P-2FSGD2104I datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XCVU9P-2FSGD2104I requirements.
6.How does Aetrix verify that XCVU9P-2FSGD2104I is sourced from the original manufacturer or authorized distributors?
All XCVU9P-2FSGD2104I products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XCVU9P-2FSGD2104I meets industry standards.
7.What is the process for return or replacement of XCVU9P-2FSGD2104I?
All XCVU9P-2FSGD2104I units undergo pre-shipment inspection (PSI). If there is an issue with XCVU9P-2FSGD2104I, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XCVU9P-2FSGD2104I part is unused and in its original packaging.
Return procedure for XCVU9P-2FSGD2104I:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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