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AMD XCVU9P-3FLGA2104E
- Part No.:
- XCVU9P-3FLGA2104E
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 2104-BBGA, FCBGA
- Datasheet:
-
XCVU9P-3FLGA2104E.pdf
- Description:
- IC FPGA 832 I/O 2104FCBGA
- Quantity:
- Payment:
- Shipping:
Inventory:3,160
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Product details
Overview
XCVU9P-3FLGA2104E from AMD is a high-performance Virtex UltraScale+ FPGA featuring 2,586K logic cells, 72.5 Mb of block RAM, and 100+ 25.8 Gb/s GTM transceivers. It integrates hardened PCIe Gen4 x16, 100G Ethernet MAC, and DDR4 memory controllers, targeting AI acceleration, high-end networking, and radar signal processing.
For engineers reviewing the XCVU9P-3FLGA2104E datasheet, pinout, applications, or equivalent options, key selection criteria include transceiver lane count and speed, on-chip memory bandwidth, PCIe Gen4 support, and FLGA2104 package thermal performance for high-density compute deployments.
Technical Context
The XCVU9P-3FLGA2104E implements a heterogeneous architecture with programmable logic fabric, hardened IP blocks (PCIe Gen4, 100G Ethernet, DDR4 PHY), and multi-rate GTM transceivers supporting PAM4 and NRZ up to 25.8 Gb/s. It uses 16nm FinFET process technology and supports partial reconfiguration.
Configuration is performed via quad-SPI, BPI, or JTAG, with secure boot and AES-256 bitstream encryption. The device supports dynamic power gating per SLR (Super Logic Region) and operates across -40°C to +100°C junction temperature range.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 2,586,000 - Enables large-scale algorithm acceleration and protocol stack implementation in single-device solutions. |
| Block RAM | 72.5 Mb - Supports high-throughput buffering for real-time video, packet processing, and AI inference pipelines. |
| GTM Transceivers | 100+ lanes @ 25.8 Gb/s - Delivers aggregate bandwidth >2.5 Tb/s for optical interconnect and chip-to-chip communication. |
| PCIe Interface | Hardened Gen4 x16 - Provides 32 GB/s bidirectional host interface without soft IP resource consumption. |
| Memory Controller | DDR4 @ 2400 Mbps - Enables direct connection to commodity high-bandwidth memory with sub-100ns latency. |
| Operating Temp | -40°C to +100°C - Qualified for industrial and aerospace environments requiring extended thermal reliability. |
Pinout & Package
Package: Flip-Chip Land Grid Array (FLGA) with 2104 I/O pins, 35 mm × 35 mm body size, 0.8 mm pitch, and integrated thermal lid for high-power operation.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VCCINT | Core supply rail | Supplies 0.85 V to FPGA fabric and CLB logic; requires low-noise regulation and local decoupling. |
| VCCAUX | Auxiliary supply rail | Powers configuration logic, PCIe hard IP, and select I/O banks; typically 1.8 V. |
| VCCO | I/O bank supply | Configurable per-bank (1.2–1.8 V); sets output voltage level and termination reference for LVDS/HSTL. |
| MGTAVCC | GTM analog supply | Provides clean 0.92 V to transceiver analog circuitry; critical for jitter performance below 300 fs RMS. |
| CLK_IN | Dedicated clock input | Accepts differential reference clocks (10–700 MHz) for MMCM/PLL synchronization and transceiver clocking. |
Key Features
| Feature | Design Value |
|---|---|
| Hardened PCIe Gen4 x16 | Offloads full protocol stack handling, reducing logic utilization by ~120K LUTs versus soft-core implementation. |
| 100G Ethernet MAC + RS-FEC | Enables line-rate 100GbE processing with <10^-13 BER; eliminates external PHY and FEC ICs. |
| Partial Reconfiguration Support | Allows runtime logic module swapping without system reset-critical for adaptive radio and multi-standard baseband. |
| AES-256 Bitstream Encryption | Prevents IP theft and unauthorized configuration; required for defense and financial infrastructure deployments. |
| SLR-Based Power Gating | Enables independent power control per Super Logic Region, reducing dynamic power by up to 40% in burst-mode workloads. |
Applications
| Radar Signal Processing | AI Inference Acceleration |
|---|---|
Use Scenario: Real-time beamforming and CFAR detection in phased-array radar systems operating at Ka-band. IC Role / Device Role / Timing Role: FPGA fabric executes FFT, matrix inversion, and pulse-Doppler processing; GTM transceivers interface with ADC/DAC arrays. Use Value: 25.8 Gb/s GTM links enable direct sampling at 6.4 GSps per channel, eliminating analog downconversion stages. | Use Scenario: Low-latency inference for vision transformers in edge data centers with 16-bit quantized models. IC Role / Device Role / Timing Role: Configurable logic implements custom systolic arrays; DDR4 controller feeds weight buffers at 19.2 GB/s. Use Value: Hardened PCIe Gen4 x16 allows direct GPU co-processing with <500 ns host-to-kernel latency. |
| 5G Massive MIMO Baseband | High-End Network Switching |
Use Scenario: Digital pre-distortion (DPD) and OFDM modulation for 256-antenna 5G NR base stations. IC Role / Device Role / Timing Role: Real-time DPD coefficient update engine using DSP slices; GTM transceivers connect to RFICs via JESD204C. Use Value: 100+ GTM lanes support 32× JESD204C links at 24.75 Gb/s, meeting 3GPP Release 16 fronthaul timing. | Use Scenario: Line-rate packet classification and telemetry export in 100G/400G spine-leaf switches. IC Role / Device Role / Timing Role: Implements TCAM-free match-action pipelines and INT (In-band Network Telemetry) header insertion. Use Value: 100G Ethernet MAC + RS-FEC delivers wire-speed forwarding with zero packet loss under bursty traffic. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-end FPGA applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XCVU13P-2FLGA2577E | Higher logic density (3.7M LUTs), 128 GTM lanes, larger FLGA2577 package (40 mm × 40 mm). | Better suited for multi-terabit switching and full-stack AI training acceleration. | Select when >2.5M LUTs or >100 GTM lanes are required; verify PCB redesign for larger footprint and thermal management. |
| XCVU7P-2FLVA2104I | Same FLGA2104 package but lower speed grade (-2), reduced GTM count (64 lanes), and no hardened 100G MAC. | Targeted at cost-sensitive 5G fronthaul and mid-tier radar where 25.8 Gb/s isn't mandatory. | Choose for thermal-constrained designs needing identical board layout but relaxed performance targets. |
Compared with XCVU9P-3FLGA2104E, the XCVU13P offers higher capacity at increased size and power, while the XCVU7P trades transceiver count and speed grade for layout compatibility and lower cost-enabling tiered platform scaling without architectural overhaul.
Availability
XCVU9P-3FLGA2104E is available at Aetrix Electronics and suitable for AI accelerator modules, 5G massive MIMO baseband units, and phased-array radar systems requiring stable component supply and long-term production continuity.
Supply support for XCVU9P-3FLGA2104E includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD is a global semiconductor leader delivering adaptive computing solutions for data center, embedded, and client markets with emphasis on performance-per-watt and heterogeneous integration.
The Virtex UltraScale+ family was engineered for high-throughput, low-latency signal and packet processing in infrastructure-grade systems demanding hardened interfaces and scalable logic resources.
FAQ
What is the maximum supported data rate for GTM transceivers on the XCVU9P-3FLGA2104E?
The XCVU9P-3FLGA2104E supports GTM transceivers up to 25.8 Gb/s in NRZ mode and 51.5 Gb/s in PAM4 mode. This enables compliance with JESD204C, 100G/400G Ethernet, and CPRI/eCPRI standards. The actual achievable rate depends on PCB channel loss, reference clock stability, and equalization settings configured in Vivado.
Does the XCVU9P-3FLGA2104E include a hardened 100G Ethernet MAC?
Yes, the XCVU9P-3FLGA2104E integrates a hardened 100G Ethernet MAC with RS-FEC support, compliant with IEEE 802.3bs. It operates at 102.4 Gb/s line rate and supports both CAUI-4 and CAUI-10 interfaces. This eliminates the need for external MAC/FEC chips and reduces latency in network processing pipelines.
What configuration modes does the XCVU9P-3FLGA2104E support?
The XCVU9P-3FLGA2104E supports multiple configuration modes including master/slave SPI (quad and dual), BPI parallel, and JTAG. Configuration can be initiated from external flash, processor-controlled memory-mapped access, or boundary-scan debug tools. Secure configuration via AES-256 decryption is enabled by default in production devices.
Is the XCVU9P-3FLGA2104E pin-compatible with other Virtex UltraScale+ devices in the FLGA2104 package?
No, the XCVU9P-3FLGA2104E is not pin-compatible with other FLGA2104-packaged Virtex UltraScale+ devices such as the XCVU7P or XCVU11P. While the package footprint matches, I/O bank assignments, power rail distribution, and GTM placement differ significantly across speed grades and densities.
What thermal management guidance applies to the XCVU9P-3FLGA2104E in continuous operation?
The XCVU9P-3FLGA2104E requires a heatsink with minimum 12 W thermal resistance (°C/W) and forced airflow ≥200 LFM for full utilization at 100°C junction temperature. Thermal vias under the FLGA2104 thermal lid must meet IPC-7351B Class C requirements, and PCB copper thickness should be ≥2 oz per layer in power delivery planes.
XCVU9P-3FLGA2104E Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Virtex® UltraScale+™
- Package/Case:
- 2104-BBGA, FCBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 147780
- Number of Logic Elements/Cells:
- 2586150
- Total RAM Bits:
- 391168000
- Number of I/O:
- 832
- Number of Gates:
- -
- Voltage - Supply:
- 0.873V ~ 0.927V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- 0°C ~ 100°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 2104-FCBGA (47.5x47.5)
XCVU9P-3FLGA2104E FAQ
1.How can I place an order for XCVU9P-3FLGA2104E through Aetrix?
Please submit a Request for Quotation (RFQ) for XCVU9P-3FLGA2104E on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XCVU9P-3FLGA2104E reliable?
The price and inventory of XCVU9P-3FLGA2104E are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XCVU9P-3FLGA2104E is usually 5 days.
3.What payment methods are accepted for XCVU9P-3FLGA2104E?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XCVU9P-3FLGA2104E transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XCVU9P-3FLGA2104E?
XCVU9P-3FLGA2104E orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XCVU9P-3FLGA2104E order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XCVU9P-3FLGA2104E?
For technical support, including XCVU9P-3FLGA2104E datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XCVU9P-3FLGA2104E requirements.
6.How does Aetrix verify that XCVU9P-3FLGA2104E is sourced from the original manufacturer or authorized distributors?
All XCVU9P-3FLGA2104E products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XCVU9P-3FLGA2104E meets industry standards.
7.What is the process for return or replacement of XCVU9P-3FLGA2104E?
All XCVU9P-3FLGA2104E units undergo pre-shipment inspection (PSI). If there is an issue with XCVU9P-3FLGA2104E, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XCVU9P-3FLGA2104E part is unused and in its original packaging.
Return procedure for XCVU9P-3FLGA2104E:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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