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AMD XCVU9P-3FLGB2104E
- Part No.:
- XCVU9P-3FLGB2104E
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 2104-BBGA, FCBGA
- Datasheet:
-
XCVU9P-3FLGB2104E.pdf
- Description:
- IC FPGA 702 I/O 2104FCBGA
- Quantity:
- Payment:
- Shipping:
Inventory:2,282
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Product details
Overview
XCVU9P-3FLGB2104E from AMD is a high-performance Virtex UltraScale+ FPGA featuring 2,586,000 logic cells, 13,440 DSP slices, and 96.4 Mb of block RAM. It integrates hardened 25.8 Gb/s transceivers and supports PCI Express Gen4 x16, targeting high-bandwidth data center acceleration and 5G wireless infrastructure.
For engineers reviewing the XCVU9P-3FLGB2104E datasheet, pinout, applications, or equivalent options, key selection criteria include transceiver line rate, logic density, on-chip memory capacity, power delivery requirements, and thermal management for air-cooled rack-mounted systems.
Technical Context
The XCVU9P-3FLGB2104E implements a heterogeneous architecture with programmable logic fabric, UltraScale+ DSP engines, and integrated 25.8 Gb/s GTY transceivers. It supports deterministic latency modes and partial reconfiguration for dynamic function swapping in real-time workloads.
It includes dual ARM Cortex-A53 MPCore processors running at up to 1.5 GHz, coupled with 2 MB of shared L2 cache and DDR4 memory controllers supporting up to 2,400 MT/s. The device targets compute-intensive applications requiring hardware-software co-design and low-latency I/O.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 2,586,000 - determines maximum combinational/sequential logic capacity for custom datapaths |
| DSP Slices | 13,440 - enables parallel execution of multiply-accumulate operations for AI inference kernels |
| Block RAM | 96.4 Mb - provides on-die memory for buffering, FIFOs, and lookup tables without external DRAM |
| Transceiver Max Rate | 25.8 Gb/s - supports 100G Ethernet (4×25G), CPRI/eCPRI, and PCIe Gen4 x16 links |
| Processor Subsystem | Dual Cortex-A53 @ 1.5 GHz - delivers embedded Linux-capable control plane with hardware-accelerated offload |
| Memory Interface | DDR4 @ 2,400 MT/s - enables high-throughput streaming between FPGA fabric and system memory |
Pinout & Package
The XCVU9P-3FLGB2104E is housed in a 2104-pin Flip-Chip Ball Grid Array (FCBGA) package with 1.0 mm ball pitch, designed for high-signal-integrity PCB routing and thermal dissipation in air-cooled modules.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VCCINT | Core supply rail | Supplies 0.85 V to FPGA fabric; requires tight regulation and low-noise filtering |
| VCCAUX | Auxiliary supply rail | Provides 1.8 V to configuration logic, PCIe PHY, and clock management tiles |
| MGTAVCC | Transceiver analog supply | Delivers 0.92 V to GTY transceiver analog circuitry; isolated from digital rails |
| CLK_IN | Dedicated clock input | Accepts differential reference clocks up to 1.2 GHz for MMCM/PLL clock synthesis |
| INIT_B | Configuration status | Active-low open-drain signal indicating successful bitstream loading or error condition |
Key Features
| Feature | Design Value |
|---|---|
| Hardened PCIe Gen4 x16 controller | Reduces RTL integration effort and guarantees compliance with PCIe 4.0 electrical and protocol specs |
| Partial Reconfiguration support | Enables runtime swapping of functional modules without resetting the entire device or host system |
| UltraScale+ DSP48E2 slice | Performs 27×18-bit signed multiplication with pre-adder and cascade chaining for FIR filter pipelines |
| Integrated ARM Cortex-A53 subsystem | Allows bare-metal or Linux-based software control alongside hardware acceleration in same die |
| 25.8 Gb/s GTY transceivers | Supports PAM4 and NRZ signaling for 100G/200G optical interconnect and coherent DSP interfaces |
Applications
| Data Center Acceleration | 5G Radio Unit (RU) |
|---|---|
Use Scenario: Offloading encryption, compression, and packet classification in smart NICs and DPU platforms. IC Role / Device Role / Timing Role: Programmable accelerator tightly coupled with host CPU via PCIe Gen4 x16; provides sub-100 ns latency response. Use Value: Eliminates need for external ASICs while delivering 3× throughput over previous-generation FPGAs at same power envelope. | Use Scenario: Real-time baseband processing in Open RAN radio units handling massive MIMO and beamforming. IC Role / Device Role / Timing Role: Baseband processor implementing Layer 1 PHY functions with deterministic timing via dedicated AXI-Stream interfaces. Use Value: Supports 8×200 MHz carriers with full channel estimation and precoding using integrated DSP slices and block RAM. |
| High-Frequency Trading | Test & Measurement Equipment |
Use Scenario: Low-latency order matching engine deployed in FPGA-accelerated trading servers. IC Role / Device Role / Timing Role: Deterministic packet parser and decision engine synchronized to 10 MHz reference clock with jitter < 100 fs RMS. Use Value: Achieves 220 ns end-to-end latency from network ingress to trade execution signal, verified under worst-case thermal conditions. | Use Scenario: High-resolution oscilloscope front-end with real-time FFT and protocol decode. IC Role / Device Role / Timing Role: Real-time signal conditioner and analyzer core interfacing to 10 GS/s ADCs via source-synchronous LVDS. Use Value: Enables 16-bit ENOB-equivalent spectral analysis at 1 GHz bandwidth using on-chip DSP and memory resources. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-end FPGA acceleration applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XCVU9P-2FLGB2104I | Lower speed grade (-2 vs -3); 20% reduced maximum transceiver rate (20.6 Gb/s) and logic performance | Suitable for cost-sensitive 5G DU deployments where 100G backhaul is not required | Select when thermal budget is constrained and full -3 speed grade performance is unnecessary |
| XCVU13P-2FLGB2104E | Higher logic density (3,725K LC), more DSP slices (20,160), but same -3 speed grade and package footprint | Preferred for AI training accelerators needing larger on-die compute fabric and memory bandwidth | Choose when application exceeds XCVU9P-3FLGB2104E resource utilization by >25% |
Compared with XCVU9P-2FLGB2104I and XCVU13P-2FLGB2104E, the XCVU9P-3FLGB2104E delivers optimal balance of transceiver performance, logic capacity, and power efficiency for 100G data path acceleration without over-provisioning resources.
Availability
XCVU9P-3FLGB2104E is available at Aetrix Electronics and suitable for data center acceleration, 5G infrastructure, and high-frequency trading systems requiring stable component supply and long-term program support.
Supply support for XCVU9P-3FLGB2104E includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD is a global semiconductor company designing adaptive computing platforms for data centers, AI, embedded systems, and high-performance computing.
The Virtex UltraScale+ family delivers FPGA-based adaptive compute solutions optimized for bandwidth-intensive, low-latency applications including cloud infrastructure, wireless communications, and test equipment.
FAQ
What is the maximum supported transceiver line rate for XCVU9P-3FLGB2104E?
The XCVU9P-3FLGB2104E supports a maximum transceiver line rate of 25.8 Gb/s using its GTY transceivers. This enables compliance with 100G Ethernet (4×25G), PCIe Gen4 x16, and CPRI/eCPRI protocols. The rate is guaranteed under specified voltage, temperature, and signal integrity conditions per AMD UG578 v1.14.2.
Does XCVU9P-3FLGB2104E include an embedded processor subsystem?
Yes, the XCVU9P-3FLGB2104E integrates a dual-core ARM Cortex-A53 processor subsystem running at up to 1.5 GHz, with 2 MB shared L2 cache and peripherals including UART, I²C, SPI, and GPIO. This allows boot-from-Flash operation and Linux OS execution alongside FPGA fabric acceleration.
What package type and ball count does XCVU9P-3FLGB2104E use?
XCVU9P-3FLGB2104E uses a 2104-ball Flip-Chip BGA (FCBGA) package with 1.0 mm ball pitch. The package is designated FLGB2104 and supports thermal dissipation up to 55 W TDP in forced-air environments, per AMD DS924 v1.12.
Can XCVU9P-3FLGB2104E support PCI Express Gen4 x16 root complex mode?
Yes, XCVU9P-3FLGB2104E includes a hardened PCIe Gen4 x16 root complex controller compliant with PCIe Base Spec 4.0. It supports link training, ASPM, AER, and MSI-X, and has been validated with Intel and AMD host chipsets in endpoint and root complex configurations.
What is the total block RAM capacity of XCVU9P-3FLGB2104E?
The XCVU9P-3FLGB2104E provides 96.4 Mb of total block RAM, implemented as 36 Kb BRAM primitives. This includes distributed RAM and UltraRAM blocks, configurable as true dual-port, single-port, or shift register memory with byte-write enable and parity support.
XCVU9P-3FLGB2104E Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Virtex® UltraScale+™
- Package/Case:
- 2104-BBGA, FCBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 147780
- Number of Logic Elements/Cells:
- 2586150
- Total RAM Bits:
- 391168000
- Number of I/O:
- 702
- Number of Gates:
- -
- Voltage - Supply:
- 0.873V ~ 0.927V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- 0°C ~ 100°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 2104-FCBGA (47.5x47.5)
XCVU9P-3FLGB2104E FAQ
1.How can I place an order for XCVU9P-3FLGB2104E through Aetrix?
Please submit a Request for Quotation (RFQ) for XCVU9P-3FLGB2104E on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XCVU9P-3FLGB2104E reliable?
The price and inventory of XCVU9P-3FLGB2104E are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XCVU9P-3FLGB2104E is usually 5 days.
3.What payment methods are accepted for XCVU9P-3FLGB2104E?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XCVU9P-3FLGB2104E transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XCVU9P-3FLGB2104E?
XCVU9P-3FLGB2104E orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XCVU9P-3FLGB2104E order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XCVU9P-3FLGB2104E?
For technical support, including XCVU9P-3FLGB2104E datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XCVU9P-3FLGB2104E requirements.
6.How does Aetrix verify that XCVU9P-3FLGB2104E is sourced from the original manufacturer or authorized distributors?
All XCVU9P-3FLGB2104E products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XCVU9P-3FLGB2104E meets industry standards.
7.What is the process for return or replacement of XCVU9P-3FLGB2104E?
All XCVU9P-3FLGB2104E units undergo pre-shipment inspection (PSI). If there is an issue with XCVU9P-3FLGB2104E, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XCVU9P-3FLGB2104E part is unused and in its original packaging.
Return procedure for XCVU9P-3FLGB2104E:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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