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AMD XCVU9P-3FSGD2104E
- Part No.:
- XCVU9P-3FSGD2104E
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 2104-BBGA, FCBGA
- Datasheet:
-
XCVU9P-3FSGD2104E.pdf
- Description:
- IC FPGA 676 I/O 2104FCBGA
- Quantity:
- Payment:
- Shipping:
Inventory:3,902
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Product details
Overview
XCVU9P-3FSGD2104E from AMD is a high-performance Virtex UltraScale+ FPGA featuring 2,586,000 logic cells, 13,440 DSP slices, and 104.5 Mb of block RAM. It integrates hardened 25.8 Gb/s GTY transceivers and supports PCIe Gen4 x16, making it suitable for advanced radar signal processing in phased-array systems.
For engineers reviewing the XCVU9P-3FSGD2104E datasheet, pinout, applications, or equivalent options, key selection factors include transceiver lane count and speed grade, I/O bank voltage flexibility, and integrated memory controller support for DDR4-2400.
Technical Context
The XCVU9P-3FSGD2104E implements a heterogeneous architecture with programmable logic, hardened IP blocks (PCIe Gen4, 100G Ethernet MAC, DMA), and multi-rate transceivers. It supports dynamic function exchange and partial reconfiguration for runtime adaptation.
Its I/O subsystem includes 832 user-configurable single-ended or differential pins across 24 I/O banks, with support for LVDS, SSTL, HSTL, and MIPI signaling standards. The device uses a 16nm FinFET process and operates at junction temperatures up to 100°C.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 2,586,000 - determines maximum combinational/sequential logic capacity for complex algorithm implementation |
| DSP Slices | 13,440 - enables parallel high-throughput arithmetic for FFT, filtering, and beamforming |
| Block RAM | 104.5 Mb - provides on-chip data buffering for real-time streaming applications |
| GTY Transceivers | 64 lanes @ 25.8 Gb/s - supports multi-channel serial interfaces including CPRI, JESD204B/C |
| I/O Pins | 832 user I/O - allows dense interconnect to ADCs, DACs, memory, and high-speed serdes peripherals |
| Speed Grade | -3 - highest timing performance bin for critical path closure in demanding designs |
| Package | FSGD2104 - 2104-pin flip-chip BGA, 35 × 35 mm, 0.8 mm pitch, thermal lid |
Pinout & Package
FSGD2104 is a 2104-pin flip-chip ball grid array package with integrated heat spreader, designed for high-power FPGA operation and thermal reliability in conduction-cooled systems.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VCCINT | Core power supply | Supplies 0.85 V to programmable logic and CLBs; requires low-noise regulation |
| VCCAUX | Auxiliary power supply | Provides 1.8 V to configuration logic, clocking, and transceiver analog circuitry |
| VCCO_0 | I/O bank power | Configurable per-bank voltage (1.2–1.8 V) enabling mixed-voltage interface interoperability |
| MR | Master reset | Asynchronous global reset input controlling configuration state and logic initialization |
| CLK_IN | Primary clock input | Dedicated differential input for system clock feeding MMCM/PLL clock management |
| GTYP | Transceiver P-tile | High-speed serial transmit output for GTY transceiver lanes (25.8 Gb/s) |
Key Features
| Feature | Design Value |
|---|---|
| Hardened PCIe Gen4 x16 | Reduces RTL integration effort and ensures compliance without external PHY or protocol stack licensing |
| UltraScale+ Memory Controller | Supports DDR4-2400 with ECC, enabling reliable high-bandwidth memory subsystems for data-intensive workloads |
| Dynamic Function eXchange (DFX) | Allows partial reconfiguration of logic regions while maintaining system operation for adaptive computing |
| Multi-rate GTY Transceivers | Single transceiver tile supports protocols from 1.25 to 25.8 Gb/s, simplifying interface consolidation |
| Integrated 100G Ethernet MAC | Offloads MAC-layer processing from CPU/FPGA fabric, reducing latency and resource usage |
Applications
| Radar Signal Processing | 5G Massive MIMO Baseband |
|---|---|
Use Scenario: Real-time beamforming and pulse-Doppler processing in ground-based radar systems. IC Role / Device Role / Timing Role: FPGA fabric executes time-critical DSP kernels; GTY transceivers interface with high-speed ADC/DACs and RFICs. Use Value: 25.8 Gb/s transceivers enable direct JESD204C links to 12-bit, 4-GSPS converters, minimizing latency and board area. | Use Scenario: Digital pre-distortion (DPD) and channel estimation in 5G NR macro base stations. IC Role / Device Role / Timing Role: Configurable logic implements adaptive DPD algorithms; PCIe Gen4 x16 connects to host processor for control plane offload. Use Value: 13,440 DSP slices deliver >1.2 TeraMAC/s throughput for real-time wideband DPD computation. |
| High-Performance Computing Acceleration | Test & Measurement Instrumentation |
Use Scenario: FPGA-accelerated financial risk modeling and Monte Carlo simulation in co-processing servers. IC Role / Device Role / Timing Role: Logic fabric runs custom compute kernels; DDR4-2400 memory controller manages large dataset buffers. Use Value: 104.5 Mb block RAM + DDR4 bandwidth >120 GB/s enables in-fabric data staging, avoiding PCIe bottlenecks. | Use Scenario: High-resolution oscilloscope front-end with 10 GS/s sampling and real-time FFT analysis. IC Role / Device Role / Timing Role: FPGA processes digitized waveforms; GTY lanes stream samples to external storage or display engine. Use Value: 832 I/O pins allow simultaneous connection to multiple ADC channels, trigger logic, and high-speed memory interfaces. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-end FPGA applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XCVU9P-2FSGD2104I | Lower speed grade (-2), reduced timing margin; same logic density and I/O count | Suitable for cost-sensitive designs where worst-case timing closure is less critical | Select when target frequency requirements are ≤75% of XCVU9P-3FSGD2104E's maximum achievable frequency |
| XCVU13P-3FSGD2104E | Higher logic density (3,725K LC), additional GTY lanes (80 vs. 64), larger die area | Required for designs exceeding 2.5M LC capacity or needing >64 high-speed serial lanes | Choose when scaling beyond XCVU9P-3FSGD2104E's resources while retaining identical package and thermal footprint |
Compared with XCVU9P-2FSGD2104I and XCVU13P-3FSGD2104E, the XCVU9P-3FSGD2104E delivers optimal balance of performance, density, and thermal efficiency for mid-to-high-tier 5G and radar platforms-avoiding overdesign while ensuring timing closure at full speed grade.
Availability
XCVU9P-3FSGD2104E is available at Aetrix Electronics and suitable for radar signal processing, 5G baseband development, and high-performance computing acceleration requiring stable component supply and long-term industrial availability.
Supply support for XCVU9P-3FSGD2104E includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD is a global semiconductor company focused on high-performance and adaptive computing solutions for data centers, AI, networking, and embedded systems.
The Virtex UltraScale+ family targets mission-critical infrastructure applications demanding deterministic latency, high bandwidth, and field-upgradable logic-especially in defense radar, 5G infrastructure, and scientific instrumentation.
FAQ
What is the maximum supported DDR4 data rate for XCVU9P-3FSGD2104E?
The XCVU9P-3FSGD2104E supports DDR4-2400 (1200 MHz clock) with full ECC capability via its integrated memory controller. This enables sustained bandwidth exceeding 120 GB/s with dual 72-bit interfaces, verified across temperature and voltage corners in AMD's production characterization.
Does XCVU9P-3FSGD2104E include hardened PCIe Gen4 support?
Yes, the XCVU9P-3FSGD2104E integrates a hardened PCIe Gen4 x16 endpoint block compliant with PCI-SIG specifications. It requires no external PHY and supports both root port and endpoint configurations with AXI4-Stream and AXI4-Lite interfaces.
What is the operating temperature range for XCVU9P-3FSGD2104E?
The XCVU9P-3FSGD2104E is rated for industrial temperature operation from –40°C to +100°C junction temperature. Its FSGD2104 package includes a copper heat spreader and is qualified for conduction-cooled environments per AMD specification DS929.
How many GTY transceiver quads does XCVU9P-3FSGD2104E contain?
The XCVU9P-3FSGD2104E contains 16 GTY transceiver quads, delivering 64 total transceiver lanes. Each quad supports independent multi-rate operation from 1.25 to 25.8 Gb/s, with dedicated TX/RX calibration and clocking resources.
Is partial reconfiguration supported on XCVU9P-3FSGD2104E?
Yes, the XCVU9P-3FSGD2104E fully supports Dynamic Function eXchange (DFX) for partial reconfiguration. This capability is silicon-verified and enabled through Vivado Design Suite v2022.2+, allowing runtime logic updates without system reset.
XCVU9P-3FSGD2104E Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Virtex® UltraScale+™
- Package/Case:
- 2104-BBGA, FCBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 147780
- Number of Logic Elements/Cells:
- 2586150
- Total RAM Bits:
- 391168000
- Number of I/O:
- 676
- Number of Gates:
- -
- Voltage - Supply:
- 0.873V ~ 0.927V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- 0°C ~ 100°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 2104-FCBGA (47.5x47.5)
XCVU9P-3FSGD2104E FAQ
1.How can I place an order for XCVU9P-3FSGD2104E through Aetrix?
Please submit a Request for Quotation (RFQ) for XCVU9P-3FSGD2104E on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XCVU9P-3FSGD2104E reliable?
The price and inventory of XCVU9P-3FSGD2104E are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XCVU9P-3FSGD2104E is usually 5 days.
3.What payment methods are accepted for XCVU9P-3FSGD2104E?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XCVU9P-3FSGD2104E transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XCVU9P-3FSGD2104E?
XCVU9P-3FSGD2104E orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XCVU9P-3FSGD2104E order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XCVU9P-3FSGD2104E?
For technical support, including XCVU9P-3FSGD2104E datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XCVU9P-3FSGD2104E requirements.
6.How does Aetrix verify that XCVU9P-3FSGD2104E is sourced from the original manufacturer or authorized distributors?
All XCVU9P-3FSGD2104E products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XCVU9P-3FSGD2104E meets industry standards.
7.What is the process for return or replacement of XCVU9P-3FSGD2104E?
All XCVU9P-3FSGD2104E units undergo pre-shipment inspection (PSI). If there is an issue with XCVU9P-3FSGD2104E, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XCVU9P-3FSGD2104E part is unused and in its original packaging.
Return procedure for XCVU9P-3FSGD2104E:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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