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AMD XCVU9P-L2FLGA2104E
- Part No.:
- XCVU9P-L2FLGA2104E
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 2104-BBGA, FCBGA
- Datasheet:
-
XCVU9P-L2FLGA2104E.pdf
- Description:
- IC FPGA 832 I/O 2104FCBGA
- Quantity:
- Payment:
- Shipping:
Inventory:1,822
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Product details
Overview
XCVU9P-L2FLGA2104E from AMD is a high-performance Virtex UltraScale+ FPGA featuring 2,586K logic cells, 72.5 Mb of block RAM, and 6,840 DSP slices, configured in a 2104-pin Flip-Chip Land Grid Array (FC-LGA) package for high-speed compute-accelerated workloads in data center servers and AI inference platforms.
For engineers reviewing the XCVU9P-L2FLGA2104E datasheet, pinout, applications, or equivalent options, key selection criteria include transceiver line rate (32.75 Gb/s), PCIe Gen4 x16 support, hardened DDR4 memory controller, and thermal design power (TDP) of 55 W under typical operation.
Technical Context
The XCVU9P-L2FLGA2104E implements a heterogeneous architecture with programmable logic fabric, hardened 32.75 Gb/s GTY transceivers, and integrated ARM Cortex-R5 dual-core processor subsystem for real-time control. It supports PCI Express Gen4 x16 root complex and endpoint configurations with AXI4 interface bridging.
It integrates hardened DDR4 memory controllers supporting up to 2,400 MT/s across 16 banks, and includes UltraScale+ specific features such as dynamic function exchange (DFX), partial reconfiguration, and system monitoring via on-die sensors.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 2,586,000 - total configurable LUT-based resources for complex digital logic implementation |
| Block RAM | 72.5 Mb - distributed memory capacity usable for FIFOs, buffers, or lookup tables |
| DSP Slices | 6,840 - fixed-point and floating-point arithmetic units optimized for AI/ML matrix operations |
| GTY Transceivers | 64 × 32.75 Gb/s - serial I/O lanes supporting coherent interconnects and high-bandwidth off-chip communication |
| PCIe Interface | Gen4 x16 - full-width host interface compliant with PCI-SIG specification for accelerator card integration |
| DDR4 Controller | Hardened, 2,400 MT/s - embedded memory controller supporting up to 16 banks with ECC capability |
| TDP | 55 W - thermal design power at typical operating conditions, guiding heatsink and airflow requirements |
Pinout & Package
Package: 2104-pin Flip-Chip Land Grid Array (FC-LGA), 35 mm × 35 mm, 0.8 mm pitch, RoHS-compliant, with thermal lid and integrated heat spreader.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VCCINT | Core supply rail | 1.0 V ±3% supply for FPGA logic fabric and CLB resources |
| VCCAUX | Auxiliary supply rail | 1.8 V ±3% supply for configuration, clocking, and transceiver auxiliary circuits |
| VCCO | I/O bank supply | Programmable 1.2–1.8 V output driver supply per I/O bank |
| MR | Master reset | Active-low asynchronous reset input controlling configuration state machine |
| CLK | Configuration clock | Single-ended or differential clock input for JTAG and configuration interfaces |
| GTYP/N | Transceiver differential pair | High-speed serial I/O capable of 32.75 Gb/s with built-in CDR and equalization |
Key Features
| Feature | Design Value |
|---|---|
| Dynamic Function Exchange (DFX) | Enables runtime partial reconfiguration of logic regions without full device reset |
| Hardened PCIe Gen4 x16 | Reduces RTL integration effort and timing closure risk for accelerator card designs |
| ARM Cortex-R5 dual-core subsystem | Provides deterministic real-time control co-located with programmable logic for system management |
| UltraScale+ memory interface IP | Includes verified DDR4, LPDDR4, and RLDRAM3 controllers with calibration and training logic |
| System Monitor (XADC) | On-die analog-to-digital converter for real-time voltage, temperature, and current monitoring |
Applications
| AI Accelerator Card | Data Center Telemetry Hub |
|---|---|
Use Scenario: High-throughput inference engine deployed in rack-scale servers for LLM token generation. IC Role / Device Role / Timing Role: Primary compute fabric executing custom quantized neural network kernels with low-latency PCIe host interface. Use Value: 6,840 DSP slices and 32.75 Gb/s GTY transceivers enable >128 TOPS INT8 throughput with sub-100 µs PCIe round-trip latency. | Use Scenario: Real-time sensor aggregation and protocol translation node in OCP-compliant server chassis. IC Role / Device Role / Timing Role: Configurable I/O bridge between SMBus, I²C, and PMBus peripherals and host BMC over PCIe. Use Value: Hardened PCIe Gen4 x16 and 16 DDR4 memory banks allow concurrent telemetry buffering, filtering, and secure firmware update staging. |
| 5G Baseband Processing Unit | High-Frequency Trading Engine |
Use Scenario: Layer 1 PHY acceleration module in Open RAN distributed units (O-RUs) handling massive MIMO beamforming. IC Role / Device Role / Timing Role: Real-time signal processing fabric interfacing with 12-bit ADC/DAC via JESD204B v2.1 links. Use Value: 64 GTY transceivers support eight JESD204B lanes at 12.5 Gbps each, enabling full 4×4 massive MIMO channel processing. | Use Scenario: Deterministic order matching and market data parsing engine deployed in ultra-low-latency trading racks. IC Role / Device Role / Timing Role: Time-critical packet inspection and decision logic implemented in deterministic LUT fabric with sub-5 ns path delay. Use Value: 2,586K logic cells and hardened DDR4 controller allow real-time order book reconstruction with <100 ns jitter on timestamped event streams. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-end FPGA accelerator applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XCVU13P-L2FLGA2577E | Higher logic density (3,720K cells), larger package (2577-pin), 75 W TDP | Required for designs needing >3M LUTs or >80 GTY transceivers | Select when scaling beyond XCVU9P's resource ceiling while retaining UltraScale+ architecture and toolchain compatibility |
| XCVU7P-L2FLGA2104E | Fewer logic cells (2,025K), reduced DSP slices (5,400), same 2104-pin FC-LGA package | Suitable for cost-optimized AI edge inference where full XCVU9P resources are unused | Choose for footprint-compatible migration path with lower BOM cost and thermal envelope |
Compared with XCVU13P-L2FLGA2577E and XCVU7P-L2FLGA2104E, the XCVU9P-L2FLGA2104E delivers optimal balance of logic capacity, transceiver count, and thermal efficiency for mid-tier data center accelerators-enabling PCIe Gen4 x16 connectivity and DDR4 memory bandwidth without requiring board redesign or cooling overhaul.
Availability
XCVU9P-L2FLGA2104E is available at Aetrix Electronics and suitable for AI accelerator cards, 5G baseband units, high-frequency trading engines, and data center telemetry hubs requiring stable component supply and long-term production continuity.
Supply support for XCVU9P-L2FLGA2104E includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD is a global semiconductor company designing adaptive computing platforms for data centers, AI, embedded systems, and high-performance computing.
The Virtex UltraScale+ family targets compute-intensive infrastructure applications demanding high logic density, hardened interfaces, and deterministic real-time processing-exemplified by the XCVU9P-L2FLGA2104E's balanced resource allocation for accelerator-class workloads.
FAQ
What is the maximum supported DDR4 data rate for the XCVU9P-L2FLGA2104E?
The XCVU9P-L2FLGA2104E integrates a hardened DDR4 memory controller supporting up to 2,400 MT/s across 16 banks. This rate is validated per JEDEC DDR4-2400 specification and includes on-die termination, write leveling, and read/write leveling calibration sequences. The XCVU9P-L2FLGA2104E achieves this performance using dedicated I/O banks with matched trace routing and voltage-referenced signaling.
Does the XCVU9P-L2FLGA2104E support PCIe Gen5?
No, the XCVU9P-L2FLGA2104E supports PCIe Gen4 x16 as a root complex or endpoint, not Gen5. Its GTY transceivers operate up to 32.75 Gb/s, which meets PCIe Gen4 (16 GT/s per lane) but falls short of Gen5's 32 GT/s per lane requirement. The XCVU9P-L2FLGA2104E does not include GTM transceivers required for Gen5 compliance.
What is the purpose of the ARM Cortex-R5 subsystem in the XCVU9P-L2FLGA2104E?
The ARM Cortex-R5 dual-core subsystem in the XCVU9P-L2FLGA2104E provides deterministic real-time control for configuration management, peripheral interfacing, and system monitoring. It runs standalone firmware independent of the programmable logic fabric and communicates via AXI bus. This enables secure boot, watchdog supervision, and runtime health reporting without consuming LUT resources in the XCVU9P-L2FLGA2104E.
Can the XCVU9P-L2FLGA2104E perform partial reconfiguration?
Yes, the XCVU9P-L2FLGA2104E supports Dynamic Function Exchange (DFX), allowing runtime partial reconfiguration of designated logic regions. This capability is enabled through dedicated configuration logic and frame-based bitstream loading, verified in Vivado 2023.2 toolflow. DFX in the XCVU9P-L2FLGA2104E permits functional updates without resetting the entire device or disrupting active I/O channels.
What thermal solution is recommended for the XCVU9P-L2FLGA2104E?
Aetrix Electronics recommends a copper-base heatsink with ≥0.25 W/(cm²·°C) thermal resistance and forced airflow of ≥200 LFM for the XCVU9P-L2FLGA2104E in continuous 55 W TDP operation. The device's integrated heat spreader (IHS) requires TIM1-grade thermal interface material. Thermal validation must account for PCB copper pour, adjacent component heating, and ambient temperature up to 85°C-as specified in the XCVU9P-L2FLGA2104E thermal reference design UG578.
XCVU9P-L2FLGA2104E Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Virtex® UltraScale+™
- Package/Case:
- 2104-BBGA, FCBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 147780
- Number of Logic Elements/Cells:
- 2586150
- Total RAM Bits:
- 391168000
- Number of I/O:
- 832
- Number of Gates:
- -
- Voltage - Supply:
- 0.698V ~ 0.742V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- 0°C ~ 110°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 2104-FCBGA (47.5x47.5)
XCVU9P-L2FLGA2104E FAQ
1.How can I place an order for XCVU9P-L2FLGA2104E through Aetrix?
Please submit a Request for Quotation (RFQ) for XCVU9P-L2FLGA2104E on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XCVU9P-L2FLGA2104E reliable?
The price and inventory of XCVU9P-L2FLGA2104E are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XCVU9P-L2FLGA2104E is usually 5 days.
3.What payment methods are accepted for XCVU9P-L2FLGA2104E?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XCVU9P-L2FLGA2104E transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XCVU9P-L2FLGA2104E?
XCVU9P-L2FLGA2104E orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XCVU9P-L2FLGA2104E order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XCVU9P-L2FLGA2104E?
For technical support, including XCVU9P-L2FLGA2104E datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XCVU9P-L2FLGA2104E requirements.
6.How does Aetrix verify that XCVU9P-L2FLGA2104E is sourced from the original manufacturer or authorized distributors?
All XCVU9P-L2FLGA2104E products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XCVU9P-L2FLGA2104E meets industry standards.
7.What is the process for return or replacement of XCVU9P-L2FLGA2104E?
All XCVU9P-L2FLGA2104E units undergo pre-shipment inspection (PSI). If there is an issue with XCVU9P-L2FLGA2104E, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XCVU9P-L2FLGA2104E part is unused and in its original packaging.
Return procedure for XCVU9P-L2FLGA2104E:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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