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AMD XCVU9P-L2FLGB2104E
- Part No.:
- XCVU9P-L2FLGB2104E
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 2104-BBGA, FCBGA
- Datasheet:
-
XCVU9P-L2FLGB2104E.pdf
- Description:
- IC FPGA 702 I/O 2104FCBGA
- Quantity:
- Payment:
- Shipping:
Inventory:4,315
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Product details
Overview
XCVU9P-L2FLGB2104E from AMD is a high-performance Virtex UltraScale+ FPGA featuring 2,586,000 logic cells, 13,440 DSP slices, and 104.5 Mb of block RAM. It integrates hardened 25.78 Gb/s GTY transceivers and supports PCIe Gen4 x16, making it suitable for AI acceleration, 5G baseband processing, and high-throughput data center offload.
For engineers reviewing the XCVU9P-L2FLGB2104E datasheet, pinout, applications, or equivalent options, key selection factors include transceiver lane count (40 GTY), I/O bank voltage support (0.35–1.8 V), thermal design power (125 W typical), and package footprint (2104-pin Flip-Chip BGA).
Technical Context
The XCVU9P-L2FLGB2104E implements a heterogeneous architecture with programmable logic fabric, hardened IP blocks (PCIe Gen4, 100G Ethernet MAC, DDR4 controller), and ultra-low-latency memory interfaces. It supports dual-register LUTs, carry chains, and distributed RAM for high-speed arithmetic and control logic.
Its GTY transceivers deliver deterministic latency and support PAM4 signaling at 51.56 Gb/s in gearbox mode. The device includes 16 banks of SelectIO with configurable I/O standards including LVDS, SSTL-12/15/18, and HSTL.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 2,586,000 - Enables large-scale RTL implementations such as multi-core SoC subsystems or real-time video encoding pipelines. |
| DSP Slices | 13,440 - Supports concurrent execution of >10,000 MAC operations per clock cycle for AI inference kernels. |
| Block RAM | 104.5 Mb - Provides on-die buffering for 4K60 video frame stores or packet buffer arrays in networking ASIC replacements. |
| GTY Transceivers | 40 lanes @ 25.78 Gb/s - Delivers 1.03 TB/s aggregate serial bandwidth for coherency interconnects or optical transport interfaces. |
| I/O Pins | 1,192 user-configurable - Supports mixed-voltage interface stacks (e.g., DDR4 + QSFP28 + PCIe) without level-shifting components. |
| TDP | 125 W typical - Requires active cooling and 6-layer PCB with ≥4 internal power planes for stable operation at full utilization. |
Pinout & Package
Package: 2104-pin Flip-Chip BGA (FLGB2104), 35 mm × 35 mm, 0.8 mm pitch, RoHS-compliant, thermal lid integrated.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VCCINT | Core supply rail | Supplies 0.85 V to FPGA fabric; requires low-noise regulation and local ceramic decoupling per bank. |
| VCCAUX | Auxiliary supply rail | Powers configuration logic, PCIe hard IP, and transceiver reference clocks; 1.8 V nominal. |
| VCCO_0 | I/O bank supply | Configurable 0.35–1.8 V output driver voltage; sets signal swing and termination for connected peripherals. |
| MGTAVCC | GTY analog supply | 1.0 V analog rail for GTY transceiver PLLs and serializers; sensitive to ripple & noise. |
| CLK_IN | Dedicated clock input | Accepts differential LVDS/2500 mV peak-to-peak single-ended; feeds MMCM/PLL for system-wide clock domain synthesis. |
Key Features
| Feature | Design Value |
|---|---|
| Hardened PCIe Gen4 x16 Controller | Reduces RTL integration effort by eliminating soft IP synthesis; guarantees sub-100 ns transaction latency. |
| UltraScale+ Memory Interface Engine | Enables 2400 MT/s DDR4 operation across 16 banks with built-in write leveling and read deskew calibration. |
| Dynamic Function eXchange (DFX) | Allows partial reconfiguration of logic regions without resetting the entire device-critical for runtime protocol adaptation. |
| Integrated 100G Ethernet MAC | Offloads TCP/IP stack processing from host CPU; supports IEEE 802.3bj KR4 FEC and RS-FEC for optical links. |
| System Monitor (XADC) | Provides real-time die temperature, supply voltage, and current monitoring via JTAG or AXI interface. |
Applications
| AI Inference Accelerator | 5G Massive MIMO Baseband |
|---|---|
Use Scenario: Real-time low-latency inference on vision transformer models using sparse matrix multiplication. IC Role / Device Role / Timing Role: Configurable accelerator fabric hosting custom systolic arrays and on-chip memory hierarchy. Use Value: Achieves 128 TOPS INT8 throughput with deterministic <5 µs kernel launch latency via DFX-based model partitioning. | Use Scenario: Digital pre-distortion (DPD) and channel estimation for 256-antenna 5G NR gNodeB units. IC Role / Device Role / Timing Role: Real-time signal processor interfacing directly to 12-bit 1.2 GS/s RF ADCs/DACs via JESD204B v2.0. Use Value: Supports 4× concurrent DPD engines with <100 ns loopback latency using hardened GTY transceivers and AXI-Stream DMA. |
| Data Center SmartNIC | Radar Signal Processor |
Use Scenario: Offloading TLS encryption, RDMA verbs, and packet classification in cloud server NICs. IC Role / Device Role / Timing Role: PCIe Gen4 endpoint with integrated DMA engines and SRAM-based pattern-matching TCAM. Use Value: Delivers 100 Gbps line-rate packet inspection with <200 ns added latency using hardened PCIe and memory controllers. | Use Scenario: Pulse-Doppler processing and CFAR detection in automotive long-range radar ECU. IC Role / Device Role / Timing Role: High-precision timing engine synchronizing ADC sampling, chirp generation, and FFT execution. Use Value: Enables 0.1° azimuth resolution at 77 GHz via 4096-point pipelined FFT with 128-tap FIR filtering in single clock domain. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-end FPGA applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XCVU13P-L2FLGA2577E | 3,328K logic cells, 56 GTY lanes, 132.5 Mb BRAM, 155 W TDP - larger capacity and higher bandwidth. | Required for >128-lane JESD204C or dual-100G Ethernet MAC deployments where XCVU9P lacks sufficient transceivers or memory. | Select when system-level bandwidth exceeds 1.2 TB/s or logic utilization exceeds 85% on XCVU9P-L2FLGB2104E. |
| XCVU7P-L1FLGA2104E | 2,072K logic cells, 32 GTY lanes, 84.5 Mb BRAM, 95 W TDP - reduced scale and lower power envelope. | Suitable for cost-sensitive 5G small cell or edge AI inference where full XCVU9P resources are underutilized. | Choose for designs targeting ≤90 Gb/s serial I/O and <100 W thermal budget without sacrificing DDR4 or PCIe Gen4 support. |
Compared with XCVU9P-L2FLGB2104E, the XCVU13P offers headroom for future bandwidth scaling but increases cooling complexity, while the XCVU7P reduces BOM cost and thermal management overhead at the expense of transceiver count and logic density.
Availability
XCVU9P-L2FLGB2104E is available at Aetrix Electronics and suitable for AI accelerator cards, 5G radio units, and data center SmartNICs requiring stable component supply across multi-year production cycles.
Supply support for XCVU9P-L2FLGB2104E includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD is a global semiconductor company designing adaptive computing platforms for data centers, AI, embedded systems, and high-performance computing.
The Virtex UltraScale+ family targets infrastructure acceleration with hardened interfaces, high-bandwidth memory, and reconfigurable logic for workloads demanding deterministic latency and scalable throughput.
FAQ
What is the maximum supported data rate per GTY transceiver lane on the XCVU9P-L2FLGB2104E?
The XCVU9P-L2FLGB2104E supports up to 25.78 Gb/s per GTY transceiver lane in standard mode, and 51.56 Gb/s in PAM4 gearbox mode. This capability enables compliance with IEEE 802.3cd for 100G/200G/400G Ethernet and OIF CEI-11G/28G standards. The XCVU9P-L2FLGB2104E transceiver configuration is validated using AMD's GTY IBERT core and reference clock jitter specifications.
Does the XCVU9P-L2FLGB2104E support DDR4 memory interfaces at 2400 MT/s?
Yes, the XCVU9P-L2FLGB2104E supports DDR4 interfaces at up to 2400 MT/s using its hardened Memory Interface Engine. It includes dedicated PHY logic, write leveling, and read deskew calibration across up to 16 I/O banks. The XCVU9P-L2FLGB2104E achieves this performance with verified timing closure on JEDEC-compliant DIMMs and LPDDR4x modules.
Can the XCVU9P-L2FLGB2104E be partially reconfigured during operation?
Yes, the XCVU9P-L2FLGB2104E supports Dynamic Function eXchange (DFX), enabling partial reconfiguration of designated logic regions without disrupting active functions. This capability is implemented through dedicated configuration ports and frame-based bitstream loading. The XCVU9P-L2FLGB2104E uses AXI-based configuration access and supports secure bitstream authentication during DFX updates.
What thermal management requirements apply to the XCVU9P-L2FLGB2104E in full-load operation?
The XCVU9P-L2FLGB2104E has a typical thermal design power of 125 W and requires a heatsink with ≥0.15°C/W thermal resistance plus forced airflow of ≥200 LFM. Its FLGB2104 package includes an integrated thermal lid and copper heat spreader. The XCVU9P-L2FLGB2104E thermal sensor (XADC) provides real-time junction temperature feedback for closed-loop fan control.
Is PCIe Gen4 x16 support on the XCVU9P-L2FLGB2104E implemented as hard IP or soft logic?
The XCVU9P-L2FLGB2104E implements PCIe Gen4 x16 as hardened IP, not soft logic. This includes physical layer (PHY), data link layer (DLL), and transaction layer (TL) blocks with full root complex and endpoint mode support. The XCVU9P-L2FLGB2104E PCIe hard IP meets PCI-SIG compliance test specifications and supports ASPM L0s/L1 power states and AER reporting.
XCVU9P-L2FLGB2104E Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Virtex® UltraScale+™
- Package/Case:
- 2104-BBGA, FCBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 147780
- Number of Logic Elements/Cells:
- 2586150
- Total RAM Bits:
- 391168000
- Number of I/O:
- 702
- Number of Gates:
- -
- Voltage - Supply:
- 0.698V ~ 0.742V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- 0°C ~ 110°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 2104-FCBGA (47.5x47.5)
XCVU9P-L2FLGB2104E FAQ
1.How can I place an order for XCVU9P-L2FLGB2104E through Aetrix?
Please submit a Request for Quotation (RFQ) for XCVU9P-L2FLGB2104E on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XCVU9P-L2FLGB2104E reliable?
The price and inventory of XCVU9P-L2FLGB2104E are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XCVU9P-L2FLGB2104E is usually 5 days.
3.What payment methods are accepted for XCVU9P-L2FLGB2104E?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XCVU9P-L2FLGB2104E transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XCVU9P-L2FLGB2104E?
XCVU9P-L2FLGB2104E orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XCVU9P-L2FLGB2104E order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XCVU9P-L2FLGB2104E?
For technical support, including XCVU9P-L2FLGB2104E datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XCVU9P-L2FLGB2104E requirements.
6.How does Aetrix verify that XCVU9P-L2FLGB2104E is sourced from the original manufacturer or authorized distributors?
All XCVU9P-L2FLGB2104E products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XCVU9P-L2FLGB2104E meets industry standards.
7.What is the process for return or replacement of XCVU9P-L2FLGB2104E?
All XCVU9P-L2FLGB2104E units undergo pre-shipment inspection (PSI). If there is an issue with XCVU9P-L2FLGB2104E, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XCVU9P-L2FLGB2104E part is unused and in its original packaging.
Return procedure for XCVU9P-L2FLGB2104E:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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