My Inquiry
My Account
AMD XCVU9P-L2FSGD2104E
- Part No.:
- XCVU9P-L2FSGD2104E
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 2104-BBGA, FCBGA
- Datasheet:
-
XCVU9P-L2FSGD2104E.pdf
- Description:
- IC FPGA 676 I/O 2104FCBGA
- Quantity:
- Payment:
- Shipping:
Inventory:4,994
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
XCVU9P-L2FSGD2104E from AMD is a high-performance Virtex UltraScale+ FPGA featuring 2,586K logic cells, 11,520 DSP slices, and 72.5 Mb of block RAM. It integrates hardened 25.8 Gb/s GTY transceivers and supports PCIe Gen4 x16, making it suitable for AI acceleration, 5G baseband processing, and high-end radar signal conditioning.
For engineers reviewing the XCVU9P-L2FSGD2104E datasheet, pinout, applications, or equivalent options, key selection criteria include transceiver lane count (32 GTY), I/O bank voltage support (0.35–1.8 V), and thermal design power (TDP) of 45 W under typical configuration.
Technical Context
The XCVU9P-L2FSGD2104E implements a heterogeneous architecture with programmable logic fabric, hardened IP blocks (PCIe Gen4, 100G Ethernet MAC, DDR4 controller), and multi-rate transceivers. It supports partial reconfiguration and AXI4-Stream interfaces for real-time data path adaptation.
Configuration is performed via quad-SPI or BPI flash, with secure bitstream encryption using AES-256 and HMAC authentication. The device operates across industrial temperature range (–40°C to +100°C junction) and meets JESD22-A108 reliability standards.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 2,586,000 - determines maximum combinational/sequential logic capacity for complex algorithm mapping |
| DSP Slices | 11,520 - enables parallel execution of 27×18-bit multiply-accumulate operations per slice |
| Block RAM | 72.5 Mb - provides on-die memory for frame buffering, coefficient storage, and FIFOs |
| GTY Transceivers | 32 lanes @ up to 25.8 Gb/s - supports 100G Ethernet, CPRI, and JESD204B/C serial links |
| I/O Pins | 832 user-configurable - compatible with LVDS, SSTL, HSTL, and MIPI signaling standards |
| TDP | 45 W (typical) - defines thermal management requirements for air-cooled or conduction-cooled enclosures |
Pinout & Package
Package: FCBGA-2104 (39.5 mm × 39.5 mm, 1.0 mm pitch, 2104-ball array). Thermal pad on underside requires solder paste stencil aperture and ground plane connection.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| MIO[0:15] | Multiplexed I/O Bank 65 | Configurable as SDIO, UART, SPI, I2C, or GPIO; voltage-tolerant to 3.3 V |
| HR[0:171] | High-Range I/O Bank 64/66/67/68 | Supports 1.8 V/1.5 V/1.35 V/1.2 V/1.0 V signaling; includes dedicated clock routing |
| HP[0:511] | High-Performance I/O Bank 48–53 | LVDS-21, SSTL15, HSTL_I, MIPI D-PHY compliant; optimized for DDR4 interface |
| GTY_TXN/GTY_TXP | Differential Transceiver Output | 32 differential pairs; each pair supports protocol-specific equalization and pre-emphasis |
| VCCINT | Core Power Supply | 0.85 V ±3% supply; requires low-noise regulation and local decoupling |
Key Features
| Feature | Design Value |
|---|---|
| PCIe Gen4 x16 Root Port | Hardened endpoint supporting 16 GT/s per lane; eliminates soft IP resource consumption |
| DDR4 Memory Controller | Integrated dual-channel 72-bit interface with ECC; supports up to 2400 MT/s |
| Partial Reconfiguration | Enables dynamic logic swapping without system reset; verified for runtime FPGA function updates |
| AES-256 Bitstream Encryption | Prevents unauthorized configuration loading; keys stored in eFUSE with tamper detection |
| AXI4-Stream Interconnect | Native support for high-throughput streaming between IP blocks; no bridge logic required |
Applications
| Radar Signal Processing | 5G Massive MIMO Baseband |
|---|---|
Use Scenario: Real-time beamforming and pulse-Doppler processing in phased-array radar systems. IC Role / Device Role / Timing Role: FPGA fabric executes adaptive filtering and FFT-based spectral analysis; GTY transceivers interface with ADC/DAC arrays. Use Value: 32 GTY lanes enable direct connection to 16× 12-bit 2.6 GSPS ADCs, reducing latency vs. external serializer. | Use Scenario: Digital pre-distortion (DPD) and uplink/downlink channel processing in 5G NR macro base stations. IC Role / Device Role / Timing Role: Configurable accelerator for OFDM modulation/demodulation and LDPC decoding; PCIe Gen4 connects to host CPU. Use Value: 11,520 DSP slices deliver >2.1 TOPS at 100 MHz for real-time DPD coefficient updates. |
| AI Inference Acceleration | High-Speed Test Equipment |
Use Scenario: Low-latency inference for vision-guided robotics using quantized CNN models. IC Role / Device Role / Timing Role: Programmable logic implements custom convolution pipelines; DDR4 controller manages weight buffer access. Use Value: 72.5 Mb block RAM stores 32 MB of model weights with single-cycle read access. | Use Scenario: Pattern generation and response analysis in automated test equipment for SerDes validation. IC Role / Device Role / Timing Role: GTY transceivers generate calibrated PRBS sequences; logic fabric performs real-time error counting and BER calculation. Use Value: 25.8 Gb/s GTY operation enables compliance testing of 100G/400G optical modules per IEEE 802.3bs. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-end FPGA applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XCVU13P-L2FSGD2104E | 3,328K logic cells, 13,824 DSP slices, 96.5 Mb BRAM - higher density and bandwidth | Required for larger AI models or full 5G gNodeB L1 stack implementation | Select when >2.6M LC or >12K DSP slices are needed; same package footprint but higher TDP (65 W) |
| XCVU7P-L2FSGD2104E | 2,072K logic cells, 8,640 DSP slices, 54.5 Mb BRAM - reduced capacity and transceiver count (24 GTY) | Suitable for mid-tier radar or 5G small cell deployments | Choose for cost-sensitive designs where 32 GTY lanes and 2.5M LC are not fully utilized |
Compared with XCVU9P-L2FSGD2104E, the XCVU13P offers higher compute density at increased power and cost, while the XCVU7P reduces capability and price for less demanding workloads - enabling scalable FPGA selection across performance tiers.
Availability
XCVU9P-L2FSGD2104E is available at Aetrix Electronics and suitable for AI acceleration platforms, 5G infrastructure hardware, and defense-grade radar subsystems requiring stable component supply and long-term lifecycle assurance.
Supply support for XCVU9P-L2FSGD2104E includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD is a global semiconductor company focused on high-performance computing, adaptive SoCs, and FPGA technologies for datacenter, communications, and aerospace applications.
The Virtex UltraScale+ family delivers adaptive compute acceleration for real-time signal processing, network offload, and AI inference - designed specifically for systems demanding deterministic latency and protocol-hardened I/O.
FAQ
What is the maximum supported data rate for GTY transceivers on the XCVU9P-L2FSGD2104E?
The XCVU9P-L2FSGD2104E supports GTY transceivers operating at up to 25.8 Gb/s per lane. This rate is validated for protocols including 100G Ethernet (4×25G), CPRI Option 10, and JESD204C. Operation at this speed requires proper PCB stack-up, controlled impedance routing, and reference clock jitter below 500 fs RMS.
Does the XCVU9P-L2FSGD2104E support PCIe Gen4 x16 in root complex mode?
Yes, the XCVU9P-L2FSGD2104E includes a hardened PCIe Gen4 x16 root port capable of 16 GT/s per lane. It supports Type 0 and Type 1 configurations, MSI-X interrupt handling, and address translation services (ATS). The XCVU9P-L2FSGD2104E requires no soft IP for basic enumeration and DMA transfers.
What I/O standards are supported by the HP I/O banks of the XCVU9P-L2FSGD2104E?
The HP I/O banks of the XCVU9P-L2FSGD2104E support LVDS, SSTL15, HSTL_I, and MIPI D-PHY signaling. These banks are optimized for high-speed memory interfaces such as DDR4-2400 and LPDDR4-4266, with programmable output drive strength and input termination.
Is partial reconfiguration supported on the XCVU9P-L2FSGD2104E, and what tools enable it?
Yes, partial reconfiguration is fully supported on the XCVU9P-L2FSGD2104E using Vivado Design Suite 2023.2 or later. The XCVU9P-L2FSGD2104E allows dynamic swapping of logical partitions without resetting the entire device, with verified timing closure and bitstream authentication during reload.
What is the industrial temperature range specification for the XCVU9P-L2FSGD2104E?
The XCVU9P-L2FSGD2104E is rated for industrial temperature operation from –40°C to +100°C junction temperature. This rating is validated per JESD22-A108 and applies to all I/O banks, transceivers, and logic fabric under specified voltage and cooling conditions.
XCVU9P-L2FSGD2104E Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Virtex® UltraScale+™
- Package/Case:
- 2104-BBGA, FCBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 147780
- Number of Logic Elements/Cells:
- 2586150
- Total RAM Bits:
- 391168000
- Number of I/O:
- 676
- Number of Gates:
- -
- Voltage - Supply:
- 0.698V ~ 0.742V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- 0°C ~ 110°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 2104-FCBGA (47.5x47.5)
XCVU9P-L2FSGD2104E FAQ
1.How can I place an order for XCVU9P-L2FSGD2104E through Aetrix?
Please submit a Request for Quotation (RFQ) for XCVU9P-L2FSGD2104E on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XCVU9P-L2FSGD2104E reliable?
The price and inventory of XCVU9P-L2FSGD2104E are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XCVU9P-L2FSGD2104E is usually 5 days.
3.What payment methods are accepted for XCVU9P-L2FSGD2104E?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XCVU9P-L2FSGD2104E transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XCVU9P-L2FSGD2104E?
XCVU9P-L2FSGD2104E orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XCVU9P-L2FSGD2104E order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XCVU9P-L2FSGD2104E?
For technical support, including XCVU9P-L2FSGD2104E datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XCVU9P-L2FSGD2104E requirements.
6.How does Aetrix verify that XCVU9P-L2FSGD2104E is sourced from the original manufacturer or authorized distributors?
All XCVU9P-L2FSGD2104E products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XCVU9P-L2FSGD2104E meets industry standards.
7.What is the process for return or replacement of XCVU9P-L2FSGD2104E?
All XCVU9P-L2FSGD2104E units undergo pre-shipment inspection (PSI). If there is an issue with XCVU9P-L2FSGD2104E, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XCVU9P-L2FSGD2104E part is unused and in its original packaging.
Return procedure for XCVU9P-L2FSGD2104E:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
XCVU9P-L2FSGD2104E Tags
-
ICE40LP384-SG32
Lattice Semiconductor Corporation
-
ICE40UL640-CM36AI
Lattice Semiconductor Corporation
-
ICE40UL1K-CM36AI
Lattice Semiconductor Corporation
-
LCMXO2-256HC-4SG32C
Lattice Semiconductor Corporation
-
10M02DCV36C8G
Intel
-
LCMXO2-256HC-4SG32I
Lattice Semiconductor Corporation
-
ICE5LP1K-SG48ITR
Lattice Semiconductor Corporation
-
ICE40LP1K-CM36
Lattice Semiconductor Corporation
-
LCMXO2-256ZE-1SG32I
Lattice Semiconductor Corporation
-
LCMXO2-256HC-4SG48I
Lattice Semiconductor Corporation
-
ICE40LP1K-CM81
Lattice Semiconductor Corporation
-
T20W80I4
Efinix, Inc.
Tech Hub
A practical engineering and sourcing framework covering lifecycle verification, lifetime-buy calculations, replacement qualification, supplier checks and counterfeit-risk controls.
TTL and CMOS logic families differ in thresholds, loading, output drive, power and timing. This engineering guide compares 74HC and 74HCT, calculates noise margins and checks 3.3 V/5 V compatibility.
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
