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Texas Instruments XIO1100GGB

Part No.:
XIO1100GGB
Manufacturer:
Texas Instruments
Category:
Specialized
Package:
100-LFBGA
Datasheet:
AetrixXIO1100GGB.pdf
Description:
IC INTERFACE SPECIALIZED 100BGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:111

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Product details

Overview

XIO1100GGB from Texas Instruments is a PCI Express 1.1-compliant PHY device implementing the TI-PIPE MAC interface, supporting 2.5 Gbps serial link operation with differential TXP/TXN and RXP/RXN I/O, 100/125 MHz reference clock selection, and dual-mode (8-bit DDR / 16-bit SDR) parallel interface. It serves as the physical layer bridge between PCIe MAC logic and serial link in embedded host controllers and add-in cards.

For engineers reviewing the XIO1100GGB datasheet, XIO1100GGB pinout, XIO1100GGB application, or XIO1100GGB equivalent, key selection criteria include TI-PIPE interface configuration (DDR_EN, CLK_SEL), power state control (POWERDOWN[1:0]), elastic buffer SKP handling, 8B/10B decode error reporting via RX_STATUS[2:0], and GGB BGA package compatibility with PCIe layout guidelines.

Technical Context

The XIO1100GGB implements a modified PIPE interface-TI-PIPE-with source-synchronous TX_CLK and RX_CLK clocks, unlike Intel's single-clock PIPE. It supports two operational modes: 125 MHz 16-bit SDR (when DDR_EN = low) and 250 MHz 8-bit DDR (when DDR_EN = high), both compliant with PCIe Base Specification 1.1.

It performs full 8B/10B encoding/decoding and scrambling/unscrambling, recovers receiver clock from data transitions, and incorporates an elastic buffer with ±600 ppm clock tolerance compensation using SKP ordered-sets. Power management includes three defined states-P0 (full operation), P0s (TX idle), and P1 (both TX/RX idle)-with PHY_STATUS signaling for state transition completion.

Key Specifications

Parameter Value and Actual Design Meaning
PCIe Compliance PCI Express Base Specification Revision 1.1 - ensures interoperability with standard PCIe root complexes and endpoints.
Data Rate 2.5 Gbps per lane - matches PCIe 1.x Gen1 signaling rate with 8B/10B encoding overhead.
Interface Mode Selectable 16-bit SDR @ 125 MHz or 8-bit DDR @ 250 MHz - enables flexible bandwidth and timing margin trade-offs in MAC integration.
Reference Clock 100 MHz differential (REFCLK+/REFCLK−) or 125 MHz single-ended (REFCLK+) - selected at reset via CLK_SEL pin.
Power States P0 (full operation), P0s (TX idle), P1 (TX+RX idle) - controlled by POWERDOWN[1:0]; P1 supports optional P1_SLEEP to disable RX_CLK.
Error Reporting RX_STATUS[2:0] outputs real-time codes for 8B/10B decode error, elastic buffer overflow/underflow, disparity error, and SKP insertion/removal - enables precise link-layer diagnostics.
Supply Voltages VDD_IO = 1.5 V or 1.8 V (configures TI-PIPE I/O level); VDDA_15/VDDA_33 for analog PLL and reference circuitry - requires separate filtering per datasheet Section 5.3.

Pinout & Package

The XIO1100GGB is housed in a 100-pin MicroStar BGA (GGB) package with 0.8 mm pitch, designed for high-speed PCIe signal integrity and thermal dissipation in compact board layouts.

Pin/Terminal Circuit Role Design Meaning
/RESET (N11) Asynchronous reset input Active-low signal that initializes internal state; must be held until REFCLK and power stabilize before release.
POWERDOWN[1:0] (L9, M9) Power state select inputs Defines P0 (00), P0s (01), or P1 (10); controls clock gating, PLL enable, and RX_CLK retention per LTSSM requirements.
TX_CLK (M8) / RX_CLK (B8) Source-synchronous interface clocks TX_CLK latches TX_DATA[15:0]/TX_DATAK[1:0]; RX_CLK times RX_DATA[15:0]/RX_DATAK[1:0]; independent frequency/phase domains per TI-PIPE spec.
TXP/TXN (G12/G13), RXP/RXN (C12/C13) Differential PCIe serial I/O 2.5 Gbps AC-coupled lanes meeting PCIe 1.1 electrical specs; require controlled impedance (100 Ω diff) and length matching per Section 5.4.
RX_STATUS[2:0] (E3, G1, G3) Status output bus 3-bit code reports real-time receive events: SKP add/remove (001/010), 8B/10B error (100), overflow (101), underflow (111), disparity (111) - prioritized per error hierarchy.
DDR_EN (L10) Interface mode control Configures TI-PIPE as 16-bit SDR (low) or 8-bit DDR (high) during /RESET deassertion; determines TX_DATA/CLK timing relationship and bus usage.

Key Features

Feature Design Value
TI-PIPE Interface Flexibility Configurable 16-bit SDR or 8-bit DDR mode enables MAC designers to optimize timing closure and PCB routing density without changing PHY hardware.
Elastic Buffer SKP Compensation ±600 ppm clock tolerance handled via dynamic SKP symbol insertion/removal - eliminates need for external clock alignment circuits in asymmetric clock domains.
Comprehensive Error Signaling RX_STATUS[2:0] delivers prioritized, cycle-accurate error codes (decode, overflow, underflow, disparity) - allows MAC firmware to isolate link issues without protocol stack parsing.
Three-Tier Power Management P0/P0s/P1 states align precisely with PCIe LTSSM; P1_SLEEP option reduces idle power further while retaining RX_CLK stability for fast wake-up.
Receiver Detection & Loopback Hardware-accelerated RX detection (via TXDETECTRX/LOOPBACK) and transparent loopback mode simplify link training validation and bring-up diagnostics.

Applications

PCIe Add-in Card PHY Embedded Host Controller PHY

Use Scenario: High-density server add-in card requiring PCIe Gen1 x1 or x4 connectivity with minimal latency and deterministic power state transitions.

IC Role / Device Role / Timing Role: Physical layer transceiver bridging FPGA-based MAC to backplane or slot connector; provides 2.5 Gbps serial I/O, TI-PIPE parallel interface, and LTSSM-aligned P-states.

Use Value: Enables drop-in PCIe compliance without custom PHY development; elastic buffer and SKP handling ensure robust link operation across temperature and voltage variation.

Use Scenario: Industrial embedded system with ASIC/FPGA host controller needing PCIe uplink to CPU or switch fabric, constrained by board space and thermal envelope.

IC Role / Device Role / Timing Role: PCIe 1.1 PHY implementing TI-PIPE interface with selectable 1.5 V/1.8 V I/O, 100-pin GGB footprint, and P1 sleep support for low-power idle modes.

Use Value: Reduces BOM count by integrating 8B/10B encode/decode, clock recovery, and error reporting - eliminating need for discrete SerDes or glue logic.

PCIe Diagnostic & Test Equipment Legacy System PCIe Bridge

Use Scenario: Protocol analyzer or compliance test fixture requiring precise visibility into PCIe physical layer behavior including SKP sequences, disparity, and elastic buffer status.

IC Role / Device Role / Timing Role: PHY with real-time RX_STATUS[2:0] reporting and loopback mode for injecting/receiving raw symbols; supports manual control of TX_ELECIDLE and TX_COMPLIANCE.

Use Value: Provides hardware-level access to PCIe PHY internals - enabling low-level link training observation, error injection, and electrical idle characterization.

Use Scenario: Retrofit solution adding PCIe connectivity to legacy industrial controller with parallel bus interface, where FPGA resources are limited.

IC Role / Device Role / Timing Role: Standalone PCIe PHY offloading SERDES functions from resource-constrained FPGA; interfaces via TI-PIPE with minimal logic (no encoder/decoder IP required).

Use Value: Accelerates PCIe integration by abstracting physical layer complexity - allowing legacy designs to meet modern interconnect requirements with minimal RTL changes.

Equivalent & Alternatives

The following parts are listed as comparable options for similar PCIe PHY applications.

Alternative Part Technical Difference Application Difference Selection Advice
IDT8N34S01BGI PCIe 1.1 clock generator with integrated jitter cleaner; no TI-PIPE interface or serial transceiver functionality. Used for reference clock distribution only - cannot replace XIO1100GGB as a full PHY; requires external PHY for link termination. Select only when clock synthesis-not physical layer bridging-is the primary requirement.
PI7C9X2G304SVDEX PCIe 2.0 switch with integrated PHYs; monolithic multi-port solution lacking standalone TI-PIPE interface or GGB package. Targets multi-lane switching topologies; not suitable for point-to-point MAC-to-link bridging or FPGA-based PHY offload. Choose only for systems requiring PCIe fan-out or switching; incompatible with direct TI-PIPE MAC integration.

Compared with IDT8N34S01BGI and PI7C9X2G304SVDEX, the XIO1100GGB uniquely delivers a dedicated, pin-configurable TI-PIPE PHY in a compact GGB package-enabling direct MAC interfacing, full 8B/10B processing, and PCIe 1.1 LTSSM compliance without added silicon layers or clock tree complexity.

Availability

XIO1100GGB is available at Aetrix Electronics and suitable for PCIe add-in cards, embedded host controllers, and diagnostic equipment requiring stable component supply, long-term lifecycle support, and verified signal integrity performance.

Supply support for XIO1100GGB includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Texas Instruments is a global semiconductor company specializing in analog, embedded processing, and connectivity solutions, with decades of leadership in high-speed interface IP and PHY design.

The XIO1100GGB belongs to TI's PCI Express PHY product line, engineered specifically to simplify PCIe 1.1 integration for FPGA- and ASIC-based host controllers through the TI-PIPE interface and robust power-aware link training support.

FAQ

What is the function of the DDR_EN pin on the XIO1100GGB?

The DDR_EN pin configures the TI-PIPE interface mode during /RESET deassertion: when low, it enables 16-bit SDR operation at 125 MHz; when high, it enables 8-bit DDR operation at 250 MHz. This setting determines how TX_DATA[15:0] and RX_DATA[15:0] are sampled relative to TX_CLK and RX_CLK, directly impacting MAC timing constraints and PCB routing. The XIO1100GGB does not support runtime reconfiguration of DDR_EN.

How does the XIO1100GGB handle clock tolerance between link partners?

The XIO1100GGB uses an elastic buffer with SKP ordered-set tracking to compensate for ±600 ppm clock frequency differences. Upon detecting COM (0xBC) + SKP (0x1C) symbols, it inserts or removes SKP symbols to prevent buffer overflow or underflow. The RX_STATUS[2:0] bus signals "Add SKP" (001b) or "Remove SKP" (010b) in the same RX_CLK cycle as the COM symbol, enabling MAC-level synchronization response. This mechanism is fully implemented in hardware and requires no MAC intervention.

What power states does the XIO1100GGB support, and how are they controlled?

The XIO1100GGB supports three power states-P0 (full operation), P0s (TX idle), and P1 (TX+RX idle)-selected via POWERDOWN[1:0] (L9/M9). State transitions are acknowledged by a single-cycle PHY_STATUS pulse. In P1, optional P1_SLEEP (M10) can disable RX_CLK to reduce power further, but only when asserted in P1 and cleared before exit. The XIO1100GGB does not support P2 or beacon states per PCIe 1.1 specification.

Can the XIO1100GGB operate with both 1.5 V and 1.8 V I/O voltages?

Yes-the XIO1100GGB's TI-PIPE interface voltage is determined by VDD_IO: 1.5 V supplies configure LVCMOS15 I/O levels, while 1.8 V supplies configure LVCMOS18 levels. This selection is static and must match the connected MAC's I/O voltage. VDD_IO pins (F3, K3, L7, C5) must be decoupled per Section 5.3 of the datasheet; mixing voltages on these pins is not permitted and may damage the XIO1100GGB.

What is the role of the RX_STATUS[2:0] signals in the XIO1100GGB?

RX_STATUS[2:0] is a 3-bit status bus that reports real-time receive-side events on the rising edge of RX_CLK. It encodes eight conditions-including 8B/10B decode error (100b), elastic buffer overflow (101b), underflow (111b), disparity (111b), SKP add (001b), and SKP remove (010b)-with strict priority ordering. The XIO1100GGB asserts these codes for exactly one RX_CLK cycle at the earliest possible point in the data stream, enabling precise MAC-level error handling without protocol stack dependency.

XIO1100GGB Specifications

Product attributes
Attribute value
Manufacturer:
Texas Instruments
Series:
-
Package/Case:
100-LFBGA
Packaging:
Tray
Product Status:
Obsolete
Applications:
-
Interface:
TI-PIPE
Voltage - Supply:
1.35V ~ 1.65V, 3V ~ 3.6V
Supplier Device Package:
100-BGA MICROSTAR (12.1x12.1)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount

XIO1100GGB FAQ

1.How can I place an order for XIO1100GGB through Aetrix?

Please submit a Request for Quotation (RFQ) for XIO1100GGB on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for XIO1100GGB reliable?

The price and inventory of XIO1100GGB are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XIO1100GGB is usually 5 days.

3.What payment methods are accepted for XIO1100GGB?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XIO1100GGB transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for XIO1100GGB?

XIO1100GGB orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your XIO1100GGB order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for XIO1100GGB?

For technical support, including XIO1100GGB datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XIO1100GGB requirements.

6.How does Aetrix verify that XIO1100GGB is sourced from the original manufacturer or authorized distributors?

All XIO1100GGB products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XIO1100GGB meets industry standards.

7.What is the process for return or replacement of XIO1100GGB?

All XIO1100GGB units undergo pre-shipment inspection (PSI). If there is an issue with XIO1100GGB, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The XIO1100GGB part is unused and in its original packaging.

Return procedure for XIO1100GGB:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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