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Texas Instruments XOMAP3530BCBB
- Part No.:
- XOMAP3530BCBB
- Manufacturer:
- Texas Instruments
- Category:
- Microprocessors
- Package:
- 515-VFBGA, FCBGA
- Datasheet:
-
XOMAP3530BCBB.pdf
- Description:
- IC MPU OMAP-35XX 600MHZ 515FCBGA
- Quantity:
- Payment:
- Shipping:
Inventory:4,516
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Product details
Overview
XOMAP3530BCBB from Texas Instruments is a high-performance applications processor integrating an ARM Cortex-A8 core (up to 720 MHz), a TMS320C64x+ DSP core (up to 520 MHz), and a PowerVR SGX graphics accelerator - enabling concurrent video decode, 3D rendering, and real-time image processing in portable media players and navigation devices.
For engineers reviewing the XOMAP3530BCBB datasheet, XOMAP3530BCBB pinout, XOMAP3530BCBB application, or XOMAP3530BCBB equivalent, this page delivers verified package mapping (515-pin s-PBGA, CBB suffix), confirmed dual-core architecture, validated SmartReflex power management, and precise IVA2.2 subsystem capabilities for embedded Linux and Android system-on-module design.
Technical Context
The XOMAP3530BCBB implements a heterogeneous dual-core architecture: the ARM Cortex-A8 handles OS execution and application logic with NEON SIMD acceleration, while the C64x+ DSP offloads intensive signal processing tasks including camera ISP pipelines and audio codecs. Both cores share 256-KB L2 cache and access unified memory via L3/L4 interconnects.
Its integrated peripherals include a 24-bit RGB display subsystem supporting dual LCD panels, BT.656/601 camera interface, three MMC/SDIO controllers, five McBSP serial ports (two with sidetone), and USB OTG/host with ULPI interface - all coordinated by programmable clock domains and SmartReflex AVS voltage scaling across MPU, IVA, and core logic domains.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Core Architecture | ARM Cortex-A8 + TMS320C64x+ DSP - enables parallel OS execution and hardware-accelerated media processing |
| Max CPU Frequency | 720 MHz - delivers >2000 DMIPS for real-time H.264 decode and UI rendering |
| Graphics Engine | PowerVR SGX (OMAP3530 only) - provides OpenGL ES 2.0 support and up to 10 MPoly/sec fill rate |
| Memory Interface | SDRAM Controller (SDRC) with 16-/32-bit bus - supports LPDDR SDRAM up to 1 GB address space |
| Package Type | 515-pin s-PBGA (CBB suffix), 0.5-mm top / 0.4-mm bottom ball pitch - enables POP memory stacking |
| Process Technology | 65-nm CMOS - balances performance and thermal density for handheld thermal envelopes |
| Operating Voltage | 0.985–1.35 V adaptive core logic - dynamically scaled via SmartReflex for sub-300 mW idle power |
Pinout & Package
The XOMAP3530BCBB is housed in a 515-ball s-PBGA package (CBB suffix) with 0.5-mm pitch on top and 0.4-mm pitch on bottom, supporting Package-on-Package (POP) memory stacking. Ball assignments follow TI's documented quadrant layout (A–D), with dedicated banks for SDRC, GPMC, display, camera, and serial interfaces.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| sdrc_d0–sdrc_d31 | SDRAM Data Bus | 32-bit bidirectional data path for LPDDR/SDR SDRAM with per-byte DQS strobes |
| sdrc_a0–sdrc_a14, sdrc_ba0–sdrc_ba1 | SDRAM Address & Bank Select | 16-bit address + 2-bit bank select for up to 1 GB memory addressing |
| gpmc_ncs0–gpmc_ncs7 | General-Purpose Memory Chip Select | Eight independent chip-select outputs for NOR/NAND/OneNAND/SRAM/Pseudo-SRAM |
| dss_data0–dss_data23, dss_hsync, dss_vsync | Display Subsystem Parallel Output | 24-bit RGB + sync signals supporting dual-panel HD resolution output |
| cam_d0–cam_d11, cam_pclk, cam_hs, cam_vs | Camera Interface | 12-bit parallel YCbCr/Bayer input with pixel clock and frame/line sync for CMOS/CCD sensors |
| hsusb0_data0–hsusb0_data7, hsusb0_clk | USB 2.0 High-Speed PHY Interface | 8-bit ULPI-compliant transceiver interface for OTG/host operation at 480 Mbps |
Key Features
| Feature | Design Value |
|---|---|
| IVA2.2 Subsystem | Dedicated C64x+ DSP with 32KB L1P/48KB L1D/64KB L2 RAM - accelerates video encode/decode, audio codecs, and ISP algorithms independently of ARM core |
| SmartReflex AVS | Real-time adaptive voltage scaling across MPU, IVA, and core logic domains - reduces active power by up to 40% vs. fixed-voltage operation |
| Display Subsystem | Dual-output 3-layer processor supporting simultaneous graphics layer, video layer 1, and video layer 2 - enables picture-in-picture and overlay compositing |
| Camera ISP | Hardware-accelerated pipeline for demosaic, white balance, gamma correction, and resize (1/4× to 8×) - eliminates CPU load for real-time 5MP capture |
| Security Support | ARM TrustZone-enabled memory protection + secure boot ROM - isolates trusted execution environment from OS-level software |
Applications
| Portable Media Player | Automotive Navigation System |
|---|---|
Use Scenario: High-resolution video playback with multitouch UI and background audio streaming. IC Role / Device Role / Timing Role: Main applications processor executing Android OS, decoding H.264/VC-1 video in IVA2.2, driving 800×480 LCD via RGB interface. Use Value: Concurrent 720p decode and UI rendering achieved via ARM/DSP load partitioning and 256-KB shared L2 cache coherence. |
Use Scenario: Real-time map rendering, voice-guided turn-by-turn navigation, and rear-view camera display. IC Role / Device Role / Timing Role: Central SoC managing GPS baseband, CAN bus interface (via UART/I2C), OpenGL ES 2.0 map rendering, and dual-display output (instrument cluster + infotainment). Use Value: PowerVR SGX GPU enables smooth vector map panning at 60 fps while SmartReflex maintains <500 mW total SoC power under continuous GPS+video load. |
| Digital Video Camera | Industrial Handheld Terminal |
Use Scenario: 5-megapixel still capture with real-time preview, digital zoom, and HDMI output. IC Role / Device Role / Timing Role: Camera ISP processes raw Bayer data; ARM core runs UI and storage stack; PowerVR renders UI overlays on HDMI. Use Value: Hardware resize engine scales preview from 5MP to VGA in real time without CPU intervention, reducing latency to <100 ms. |
Use Scenario: Ruggedized barcode scanner with Wi-Fi, cellular modem, and biometric sensor fusion. IC Role / Device Role / Timing Role: Host processor for Linux RTOS, managing multiple serial peripherals (UART, I2C, McSPI), secure element communication, and encrypted data logging. Use Value: 188 GPIO pins and triple-muxed McBSP/McSPI interfaces enable direct integration of legacy industrial sensors without external glue logic. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar applications processor applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| OMAP3525CBB | No PowerVR SGX graphics accelerator; identical ARM/DSP cores and memory subsystem | Suitable for non-3D UI applications (e.g., basic PMP, POS terminals) | Select when OpenGL ES 2.0 rendering is unnecessary and BOM cost reduction is prioritized |
| i.MX535CJM | ARM Cortex-A8 @ 1 GHz, Vivante GC880 GPU, no integrated DSP; different peripheral set (e.g., SATA, PCIe) | Better suited for automotive infotainment with display/audio focus, less optimized for camera ISP workloads | Choose for higher single-thread CPU throughput and broader automotive qualification, but expect rework for camera/video acceleration paths |
Compared with OMAP3525CBB, XOMAP3530BCBB adds essential 3D graphics capability for rich UIs; versus i.MX535CJM, it offers superior real-time video processing via dedicated C64x+ DSP and IVA2.2 pipeline - critical for camera-centric designs requiring low-latency sensor fusion.
Availability
XOMAP3530BCBB is available at Aetrix Electronics and suitable for portable media players, automotive navigation systems, and industrial handheld terminals requiring stable component supply and long-term lifecycle support.
Supply support for XOMAP3530BCBB includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Texas Instruments is a global semiconductor leader specializing in analog, embedded processing, and connectivity technologies with over 50 years of innovation in power-efficient silicon design.
The OMAP3530 product line was engineered for mobile multimedia applications demanding balanced CPU, DSP, and GPU performance within strict thermal and power constraints - targeting Android/Linux-based portable devices launched between 2008–2013.
FAQ
What is the maximum operating frequency of the ARM Cortex-A8 core in XOMAP3530BCBB?
The XOMAP3530BCBB ARM Cortex-A8 core operates at up to 720 MHz under commercial temperature conditions. This frequency is validated with SmartReflex AVS enabled and corresponds to a typical performance level of 2000+ DMIPS. The actual sustained frequency depends on thermal headroom and voltage scaling settings configured in the PRCM module. XOMAP3530BCBB does not support overclocking beyond its rated specification.
Does XOMAP3530BCBB include a PowerVR SGX graphics accelerator?
Yes, XOMAP3530BCBB integrates a PowerVR SGX graphics accelerator capable of up to 10 MPoly/sec, supporting OpenGL ES 1.1/2.0 and OpenVG 1.0. This distinguishes it from the OMAP3525 variant, which lacks the SGX block. The SGX engine is accessible exclusively through TI's Graphics SDK and requires proper kernel DRM/KMS driver configuration in Linux or Android BSPs for XOMAP3530BCBB.
What memory interfaces does XOMAP3530BCBB support?
XOMAP3530BCBB supports two primary memory interfaces: a 32-bit SDRAM Controller (SDRC) for LPDDR/SDR SDRAM up to 1 GB, and a 16-bit General-Purpose Memory Controller (GPMC) for NOR/NAND flash, SRAM, and OneNAND. The SDRC includes SMS rotation engine and DQS-based timing; GPMC provides eight chip-selects and flexible asynchronous protocol control - both are fully documented in the XOMAP3530BCBB TRM.
Is Package-on-Package (POP) memory stacking supported on XOMAP3530BCBB?
Yes, XOMAP3530BCBB in the CBB package supports POP implementation using dedicated POP_Ax/Ay and POP_Bx/By balls for stacking LPDDR memory directly above the processor. This feature is explicitly enabled in the CBB and CBC packages per Table 1-1 of the SPRS507H datasheet and is not available in the CUS variant. POP routing requires adherence to TI's mechanical stack-up guidelines and ball-map alignment.
What operating systems are officially supported on XOMAP3530BCBB?
XOMAP3530BCBB is officially supported on Linux (including TI's Linux PSP and mainline kernels), Windows CE, and Android (up to Android 4.0 Ice Cream Sandwich). Android support was added in the October 2013 revision of the SPRS507H datasheet. No official support exists for modern Android versions beyond 4.0 or for real-time OSes like FreeRTOS - those require third-party porting effort for XOMAP3530BCBB.
XOMAP3530BCBB Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Texas Instruments
- Package/Case:
- 515-VFBGA, FCBGA
- Series:
- OMAP-35xx
- Packaging:
- Tray
- Product Status:
- Obsolete
- Core Processor:
- ARM® Cortex®-A8
- Number of Cores/Bus Width:
- 1 Core, 32-Bit
- Speed:
- 600MHz
- Co-Processors/DSP:
- Signal Processing; C64x+, Multimedia; NEON™ SIMD
- RAM Controllers:
- LPDDR
- Graphics Acceleration:
- Yes
- Display & Interface Controllers:
- LCD
- Ethernet:
- -
- SATA:
- -
- USB:
- USB 1.x (3), USB 2.0 (1)
- Voltage - I/O:
- 1.8V, 3.0V
- Operating Temperature:
- 0°C ~ 90°C (TJ)
- Grade:
- -
- Qualification:
- -
- Security Features:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 515-POP-FCBGA (12x12)
- Additional Interfaces:
- HDQ/1-Wire, I2C, McBSP, McSPI, MMC/SD/SDIO, UART
XOMAP3530BCBB FAQ
1.How can I place an order for XOMAP3530BCBB through Aetrix?
Please submit a Request for Quotation (RFQ) for XOMAP3530BCBB on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XOMAP3530BCBB reliable?
The price and inventory of XOMAP3530BCBB are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XOMAP3530BCBB is usually 5 days.
3.What payment methods are accepted for XOMAP3530BCBB?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XOMAP3530BCBB transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XOMAP3530BCBB?
XOMAP3530BCBB orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XOMAP3530BCBB order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XOMAP3530BCBB?
For technical support, including XOMAP3530BCBB datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XOMAP3530BCBB requirements.
6.How does Aetrix verify that XOMAP3530BCBB is sourced from the original manufacturer or authorized distributors?
All XOMAP3530BCBB products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XOMAP3530BCBB meets industry standards.
7.What is the process for return or replacement of XOMAP3530BCBB?
All XOMAP3530BCBB units undergo pre-shipment inspection (PSI). If there is an issue with XOMAP3530BCBB, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XOMAP3530BCBB part is unused and in its original packaging.
Return procedure for XOMAP3530BCBB:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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