Texas Instruments XOMAPL137AZKB3

Overview

XOMAPL137AZKB3 from Texas Instruments is a dual-core low-power applications processor integrating a 375/456-MHz ARM926EJ-S RISC MPU and a 375/456-MHz TMS320C674x VLIW DSP on a single die, with 16KB instruction cache, 16KB data cache, and 128KB shared RAM - deployed in professional audio systems requiring real-time audio processing, network streaming, and rich OS support.

For engineers reviewing the XOMAPL137AZKB3 datasheet, XOMAPL137AZKB3 pinout, XOMAPL137AZKB3 application, or XOMAPL137AZKB3 equivalent, key selection criteria include dual-core clock scaling (1.2V/1.3V), EMAC + RMII + MDIO connectivity, triple McASP with FIFO and DIT capability, USB 2.0 OTG + USB 1.1 OHCI integration, and 256-ball ZKB PBGA packaging for high-density embedded audio SoC designs.

Technical Context

The XOMAPL137AZKB3 implements a tightly coupled dual-subsystem architecture: the ARM926EJ-S handles OS services, UI, and peripheral control using ARMv5TEJ instructions, MMU, and 8KB vector RAM, while the C674x DSP executes signal-intensive tasks with IEEE SP/DP floating-point, mixed-precision multiply, and 3648 MIPS / 2736 MFLOPS peak performance at 456 MHz.

Memory hierarchy includes L1P/L1D (32KB each), 256KB unified L2 RAM/cache, 64KB ROM, and dedicated 128KB shared RAM accessible by both cores and EDMA3 - enabling zero-copy audio buffer transfers between McASP peripherals and DSP processing engines without bus contention.

Key Specifications

Pinout & Package

Package: 256-ball Pb-free plastic ball grid array (PBGA), ZKB suffix, 17.0 mm × 17.0 mm body size, 1.0-mm ball pitch.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar dual-core audio SoC applications.

Compared with OMAP-L138AZKHA, XOMAPL137AZKB3 offers identical feature set at fixed 375/456 MHz bins and simplified power sequencing; versus TMS320DM8168ZCEA, it delivers lower power, smaller footprint, and McASP-specific DIT capability critical for pure-audio designs - making XOMAPL137AZKB3 optimal for cost-sensitive, thermally constrained audio endpoints.

Availability

XOMAPL137AZKB3 is available at Aetrix Electronics and suitable for professional audio mixers, A/V receivers, automotive infotainment head units, and network streaming soundbars requiring stable component supply and long-term industrial lifecycle support.

Supply support for XOMAPL137AZKB3 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Texas Instruments is a global semiconductor company headquartered in Dallas, Texas, delivering analog and embedded processing solutions for industrial, automotive, and consumer markets since 1930.

The OMAP-L137 product line was designed specifically for low-power, high-fidelity audio applications - combining ARM software flexibility with C674x DSP computational precision to replace discrete MCU+DSP architectures in A/V and automotive audio systems.

FAQ

What is the maximum supported SDRAM capacity for XOMAPL137AZKB3?

XOMAPL137AZKB3 supports up to 128 MB via EMIFA (16-bit SDRAM) and up to 256 MB via EMIFB (32-bit SDRAM). The EMIFB interface operates at higher bandwidth and is recommended for main application memory, while EMIFA targets NAND/NOR flash and legacy peripherals. Both interfaces are independently configurable in the SYSCFG module.

Does XOMAPL137AZKB3 support secure boot or cryptographic acceleration?

XOMAPL137AZKB3 does not include hardware cryptographic accelerators or secure boot ROM. Boot security relies on external mechanisms such as encrypted image loading via UART/SD/MMC and software-based signature verification in ARM-side bootloader. The device supports JTAG boundary scan and ETB trace for debug, but lacks AES/SHA engines or TRNG found in later TI processors.

Can XOMAPL137AZKB3 run Linux distributions like Ångström or Yocto?

Yes, XOMAPL137AZKB3 is fully supported by TI's Linux SDK (v3.x and earlier) and community Yocto BSP layers. The ARM926EJ-S core with MMU, 16KB caches, and 64KB ROM enables booting u-boot → Linux kernel → userspace with full POSIX compliance. Verified configurations include ALSA audio stack, RTNet for deterministic Ethernet, and Qt-based UI frameworks.

What is the role of the PRUSS in XOMAPL137AZKB3, and how is it accessed?

The Programmable Real-Time Unit Subsystem (PRUSS) in XOMAPL137AZKB3 consists of two independent 32-bit RISC PRU cores, each with 4KB instruction RAM and 512B data RAM. It is accessed via memory-mapped registers from ARM or DSP over the internal interconnect - used for time-critical I/O (e.g., PWM sync, GPIO bit-banging, IR decoding) without CPU intervention or interrupt latency.

Is XOMAPL137AZKB3 pin-compatible with other OMAP-L13x variants like OMAP-L132 or OMAP-L131?

No, XOMAPL137AZKB3 is not pin-compatible with OMAP-L131 or OMAP-L132. While all share the ZKB 256-ball PBGA package, pin functions differ significantly - especially for McASP, EMAC, and USB signals. The OMAP-L137 has unique McASP2 DIT functionality and dual USB PHY routing not present in earlier L13x devices, requiring dedicated PCB layout.