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Texas Instruments XOMAPL137BZKB3
- Part No.:
- XOMAPL137BZKB3
- Manufacturer:
- Texas Instruments
- Category:
- Microprocessors
- Package:
- 256-BGA
- Datasheet:
-
XOMAPL137BZKB3.pdf
- Description:
- IC MPU OMAP-L1X 375MHZ 256BGA
- Quantity:
- Payment:
- Shipping:
Inventory:4,995
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Product details
Overview
XOMAPL137BZKB3 from Texas Instruments is a dual-core low-power applications processor integrating a 375-/456-MHz ARM926EJ-S RISC MPU and a 375-/456-MHz TMS320C674x VLIW DSP on a single die, with 16KB instruction cache, 16KB data cache, 128KB shared RAM, and 256KB L2 unified RAM/cache - deployed in professional audio systems, automotive amplifiers, and network streaming audio endpoints.
For engineers reviewing the XOMAPL137BZKB3 datasheet, XOMAPL137BZKB3 pinout, XOMAPL137BZKB3 application, or XOMAPL137BZKB3 equivalent, key selection criteria include dual-core clock scaling (1.2V/1.3V), EMAC + RMII + MDIO support, triple McASP with FIFO and DIT capability, USB 2.0 OTG + USB 1.1 OHCI integration, and 256-ball ZKB PBGA package compatibility.
Technical Context
The XOMAPL137BZKB3 implements a tightly coupled dual-subsystem architecture: the ARM926EJ-S subsystem provides full MMU-based Linux/RTOS execution with Thumb/ARMv5TEJ instruction support, while the C674x DSP subsystem delivers up to 2736 MFLOPS via two-level cache (32KB L1P, 32KB L1D, 256KB L2) and mixed-precision IEEE SP/DP floating-point arithmetic. Both cores share 128KB of dedicated RAM and access common peripherals through a centralized interconnect.
Peripherals are partitioned across configurable interfaces: EMIFA supports NAND/NOR/SDRAM up to 128MB; EMIFB handles high-speed SDRAM up to 256MB; three McASPs support TDM/I2S/DIT with 28 serializers; EDMA3 provides 32 independent channels plus 8 QDMA channels; and PRUSS adds two programmable real-time units for deterministic I/O control without CPU intervention.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Architecture | Dual-core: ARM926EJ-S + TMS320C674x VLIW DSP - enables concurrent OS execution and real-time signal processing in one SoC. |
| Max Operating Frequency | 456 MHz (at 1.3V) for both ARM and DSP cores - supports high-throughput audio decoding and Ethernet packet handling. |
| On-Chip Memory | 16KB I-Cache + 16KB D-Cache (ARM); 32KB L1P + 32KB L1D + 256KB L2 (DSP); 128KB shared RAM - eliminates external memory dependency for boot and critical buffers. |
| External Memory Interfaces | EMIFA (NAND/NOR/SDRAM) + EMIFB (SDRAM only) - enables flexible storage hierarchy with up to 256MB addressable SDRAM space. |
| Audio Interfaces | 3× McASP with 28 serializers, FIFO, TDM/I2S/DIT support - allows simultaneous multi-channel audio input/output for A/V receivers and soundbars. |
| Connectivity | 10/100 Mbps EMAC with RMII + MDIO; USB 2.0 OTG + USB 1.1 OHCI; 2× I²C; 3× UART (one with RTS/CTS); 2× SPI - provides full networking and peripheral control without external bridges. |
| Real-Time Peripherals | 3× eHRPWM (6 single/dual-edge outputs), 3× eCAP, 2× eQEP, PRUSS with two 32-bit RISC cores - supports motor control, encoder feedback, and deterministic PWM generation in industrial audio systems. |
Pinout & Package
Package: 256-ball Pb-free plastic ball grid array (PBGA), ZKB suffix, 17.00 mm × 17.00 mm body size, 1.0-mm ball pitch - compatible with standard BGA reflow profiles and industrial PCB assembly.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDD_CORE | Core power supply | 1.2V or 1.3V supply for ARM and DSP logic - voltage selection determines max frequency (375 MHz @ 1.2V, 456 MHz @ 1.3V). |
| VDD_IO | I/O power supply | 3.3V supply for general-purpose I/Os; 1.8V required only for USB PHY pins - enables mixed-voltage system interfacing. |
| CLKIN | Primary clock input | Accepts 24–48 MHz crystal or external oscillator - feeds PLL to generate core, memory, and peripheral clocks. |
| USB0_VDDA12 | USB0 analog supply | 1.2V analog supply for integrated USB 2.0 OTG PHY - requires 0.22-μF decoupling capacitor per TI design guidelines. |
| EMAC_RXD[3:0] | Ethernet receive data | 4-bit RMII interface for 10/100 Mbps Ethernet MAC - connects directly to RMII-compliant PHY without MII-to-RMII bridge. |
| MCASP0_AXR[15:0] | McASP0 serial data | 16-bit bidirectional serializer bus for TDM/I2S audio - supports up to 16-channel audio output with programmable frame sync. |
Key Features
| Feature | Design Value |
|---|---|
| Dual-core asymmetric processing | ARM926EJ-S handles OS, UI, and protocol stacks; C674x DSP executes real-time audio codecs (e.g., Dolby Digital, DTS) with <100 μs latency. |
| Triple McASP with DIT capability | McASP2 supports S/PDIF transmit via DIT mode - enables direct digital audio output to external DACs or AV receivers without FPGA glue logic. |
| PRUSS real-time I/O offload | Two independent 32-bit RISC PRU cores handle time-critical GPIO, PWM, and encoder tasks - frees ARM/DSP for higher-layer functions. |
| EDMA3 with QDMA acceleration | 8 quick DMA channels enable zero-CPU-overhead audio buffer transfers between McASP FIFOs and DDR/SDRAM - sustains 192 kHz/24-bit 8-channel streaming. |
| Flexible memory mapping | L2 cache/RAM partitioning allows 128KB as mapped RAM + 128KB as cache - optimizes deterministic latency for control loops and throughput for media buffers. |
Applications
| Professional Audio Mixing Console | Automotive Infotainment Head Unit |
|---|---|
Use Scenario: Real-time multi-track mixing, effects processing, and low-latency monitoring in studio-grade hardware mixers. IC Role / Device Role / Timing Role: XOMAPL137BZKB3 serves as central audio SoC - ARM runs Linux-based mixer GUI and network control; C674x executes FIR/IIR filters, dynamics processing, and sample-rate conversion. Use Value: 2736 MFLOPS DSP performance enables 64-channel 96 kHz mixing with 32 effects instances; triple McASP routes I/O to 48 analog/digital channels. |
Use Scenario: In-vehicle head unit supporting Bluetooth audio, HDMI video, and rear-seat entertainment with voice command integration. IC Role / Device Role / Timing Role: XOMAPL137BZKB3 acts as multimedia hub - ARM hosts Android Automotive OS and CAN gateway; DSP handles acoustic echo cancellation and noise suppression. Use Value: Integrated EMAC + USB OTG enables OTA updates and Wi-Fi tethering; PRUSS manages CAN FD message scheduling and LED driver timing. |
| Network Streaming Audio Endpoint | Home Theatre Receiver |
Use Scenario: High-resolution streaming endpoint decoding MQA, FLAC, and DSD over Ethernet or Wi-Fi (via external module). IC Role / Device Role / Timing Role: XOMAPL137BZKB3 functions as audio decoder and transport controller - ARM parses UPnP/DLNA metadata; DSP performs lossless decode and jitter-free clock recovery. Use Value: 128KB shared RAM buffers network packets; McASP0+1+2 drive dual DACs for stereo + subwoofer + zone 2 outputs simultaneously. |
Use Scenario: 7.1-channel A/V receiver performing Dolby Atmos decoding, HDMI passthrough, and room correction. IC Role / Device Role / Timing Role: XOMAPL137BZKB3 operates as audio processing engine - ARM manages HDMI CEC and IR remote stack; DSP runs Dirac Live calibration and object-based audio rendering. Use Value: Dual EMIF interfaces allow separate SDRAM for video frame buffering and audio processing; eHRPWM controls motorized speaker calibration sensors. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar dual-core audio/video applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| OMAP-L138BZKB3 | Same package and pinout; adds 64KB of on-chip SRAM and enhanced PRUSS with 8KB instruction RAM per PRU - no change to ARM/DSP clock specs or peripheral set. | Preferred for designs requiring deterministic PRU firmware execution or larger local code storage without external memory access. | Select OMAP-L138BZKB3 when PRU-based real-time control complexity exceeds XOMAPL137BZKB3's 4KB/core limit. |
| AM3358BZCZ100 | ARM Cortex-A8 core (1 GHz), no integrated DSP; includes PRU-ICSS but lacks McASP and EMAC RMII; uses 324-ball ZCE package - not pin-compatible. | Better suited for Linux-heavy HMI applications with Ethernet/Wi-Fi connectivity but no high-channel-count audio processing. | Choose AM3358BZCZ100 only if audio processing is offloaded to external DSP or handled via NEON-accelerated software codecs. |
Compared with OMAP-L138BZKB3, XOMAPL137BZKB3 offers identical dual-core performance and peripheral integration at lower cost and power, while AM3358BZCZ100 trades DSP capability for higher ARM throughput and modern ARMv7 features - making XOMAPL137BZKB3 optimal for fixed-function audio SoCs where hardware-accelerated signal processing is mandatory.
Availability
XOMAPL137BZKB3 is available at Aetrix Electronics and suitable for professional audio mixing consoles, automotive infotainment head units, and network streaming audio endpoints requiring stable component supply across extended product lifecycles.
Supply support for XOMAPL137BZKB3 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Texas Instruments is a global semiconductor company headquartered in Dallas, Texas, delivering analog and embedded processing solutions for industrial, automotive, and consumer markets since 1930.
XOMAPL137BZKB3 belongs to TI's OMAP-L13x low-power applications processor family, designed specifically for cost-sensitive, thermally constrained audio/video systems requiring integrated DSP acceleration and rich peripheral connectivity without external co-processors.
FAQ
What is the maximum operating frequency of the XOMAPL137BZKB3 and under what conditions?
The XOMAPL137BZKB3 operates at up to 456 MHz for both the ARM926EJ-S and C674x DSP cores when supplied with a 1.3V core voltage and within the commercial temperature range. At 1.2V, the maximum frequency is 375 MHz. These ratings are validated per TI's SPRS563G datasheet Section 3.1 and require adherence to specified power sequencing and thermal derating curves.
Does the XOMAPL137BZKB3 support boot from NAND flash, and which interfaces are used?
Yes, the XOMAPL137BZKB3 supports NAND flash boot via its EMIFA interface, which natively handles 8-bit or 16-bit NAND devices with hardware ECC. Boot mode is selected using strap pins (SYSBOOT[4:0]), and the internal ROM bootloader initializes NAND, copies first-stage loader to internal RAM, then executes it - all without external configuration.
How many McASP interfaces does the XOMAPL137BZKB3 include, and what audio protocols do they support?
The XOMAPL137BZKB3 integrates three multichannel audio serial ports (McASP0, McASP1, McASP2), each supporting TDM, I2S, and similar formats. McASP2 additionally supports DIT (Digital Interface Transmitter) mode for S/PDIF output. Each McASP provides up to 16 serializers, configurable FIFOs, and clock zone independence - enabling simultaneous multi-format audio I/O.
Is the XOMAPL137BZKB3 pin-compatible with other OMAP-L13x variants such as the OMAP-L138?
Yes, the XOMAPL137BZKB3 is pin-compatible with the OMAP-L138BZKB3 in the 256-ball ZKB PBGA package. They share identical ball map, power domains, and peripheral pin assignments - allowing drop-in replacement where enhanced PRUSS or additional on-chip SRAM are not required.
What development tools are officially supported for the XOMAPL137BZKB3?
Texas Instruments provides full toolchain support for XOMAPL137BZKB3, including Code Composer Studio v5+ IDE, C6000 compiler v7.4+, ARM compiler v5.0+, Chip Support Library, DSP/BIOS RTOS, and the OMAP-L137 Technical Reference Manual. TI also supplies reference schematics, layout guidelines, and EVM firmware images for rapid prototyping.
XOMAPL137BZKB3 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Texas Instruments
- Package/Case:
- 256-BGA
- Series:
- OMAP-L1x
- Packaging:
- Tray
- Product Status:
- Obsolete
- Core Processor:
- ARM926EJ-S
- Number of Cores/Bus Width:
- 1 Core, 32-Bit
- Speed:
- 375MHz
- Co-Processors/DSP:
- Signal Processing; C674x, System Control; CP15
- RAM Controllers:
- SDRAM
- Graphics Acceleration:
- No
- Display & Interface Controllers:
- LCD
- Ethernet:
- 10/100Mbps (1)
- SATA:
- -
- USB:
- USB 1.1 + PHY (1), USB 2.0 + PHY (1)
- Voltage - I/O:
- 1.8V, 3.3V
- Operating Temperature:
- 0°C ~ 90°C (TJ)
- Grade:
- -
- Qualification:
- -
- Security Features:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 256-BGA (17x17)
- Additional Interfaces:
- HPI, I2C, McASP, MMC/SD, SPI, UART
XOMAPL137BZKB3 FAQ
1.How can I place an order for XOMAPL137BZKB3 through Aetrix?
Please submit a Request for Quotation (RFQ) for XOMAPL137BZKB3 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XOMAPL137BZKB3 reliable?
The price and inventory of XOMAPL137BZKB3 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XOMAPL137BZKB3 is usually 5 days.
3.What payment methods are accepted for XOMAPL137BZKB3?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XOMAPL137BZKB3 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XOMAPL137BZKB3?
XOMAPL137BZKB3 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XOMAPL137BZKB3 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XOMAPL137BZKB3?
For technical support, including XOMAPL137BZKB3 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XOMAPL137BZKB3 requirements.
6.How does Aetrix verify that XOMAPL137BZKB3 is sourced from the original manufacturer or authorized distributors?
All XOMAPL137BZKB3 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XOMAPL137BZKB3 meets industry standards.
7.What is the process for return or replacement of XOMAPL137BZKB3?
All XOMAPL137BZKB3 units undergo pre-shipment inspection (PSI). If there is an issue with XOMAPL137BZKB3, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XOMAPL137BZKB3 part is unused and in its original packaging.
Return procedure for XOMAPL137BZKB3:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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