NXP Semiconductors XPC8240LVV200E

Overview

XPC8240LVV200E from Freescale Semiconductor is a 32-bit PowerPC™ integrated processor combining an MPC603e superscalar core with a PCI 2.1-compliant bridge, memory controller, DMA engine, I²C and I²O controllers, and programmable interrupt controller. It operates at up to 200 MHz CPU frequency, supports 32-/64-bit DRAM/SDRAM (up to 1 GB), and delivers 2.5 V core / 3.3 V I/O power operation in a 352-pin TBGA package. It serves as a PCI host or agent in embedded telecom, networking, and industrial control systems.

For engineers reviewing the XPC8240LVV200E datasheet, XPC8240LVV200E pinout, XPC8240LVV200E application, or XPC8240LVV200E equivalent, key selection considerations include its dual-PLL clock architecture enabling independent core/peripheral logic frequencies, support for ECC/parity memory interfaces, PCI 5.0-V tolerance, and dynamic power management modes (nap/doze/sleep) verified at 200 MHz operation.

Technical Context

The XPC8240LVV200E integrates a 32-bit MPC603e core with 16 KB instruction and 16 KB data caches, floating-point unit, and MMU, coupled to peripheral logic via a dedicated 64-bit internal bus. Core and peripheral logic operate on separate PLLs-core PLL referenced to peripheral PLL-enabling asynchronous frequency scaling while maintaining synchronous bus timing.

Its peripheral logic includes a 32-bit, 66 MHz PCI interface compliant with PCI Local Bus Specification Rev 2.1; a configurable memory controller supporting FPM/EDO/SDRAM with ECC or parity; a two-channel DMA controller with scatter-gather capability; and integrated clock generation for PCI, SDRAM, and CPU domains. All I/O drivers are programmable (DRV_STD/DRV_PCI/DRV_MEM_DATA) with defined impedance and current drive per signal class.

Key Specifications

Pinout & Package

Package: 352-pin TBGA (27 mm × 27 mm, 1.27 mm ball pitch), RoHS-compliant, lead-free solder compatible. Thermal pad on underside for enhanced heat dissipation.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar integrated processor applications.

Compared with XPC8240LVV200E, the MPC8245LVV266E offers higher clock performance in identical packaging but increases power and signal integrity demands, while the MPC8260AZUUPEA introduces architectural divergence with communications acceleration at the cost of mechanical and electrical redesign.

Availability

XPC8240LVV200E is available at Aetrix Electronics and suitable for telecom line cards, industrial PLC controllers, network security appliances, and medical imaging subsystems requiring stable component supply across extended product lifecycles.

Supply support for XPC8240LVV200E includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Freescale Semiconductor (now part of NXP Semiconductors) is a fabless semiconductor company specializing in embedded processing, connectivity, and analog solutions for automotive, industrial, and networking markets.

The MPC8240 family was designed as Freescale's first PowerPC-based integrated processor targeting cost-sensitive, high-reliability embedded systems requiring PCI connectivity, memory management, and real-time interrupt handling without external glue logic.

FAQ

What is the maximum guaranteed operating frequency of the XPC8240LVV200E?

The XPC8240LVV200E is rated and tested for guaranteed operation at up to 200 MHz CPU frequency. This speed grade corresponds to a PCI_SYNC_IN input of 66 MHz and specific PLL_CFG[0:4] configuration bits. Operation beyond 200 MHz is not characterized or supported for this part number; the MPC8245LVV266E is the next speed grade in the family.

Does the XPC8240LVV200E support both 3.3 V and 5.0 V PCI signaling?

Yes, the XPC8240LVV200E supports 5.0-V tolerant PCI I/O buffers. Its OVDD supply is specified at 3.3 V ± 0.3 V, but PCI input pins (e.g., PCI_AD[31:0], PCI_CBE[3:0]) accept voltages up to 5.75 V when LVDD = 5.0 V, complying with PCI Local Bus Specification Rev 2.1 for mixed-voltage systems.

How does the dual-PLL architecture of the XPC8240LVV200E benefit system design?

The XPC8240LVV200E uses separate PLLs for the MPC603e core and peripheral logic, allowing independent clock domain scaling-for example, running the CPU at 200 MHz while the memory bus operates at 100 MHz and PCI at 66 MHz. This optimizes performance-per-watt and simplifies timing closure by decoupling critical paths.

Can the XPC8240LVV200E operate in low-power modes, and what are their typical power draws?

Yes, the XPC8240LVV200E supports nap (667 mW), doze (1.8–2.1 W), and sleep (477–762 mW) modes. These states reduce dynamic power significantly versus full operation (3.0 W typical at 200 MHz). Entry/exit is controlled via MSR[WE] and HID0 register bits, with hardware-enforced sequencing verified across the 0–105 °C junction range.

What memory technologies and configurations does the XPC8240LVV200E support through its integrated controller?

The XPC8240LVV200E memory controller supports FPM DRAM, EDO DRAM, and SDRAM across 1–8 banks of 4-, 16-, 64-, or 128-Mbit devices, accommodating 1 MB to 1 GB total capacity. It implements ECC or parity protection, write buffering, and programmable timing-enabling reliable, high-bandwidth access to DDR-capable SDRAM subsystems.