NXP Semiconductors XPC8240RVV250E
- Part No.:
- XPC8240RVV250E
- Manufacturer:
- NXP Semiconductors
- Category:
- Microprocessors
- Package:
- 352-LBGA
- Datasheet:
-
XPC8240RVV250E.pdf
- Description:
- IC MPU MPC82XX 250MHZ 352TBGA
- Quantity:
- Payment:

- Shipping:

Inventory:2,385
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
XPC8240RVV250E from Freescale Semiconductor is a 250 MHz integrated PowerPC processor with MPC603e core, dual PLL architecture (CPU and peripheral/memory bus), 2.625 V ±125 mV core supply, and TBGA package optimized for embedded control in PCI-based industrial systems requiring deterministic real-time response and memory coherency.
For engineers reviewing the XPC8240RVV250E datasheet, XPC8240RVV250E pinout, XPC8240RVV250E application, or XPC8240RVV250E equivalent, this part supports 66 MHz PCI bus operation, 100 MHz memory bus, and 250 MHz CPU clock via configurable PLL_CFG[0:4] inputs - critical for legacy PCI-to-embedded bridge designs, telecom line cards, and industrial automation controllers where voltage tolerance, thermal range (0–105°C), and power management modes (Doze/Nap/Sleep) are design-critical.
Technical Context
The XPC8240RVV250E implements two independent PLLs: one for CPU clock generation (memory-to-CPU multiplier up to 4×) and another for peripheral/memory bus clocking (PCI-to-memory multiplier up to 3×), both configured via five-pin PLL_CFG[0:4] strap inputs. It retains full MPC8240 instruction set compatibility and integrates EPIC (Embedded Performance Interface Controller) for PCI host bridge functionality.
It operates within a die-junction temperature range of 0–105°C and requires four distinct supply domains: VDD/AVDD/AVDD2/LAVDD at 2.625 V ±5%, OVDD at 3.3 V ±0.3 V, GVDD at 3.3 V ±5%, and LVDD at either 3.3 V or 5.0 V ±5%. LVDD-tolerant inputs include PCI interface, EPIC control, and OSC_IN signals.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Frequency | 250 MHz - fixed maximum operating frequency confirmed for XPC8240RVV250E; enables high-throughput real-time processing in PCI-hosted embedded systems. |
| Core Supply Voltage | 2.625 V ±125 mV DC - precise low-voltage rail required for stable 250 MHz operation; deviation beyond ±5% invalidates timing guarantees. |
| Operating Temperature | 0 to 105°C junction - supports deployment in uncontrolled industrial enclosures without active cooling. |
| Power Consumption (Typical) | 3.7 W at 66/100/250 MHz (PCI/Mem/CPU) - measured with dynamic power management enabled and cache-resident FP load; includes VDD, AVDD, AVDD2, LAVDD only. |
| Power Saving Modes | Doze (2.6 W), Nap (900 mW), Sleep (500 mW) - hardware-controlled low-power states reducing total system energy without software intervention. |
| PCI Interface | 32-bit, 33/66 MHz compliant - supports standard PCI v2.2 signaling with LVDD input-tolerant I/O pins enabling mixed-voltage backplane integration. |
| Package | 324-pin TBGA (ZU suffix) - lead-free, thermally enhanced ball grid array with defined thermal pad layout per Freescale mechanical drawings. |
Pinout & Package
Package: 324-pin TBGA (ZU), RoHS-compliant, lead-free, with thermal pad on underside. Dimensions and land pattern match Freescale specification MPC8240RZUPNS.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| PLL_CFG[0:4] | Strap Inputs | Five dedicated pins setting PLL multipliers at power-on reset; determines CPU and memory bus frequencies; no runtime reconfiguration. |
| VDD / AVDD / AVDD2 / LAVDD | Core & PLL Supplies | Four separate 2.625 V supply pins - must be independently decoupled; violation of inter-supply voltage limits (>±0.6 V) risks latch-up. |
| OVDD / GVDD | I/O Supplies | 3.3 V supplies for PCI and memory bus drivers; OVDD powers PCI transceivers; GVDD drives SDRAM interface; each requires local bulk + high-frequency decoupling. |
| LVDD | Reference Supply | 5.0 V or 3.3 V reference for PCI signaling; input-tolerant pins (PCI, EPIC, OSC_IN) withstand LVDD + 0.5 V - enables safe hot-swap and mixed-voltage backplanes. |
| PCI_SYNC_IN | PCI Clock Input | Accepts 25–56 MHz input; directly clocks internal logic in PLL bypass mode; used as reference for both PLL VCOs in normal operation. |
Key Features
| Feature | Design Value |
|---|---|
| Dual Independent PLLs | Separate CPU and memory/peripheral PLLs allow asynchronous scaling - e.g., 66 MHz PCI, 100 MHz SDRAM, 250 MHz CPU - eliminating clock domain bottlenecks. |
| EPIC Integrated PCI Host Bridge | Full PCI v2.2 host controller with programmable BARs, latency timers, and interrupt mapping - eliminates need for external bridge IC in compact designs. |
| Hardware Power Management | Three autonomous low-power states (Doze/Nap/Sleep) triggered by software or hardware events - reduces average power by >70% during idle without OS modification. |
| LVDD-Tolerant I/O | PCI, EPIC control, and OSC_IN pins tolerate LVDD + 0.5 V - supports interoperability with 5 V or 3.3 V backplanes and simplifies level-shifting design. |
| Thermal Range Compliance | Validated operation from 0°C to 105°C junction temperature - qualified for fanless industrial control cabinets and telecom equipment operating in extended ambient conditions. |
Applications
| Industrial PLC Backplane Controller | Telecom Line Card Host Processor |
|---|---|
|
Use Scenario: Real-time motion control and I/O scanning across modular chassis using PCI-based backplane with deterministic latency. IC Role / Device Role / Timing Role: Primary host processor executing ladder logic and managing PCI-to-local-bus bridging via integrated EPIC. Use Value: 250 MHz CPU clock and 100 MHz memory bus enable sub-millisecond scan cycles; LVDD-tolerant PCI interface ensures robustness in noisy factory environments. |
Use Scenario: Protocol processing and packet forwarding on E1/T1 line cards with PCI-connected DSPs and PHYs. IC Role / Device Role / Timing Role: PCI host controller and real-time scheduler coordinating multiple time-critical peripherals over shared PCI bus. Use Value: Dual PLL architecture isolates CPU timing from variable PCI traffic; Nap mode reduces standby power to 900 mW during low-traffic periods. |
| Legacy Embedded Server Management | Ruggedized Network Appliance |
|
Use Scenario: Out-of-band management engine in blade servers using PCI-connected IPMI controllers and flash storage. IC Role / Device Role / Timing Role: Dedicated management processor handling watchdog, sensor polling, and firmware updates independent of main CPU. Use Value: 0–105°C operation supports deployment in high-temperature server bays; Sleep mode draws only 500 mW for always-on monitoring. |
Use Scenario: Secure gateway in transportation infrastructure with vibration, wide temperature swings, and long service life requirements. IC Role / Device Role / Timing Role: Central control unit running Linux-based firewall stack while interfacing to CAN, serial, and Ethernet via PCI expansion. Use Value: TBGA package provides mechanical reliability under shock/vibration; 2.625 V core supply improves noise immunity in electrically harsh environments. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar integrated processor applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MPC8245RZUP250B | Same 250 MHz CPU, but uses 2.5 V ±100 mV core supply; different PLL_CFG encoding; higher typical power (4.2 W). | Designed for newer PCB layouts with tighter voltage regulation; lacks LVDD-tolerant OSC_IN pin. | Select when migrating from XPC8240RVV250E to production-grade MPC8245 with updated qualification data and longer lifecycle support. |
| PQ3868ALV250B | 250 MHz PowerQUICC III derivative; integrates QUICC Engine for offloading protocol processing; 1.25 V core; different pinout and memory interface. | Targeted at communications applications requiring integrated HDLC, USB, or Ethernet MACs - not drop-in compatible. | Choose when adding packet processing acceleration is required and board redesign is acceptable; not suitable for direct replacement. |
Compared with MPC8245RZUP250B and PQ3868ALV250B, the XPC8240RVV250E offers unique LVDD-tolerant I/O and proven thermal performance in legacy PCI chassis, making it optimal for sustaining existing industrial designs where voltage margin and backward compatibility are non-negotiable.
Availability
XPC8240RVV250E is available at Aetrix Electronics and suitable for industrial PLC backplane controllers, telecom line card hosts, legacy server management modules, and ruggedized network appliances requiring stable component supply across extended product lifecycles.
Supply support for XPC8240RVV250E includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Freescale Semiconductor (now part of NXP Semiconductors) was a leading designer of embedded processors and analog/mixed-signal ICs, specializing in automotive, industrial, and networking solutions before its 2015 acquisition.
The XPC8240RVV250E belongs to the MPC824x family of integrated PCI host processors targeting cost-sensitive, thermally constrained embedded systems needing deterministic real-time performance without external bridge logic.
FAQ
What is the maximum guaranteed CPU frequency for XPC8240RVV250E?
The XPC8240RVV250E is characterized and tested for guaranteed operation at 250 MHz CPU frequency under all recommended operating conditions - including 2.625 V ±125 mV core supply and 0–105°C junction temperature. This frequency is fixed by mask option and cannot be overclocked; higher frequencies require different part numbers such as XPC8240RZU250E (same spec, alternate marking).
Does XPC8240RVV250E support PCI 66 MHz operation?
Yes, XPC8240RVV250E supports 66 MHz PCI bus operation as confirmed in Table 18 (Ref. No. E, C, 1C, 1D) with valid PLL_CFG[0:4] configurations. The device meets PCI v2.2 electrical specifications when OVDD = 3.3 V ±0.3 V and LVDD = 3.3 V or 5.0 V ±5%, and requires proper termination and trace length matching per Freescale's MPC8240RZUPNS layout guidelines.
What power management modes does XPC8240RVV250E support?
XPC8240RVV250E supports three hardware-initiated power saving modes: Doze (2.6 W typical), Nap (900 mW), and Sleep (500 mW). These are entered via EPIC register writes and reduce dynamic power by gating clocks to non-essential blocks while preserving register and cache state - enabling rapid wake-up (<1 µs) without software reinitialization. All modes are validated across the full 0–105°C range.
Is XPC8240RVV250E pin-compatible with other MPC8240 variants?
No, XPC8240RVV250E is not pin-compatible with standard MPC8240RZU250E or MPC8245 parts due to differences in supply pin allocation and thermal pad configuration. While both use 324-pin TBGA packages, the VDD/AVDD/AVDD2/LAVDD pin assignments and decoupling requirements differ per revision - PCB layout must follow Freescale's XPC8240RVV250E-specific mechanical drawing and power sequencing diagram.
What does the 'X' prefix signify in XPC8240RVV250E?
The 'X' prefix in XPC8240RVV250E indicates a pilot production prototype per Freescale SOP 3-13 - meaning it is a limited-volume release with preliminary reliability data, subject to change before final qualification. Customers must obtain written authorization acknowledging this status prior to integration; design-in should include margin for potential spec revisions or mask changes affecting timing or power behavior.
XPC8240RVV250E Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Package/Case:
- 352-LBGA
- Series:
- MPC82xx
- Packaging:
- Tray
- Product Status:
- Obsolete
- Core Processor:
- PowerPC 603e
- Number of Cores/Bus Width:
- 1 Core, 32-Bit
- Speed:
- 250MHz
- Co-Processors/DSP:
- -
- RAM Controllers:
- DRAM, SDRAM
- Graphics Acceleration:
- No
- Display & Interface Controllers:
- -
- Ethernet:
- -
- SATA:
- -
- USB:
- -
- Voltage - I/O:
- 3.3V
- Operating Temperature:
- 0°C ~ 105°C (TA)
- Grade:
- -
- Qualification:
- -
- Security Features:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 352-TBGA (35x35)
- Additional Interfaces:
- I2C, I²O, PCI, UART
XPC8240RVV250E FAQ
1.How can I place an order for XPC8240RVV250E through Aetrix?
Please submit a Request for Quotation (RFQ) for XPC8240RVV250E on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XPC8240RVV250E reliable?
The price and inventory of XPC8240RVV250E are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XPC8240RVV250E is usually 5 days.
3.What payment methods are accepted for XPC8240RVV250E?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XPC8240RVV250E transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XPC8240RVV250E?
XPC8240RVV250E orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XPC8240RVV250E order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XPC8240RVV250E?
For technical support, including XPC8240RVV250E datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XPC8240RVV250E requirements.
6.How does Aetrix verify that XPC8240RVV250E is sourced from the original manufacturer or authorized distributors?
All XPC8240RVV250E products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XPC8240RVV250E meets industry standards.
7.What is the process for return or replacement of XPC8240RVV250E?
All XPC8240RVV250E units undergo pre-shipment inspection (PSI). If there is an issue with XPC8240RVV250E, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XPC8240RVV250E part is unused and in its original packaging.
Return procedure for XPC8240RVV250E:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
XPC8240RVV250E Tags

-
AT91SAM9260B-CU-999
Microchip Technology

-
AT91SAM9G25-CU
Microchip Technology

-
ATSAMA5D27C-CU
Microchip Technology

-
AT91SAM9X35-CU
Microchip Technology

-
AT91SAM9X25-CU
Microchip Technology

-
MCIMX6Y2CVM08AB
NXP Semiconductors
-
AM3352BZCZ100
Texas Instruments

-
AT91SAM9260B-CU
Microchip Technology

-
AT91SAM9260B-QU
Microchip Technology

-
ATSAMA5D31A-CU
Microchip Technology

-
AT91SAM9G20B-CU-999
Microchip Technology

-
MCIMX6Y2CVM05AB
NXP Semiconductors
Tech Hub
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…

