NXP Semiconductors XPC8240RZU250E

Overview

XPC8240RZU250E from Freescale Semiconductor is a 250 MHz integrated PowerPC processor with MPC603e core, dual PLL architecture (CPU and peripheral/memory bus), 2.625 V ±125 mV core supply, and TBGA package optimized for embedded control applications requiring PCI-to-memory-to-CPU clock domain bridging.

For engineers reviewing the XPC8240RZU250E datasheet, XPC8240RZU250E pinout, XPC8240RZU250E application, or XPC8240RZU250E equivalent, key selection criteria include verified 250 MHz CPU operation under 0–105°C junction temperature, PLL_CFG[0:4]-driven frequency configuration, and compatibility with 33/66 MHz PCI Sync input and 100 MHz memory bus timing.

Technical Context

The XPC8240RZU250E implements two independent PLLs: one for CPU clock generation (memory-to-CPU multiplier up to 4×) and another for peripheral/memory bus clocking (PCI-to-memory multiplier up to 3×), both configurable via PLL_CFG[0:4] pins. It supports PLL bypass mode for hardware modeling and clock-off mode for full power-down.

It operates across 0–105°C die-junction temperature with five dedicated power domains: VDD/AVDD/AVDD2/LAVDD at 2.625 V ±5%, OVDD at 3.3 V ±0.3 V, and GVDD at 3.3 V ±5%. LVDD supports dual 3.3 V or 5.0 V reference with input-tolerant signals on PCI, EPIC control, and OSC_IN.

Key Specifications

Pinout & Package

Package: 484-ball TBGA (Thin Ball Grid Array), RoHS-compliant, marked "XPC8240RZU250E" with revision ID 0x13.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar integrated processor applications.

Compared with MPC8245RZUP250C and MPC8240RVV250E, the XPC8240RZU250E uniquely combines extended 0–105°C operation, TBGA packaging for improved thermal dissipation, and pilot-production readiness for early-system integration-making it optimal for ruggedized, thermally constrained embedded platforms.

Availability

XPC8240RZU250E is available at Aetrix Electronics and suitable for industrial control gateways, telecom line cards, medical imaging subsystems, and ruggedized data acquisition requiring stable component supply through design-in and volume production phases.

Supply support for XPC8240RZU250E includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Freescale Semiconductor (now part of NXP Semiconductors) was a leading designer of embedded processors, analog, and connectivity solutions for automotive, industrial, and networking markets.

The MPC8240 product line delivers integrated PowerPC-based system-on-chip solutions targeting PCI-based embedded control applications with tight thermal and power constraints.

FAQ

What does the "X" prefix in XPC8240RZU250E signify?

The "X" prefix in XPC8240RZU250E indicates a pilot production prototype per Freescale SOP 3-13: a limited-volume run manufactured and tested on qualified technology with preliminary reliability data. Customers must provide written authorization before deployment, acknowledging potential for product changes during shipment.

What PLL configuration is required to achieve 250 MHz CPU operation on XPC8240RZU250E?

XPC8240RZU250E achieves 250 MHz CPU operation using PLL_CFG[0:4] = 01110 (Ref. No. E), which configures the memory bus at 100 MHz and applies a 2.5× CPU VCO multiplier to a 100 MHz memory clock. This setting is validated for 25–41 MHz PCI_SYNC_IN input.

Is XPC8240RZU250E compatible with standard 3.3 V PCI signaling?

Yes, XPC8240RZU250E supports standard 3.3 V PCI signaling via its OVDD supply (3.3 V ±0.3 V) and LVDD-referenced input-tolerant pins. The PCI interface signals tolerate up to 3.6 V input when LVDD is set to 3.3 V, meeting PCI Local Bus Specification 2.2 requirements.

How does the power consumption of XPC8240RZU250E compare across operating modes?

XPC8240RZU250E draws 3.7 W typical at 33/100/250 MHz (PCI/Mem/CPU), drops to 2.6 W in Doze mode, 900 mW in Nap mode, and 500–800 mW in Sleep mode depending on clock enable states-enabling dynamic power management in thermally constrained systems.

What package and marking details identify XPC8240RZU250E?

XPC8240RZU250E uses a 484-ball TBGA package with lead-free finish. Marking includes "XPC8240RZU250E", 6-digit mask number (MMMMMM), and traceability code (ATWLYYWWA); revision ID 0x13 is readable from address offset 0x08.