NXP Semiconductors XPC8260CVVIFBC

Overview

XPC8260CVVIFBC from Freescale Semiconductor is a PowerQUICC II integrated communications processor featuring a dual-issue EC603e core (133–200 MHz), 16-Kbyte I/D caches, and a dedicated 32-bit RISC communications processor module (CPM). It integrates FCCs for 10/100-Mbit Ethernet via MII, SCCs for HDLC/UART/SDLC, and TDM interfaces supporting ISDN/T1/E1 - deployed in telecom access gateways, industrial protocol converters, and legacy WAN edge routers.

For engineers reviewing the XPC8260CVVIFBC datasheet, XPC8260CVVIFBC pinout, XPC8260CVVIFBC application, or XPC8260CVVIFBC equivalent, this page delivers verified electrical specs (VDD = 2.4–2.7 V, VDDH = 3.135–3.465 V), thermal resistance (θJA = 7.78 °C/W, 4-layer board), clock configuration modes (up to 200 MHz core / 166 MHz CPM), and validated alternative parts for migration planning.

Technical Context

The XPC8260CVVIFBC implements a split-architecture design: the G2 core handles general-purpose processing with MMU and FPU support, while the autonomous CPM offloads serial communications using 24-Kbyte dual-port RAM and virtual DMA. Core and CPM operate on independent PLLs, enabling asynchronous frequency scaling (e.g., 200 MHz core + 133 MHz CPM).

It supports three bus domains: a 64-bit 60x bus (up to 66 MHz) with ECC/parity, a 32-bit local bus (up to 66 MHz), and memory controllers for SDRAM/Flash/SRAM. Pin multiplexing is managed via MODCK[1–3] and RSTCONF during HRESET assertion, defining 57 distinct clock configurations per Table 13.

Key Specifications

Pinout & Package

Package: 480-pin TBGA (35 mm × 35 mm, 1.27 mm pitch), RoHS-compliant, thermal pad exposed on underside.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar integrated communications processor applications.

Compared with MPC8272CZQHBB and MPC8360EVRAGDB, the XPC8260CVVIFBC offers proven TDM/HDLC integration and lower power at <200 MHz, making it optimal for cost-sensitive, protocol-diverse legacy infrastructure where CPM determinism is critical.

Availability

XPC8260CVVIFBC is available at Aetrix Electronics and suitable for telecom access gateways, industrial protocol converters, and legacy WAN edge routers requiring stable component supply across extended product lifecycles.

Supply support for XPC8260CVVIFBC includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Freescale Semiconductor (now part of NXP Semiconductors) specialized in high-performance embedded processors for networking and automotive applications before its 2015 acquisition.

The PowerQUICC II family, including XPC8260CVVIFBC, was engineered for carrier-grade communications equipment requiring deterministic serial protocol handling alongside general-purpose computing - targeting DSLAMs, base station controllers, and enterprise routers.

FAQ

What is the maximum allowable junction temperature for XPC8260CVVIFBC?

The absolute maximum junction temperature for XPC8260CVVIFBC is 120 °C, but the recommended operational limit is 105 °C per Table 2. Exceeding 105 °C risks timing violations and accelerated electromigration; thermal design must ensure TJ ≤ 105 °C under worst-case ambient and load conditions. The XPC8260CVVIFBC datasheet specifies θJA = 7.78 °C/W for 4-layer boards with 1 m/s airflow - use this value to calculate required heatsink size.

Does XPC8260CVVIFBC support DDR SDRAM?

No, XPC8260CVVIFBC does not support DDR SDRAM. Its memory controller is designed for SDR SDRAM, SRAM, Flash, EPROM, and DRAM only - as confirmed in Section 1 ("Features") and Table 12 ("Memory Controller"). DDR support was introduced in later PowerQUICC III (MPC85xx) and QorIQ families. Using DDR with XPC8260CVVIFBC is electrically and logically incompatible.

How many Ethernet MACs does XPC8260CVVIFBC integrate?

XPC8260CVVIFBC integrates three Fast Communications Controllers (FCC1–FCC3), each capable of implementing a full-duplex 10/100-Mbit Ethernet MAC via MII interface. FCC1 and FCC2 support IEEE 802.3 CSMA/CD; FCC3 adds UTOPIA Level 1 support for ATM segmentation/reassembly. All three operate independently and concurrently - confirmed in Figure 1 and Section 1 "Features".

Can XPC8260CVVIFBC operate in slave mode to an external processor?

Yes, XPC8260CVVIFBC supports slave mode operation. Section 1 "Features" explicitly states: "CPU core can be disabled and the device can be used in slave mode to an external core." In this mode, the G2 core is powered down while the CPM remains active, allowing the XPC8260CVVIFBC to function solely as a communications coprocessor - ideal for systems with a primary application processor handling OS tasks.

What clock sources are required for XPC8260CVVIFBC operation?

XPC8260CVVIFBC requires one primary clock source: a 33 MHz or 66 MHz oscillator/crystal connected to CLKIN. This single reference feeds both the G2 core PLL and CPM PLL, with multiplication ratios set by MODCK[1–3] pins during HRESET. No secondary clock is needed for basic operation - though optional external clocks may be applied to FCC/SCC/SMC peripherals via dedicated input pins (e.g., BRG_IN) for specific protocol timing.