NXP Semiconductors XPC8260CZUHFBC

Overview

XPC8260CZUHFBC from Freescale Semiconductor is a PowerQUICC II integrated communications processor featuring a dual-issue EC603e-derived G2 core (133–200 MHz), a dedicated 32-bit RISC communications processor module (CPM), and integrated memory controller supporting SRAM, SDRAM, Flash, and EPROM. It delivers 280 Dhrystone MIPS at 200 MHz and includes three fast communications controllers (FCCs), four serial communications controllers (SCCs), two serial management controllers (SMCs), SPI, I²C, and eight TDM interfaces - deployed in telecom access equipment, enterprise routers, and industrial protocol gateways.

For engineers reviewing the XPC8260CZUHFBC datasheet, XPC8260CZUHFBC pinout, XPC8260CZUHFBC application, or XPC8260CZUHFBC equivalent, key selection criteria include its 64-bit 60x bus with ECC/parity support, independent G2 core and CPM PLLs enabling asynchronous clock domain operation, 24 KB dual-port RAM for core-CPM data exchange, and hardware acceleration for HDLC, ATM SAR, Ethernet MII, and TDM protocols.

Technical Context

The XPC8260CZUHFBC implements a split-architecture design: the G2 core handles general-purpose processing and system control, while the autonomous CPM offloads time-critical serial communications tasks using its own 24 KB dual-port RAM and dedicated instruction ROM. Core and CPM operate on separate PLLs, allowing independent frequency scaling (e.g., 200 MHz core / 133 MHz CPM) to optimize power versus throughput.

Its memory subsystem integrates a twelve-bank controller with glueless support for multiple DRAM/SRAM/Flash types, programmable bank sizing, and byte-select logic for both 64-bit 60x and 32-bit local buses. The SIU provides clock synthesis, JTAG test access, RTC, watchdog, and IEEE 1149.1 boundary-scan - all essential for carrier-grade embedded networking platforms.

Key Specifications

Pinout & Package

Package: 480-pin TBGA (Thin Ball Grid Array), 27 mm × 27 mm, 1.0 mm ball pitch, RoHS-compliant. Thermal resistance θJA = 7.78 °C/W (4-layer board, 1 m/s airflow).

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar integrated communications processor applications.

Compared with MPC8272CZUHFBC and MPC8360EVRAGDB, the XPC8260CZUHFBC offers the most direct hardware continuity for existing PowerQUICC II CPM-based firmware, lowest BOM cost in volume production, and proven thermal reliability in convection-cooled 1RU chassis - making it the preferred choice for sustaining engineering and long-lifecycle deployments.

Availability

XPC8260CZUHFBC is available at Aetrix Electronics and suitable for telecom access nodes, industrial protocol gateways, and enterprise edge routers requiring stable component supply across extended product lifecycles.

Supply support for XPC8260CZUHFBC includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Freescale Semiconductor (now part of NXP Semiconductors) is a fabless semiconductor company specializing in embedded processing, connectivity, and analog solutions for automotive, industrial, and networking markets.

The XPC8260CZUHFBC belongs to the PowerQUICC II family - designed specifically for carrier-class communications infrastructure requiring hardware-accelerated serial protocol handling, deterministic real-time response, and long-term industrial temperature support.

FAQ

What is the maximum supported core frequency for the XPC8260CZUHFBC?

The XPC8260CZUHFBC supports a maximum G2 core frequency of 200 MHz, achievable via PLL configuration using MODCK[1–3] pins and a 66 MHz input clock with a 3× core multiplier. This is validated across the full industrial temperature range (–40 °C to +105 °C junction) and specified in the MPC8260EC Rev. 2 datasheet Table 12. Operation above 200 MHz is not guaranteed and may violate timing margins.

Does the XPC8260CZUHFBC include hardware support for Ethernet MAC functionality?

Yes, the XPC8260CZUHFBC integrates three Fast Communications Controllers (FCCs), each capable of full-duplex 10/100-Mbit Ethernet MAC operation via Media Independent Interface (MII). Each FCC supports IEEE 802.3 CSMA/CD, automatic padding/CRC generation, and flow control - eliminating the need for external Ethernet PHYs in basic implementations.

Can the XPC8260CZUHFBC operate with its G2 core disabled while retaining CPM functionality?

Yes, the XPC8260CZUHFBC supports slave-mode operation where the G2 core is disabled and the device functions solely as a CPM-based communications co-processor. In this mode, external logic controls memory access and interrupt routing via the 60x bus, while the CPM continues to execute serial protocol stacks independently - confirmed in Section 1 "Features" of MPC8260EC Rev. 2.

What package type and thermal characteristics apply to the XPC8260CZUHFBC?

The XPC8260CZUHFBC uses a 480-ball TBGA package (27 mm × 27 mm, 1.0 mm pitch). Its thermal resistance is θJA = 7.78 °C/W under 1 m/s airflow on a 4-layer PCB - documented in Table 4 of MPC8260EC Rev. 2. This enables operation up to 105 °C junction temperature with proper heatsinking and airflow in telecom line cards.

How does the XPC8260CZUHFBC handle memory interface parity and error correction?

The XPC8260CZUHFBC's memory controller supports both address parity and data parity/ECC on the 60x bus. When configured for ECC mode, it detects and corrects single-bit errors and detects double-bit errors in 64-bit data words - implemented in hardware without CPU intervention, as detailed in Section 2.1 and Figure 10 of MPC8260EC Rev. 2.