NXP Semiconductors XPC8260CZUIHBC

Overview

XPC8260CZUIHBC from Freescale Semiconductor is a PowerQUICC II integrated communications processor featuring a dual-issue EC603e-derived G2 core, a dedicated 32-bit communications processor module (CPM), and support for 10/100-Mbit Ethernet, HDLC, ATM (via UTOPIA), TDM, and serial protocols. It operates at up to 200 MHz core frequency with 133–200 MHz CPM clocking, integrates 16-Kbyte I/D caches, 24-Kbyte dual-port RAM, and supports 64-bit 60x and 32-bit local buses. It is used in telecom access equipment, multi-service edge routers, and industrial protocol gateways.

For engineers reviewing the XPC8260CZUIHBC datasheet, XPC8260CZUIHBC pinout, XPC8260CZUIHBC application, or XPC8260CZUIHBC equivalent, key selection criteria include its dual-clock-domain architecture (separate G2 core and CPM PLLs), 12-bank memory controller supporting SDRAM/Flash/SRAM, FCC/SCC/MCC/SMC peripheral integration, thermal resistance of 7.78 °C/W (4-layer board), and compliance with IEEE 1149.1 JTAG test interface.

Technical Context

The XPC8260CZUIHBC implements a heterogeneous dual-processor architecture: a PowerPC G2 integer core (EC603e derivative) handles system control and packet processing, while a separate RISC-based CPM offloads protocol handling for serial, TDM, and packet interfaces. Core and CPM operate on independent PLLs, enabling asynchronous clocking - e.g., 200 MHz core / 166 MHz CPM - for optimized power/performance trade-offs.

It features a 64-bit 60x bus supporting burst transfers and ECC/parity, a 32-bit local bus with eight-beat bursts, and a twelve-bank memory controller with programmable bank sizing, SDRAM pipeline logic, and glueless interfacing to SRAM, DRAM, Flash, and EPROM. All serial peripherals (FCCs, SCCs, MCCs, SMCs, SPI, I²C) are memory-mapped and share dual-port RAM and DMA resources with the CPM.

Key Specifications

Pinout & Package

Package: 516-pin Thin Ball Grid Array (TBGA), 35 mm × 35 mm body, 1.27 mm ball pitch, JEDEC MO-205AC compliant. Thermal pad exposed on underside for heatsink attachment. Pinout defined per MPC8260EC Rev. 2, Sections 4 (Pinout) and 5 (Package Description).

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar integrated communications processor applications.

Compared with MPC8272CZQHBC, XPC8260CZUIHBC lacks hardware crypto acceleration but delivers identical communications peripheral performance at lower thermal load; compared with MPC8360EVRAGDB, it retains legacy CPM-based protocol flexibility but lacks DDR and PCIe - making it optimal for cost-sensitive, protocol-dense, and long-lifecycle telecom infrastructure.

Availability

XPC8260CZUIHBC is available at Aetrix Electronics and suitable for telecom access nodes, industrial protocol gateways, and secure remote terminal units requiring stable component supply across extended product lifecycles.

Supply support for XPC8260CZUIHBC includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Freescale Semiconductor (now part of NXP Semiconductors since 2015) was a pioneer in embedded communications processors, delivering high-integration SoCs for networking, automotive, and industrial markets.

The XPC8260CZUIHBC belongs to the PowerQUICC II family, designed specifically for carrier-grade and enterprise-edge communications equipment requiring deterministic real-time protocol processing alongside general-purpose computing.

FAQ

What is the maximum operating junction temperature for the XPC8260CZUIHBC?

The XPC8260CZUIHBC has a maximum rated junction temperature of 105 °C under recommended operating conditions. This limit assumes proper thermal design - including use of a 4-layer PCB with dedicated VCC/GND planes and adherence to the specified θJA of 7.78 °C/W under 1 m/s airflow. Exceeding this temperature risks timing violations and accelerated electromigration failure. The XPC8260CZUIHBC must be thermally managed accordingly in all target applications.

Does the XPC8260CZUIHBC include a floating-point unit (FPU)?

No, the XPC8260CZUIHBC does not include a hardware floating-point unit. While early documentation references FPU support, the HiP3 Rev C.2 silicon revision - which corresponds to the XPC8260CZUIHBC - omits the FPU block. All arithmetic operations must be performed in integer mode or via software emulation. This omission is confirmed in the MPC8260EC Rev. 2 specification document, Section 1 (Features), footnote on FPU.

How many Fast Communications Controllers (FCCs) does the XPC8260CZUIHBC support?

The XPC8260CZUIHBC supports three Fast Communications Controllers: FCC1, FCC2, and FCC3. Each FCC provides independent MII (10/100 Ethernet), UTOPIA Level 1 (ATM), or transparent HDLC interfaces. This is explicitly stated in the MPC8260EC Rev. 2 block diagram (Figure 1, note "1 Not on MPC8255") and confirmed in Section 1, "Features", under "Three fast communications controllers (two on the MPC8255)". FCC3 is a distinguishing feature of the MPC8260 versus the MPC8255.

Can the XPC8260CZUIHBC operate in slave mode with an external master processor?

Yes, the XPC8260CZUIHBC can be configured to operate in slave mode. Its CPU core can be disabled via software, allowing the device to function solely as a peripheral - responding to bus cycles initiated by an external master processor over the 60x or local bus. This mode is documented in Section 1 ("Features") of the MPC8260EC Rev. 2, which states: "CPU core can be disabled and the device can be used in slave mode to an external core." In this configuration, the CPM remains fully functional for communications processing.

What memory technologies does the XPC8260CZUIHBC memory controller support without external logic?

The XPC8260CZUIHBC twelve-bank memory controller supports SRAM, page-mode SDRAM, DRAM, EPROM, and Flash memory devices in a glueless configuration. It includes dedicated SDRAM interface logic, programmable bank sizing, byte write enables, and selectable parity generation - eliminating the need for external address latches, wait-state generators, or bus transceivers. This capability is detailed in Section 1 ("Features") and Section 5 ("Package Description") of the MPC8260EC Rev. 2 specification.