NXP Semiconductors XPC8260ZUHFBC

Overview

XPC8260ZUHFBC from Freescale Semiconductor is a PowerQUICC II integrated communications processor featuring a dual-issue EC603e-derived G2 core, a dedicated 32-bit communications processor module (CPM), and support for 10/100-Mbps Ethernet, HDLC, ATM (via UTOPIA), TDM, and serial protocols. It operates at up to 200 MHz core frequency with 16 KB instruction and 16 KB data caches, 24 KB dual-port RAM for CPM–core communication, and supports 64-bit 60x bus and 32-bit local bus interfaces. It is used in telecom access equipment, industrial gateways, and legacy network edge routers requiring deterministic real-time protocol processing.

For engineers reviewing the XPC8260ZUHFBC datasheet, XPC8260ZUHFBC pinout, XPC8260ZUHFBC application, or XPC8260ZUHFBC equivalent, this page delivers verified specifications including core/CPM clock ratios, DC supply requirements (VDD = 2.4–2.7 V, VDDH = 3.135–3.465 V), thermal resistance (θJA = 7.78 °C/W on 4-layer board), FCC/SCC timing constraints, and package-specific pin assignments for the 516-pin TBGA.

Technical Context

The XPC8260ZUHFBC integrates a PowerPC G2 core and an autonomous RISC-based CPM sharing 24 KB dual-port RAM; the two subsystems operate on independent PLLs, enabling asynchronous clocking (e.g., 133 MHz CPM / 200 MHz core). Its memory controller supports glueless interfacing to SDRAM, SRAM, Flash, and EPROM with programmable bank sizes, byte write enables, and ECC/parity support.

Communication peripherals include three Fast Communications Controllers (FCCs) supporting MII-based Ethernet and UTOPIA Level 1 ATM, four Serial Communications Controllers (SCCs) for HDLC/UART/BISYNC, two Multichannel Controllers (MCCs) handling up to 128 TDM channels, and eight independent baud rate generators. All serial I/O is managed by the CPM, isolating protocol processing from the main CPU.

Key Specifications

Pinout & Package

Package: 516-ball thin quad flat no-lead (TBGA), 27 mm × 27 mm body, 1.27 mm ball pitch, lead-free (Pb-free) construction per JEDEC MO-205.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar integrated communications processor applications.

Compared with MPC8272ZUHFBC and MPC8360EVRAGDB, the XPC8260ZUHFBC provides proven, hardware-accelerated HDLC/ATM/TDM processing in a mature, field-deployed platform - ideal for cost-sensitive, long-lifecycle telecom infrastructure where CPM determinism and driver stability outweigh raw CPU speed or DDR bandwidth.

Availability

XPC8260ZUHFBC is available at Aetrix Electronics and suitable for telecom access nodes, industrial protocol gateways, and legacy network edge routers requiring stable component supply across extended product lifecycles.

Supply support for XPC8260ZUHFBC includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Freescale Semiconductor (now part of NXP Semiconductors) was a leading designer of embedded processors for networking, automotive, and industrial applications, known for its PowerQUICC family of communications SoCs.

The XPC8260ZUHFBC belongs to the PowerQUICC II product line, engineered specifically for deterministic, hardware-accelerated protocol processing in carrier-class access equipment and enterprise edge devices.

FAQ

What is the maximum operating frequency of the XPC8260ZUHFBC core?

The XPC8260ZUHFBC supports a maximum core frequency of 200 MHz, achievable using a 66 MHz CLKIN with a 3× core PLL multiplier (MODCK[1–3] = 101). This configuration also sets the CPM to 133 MHz. The device's thermal design must accommodate junction temperatures ≤105 °C under sustained 200 MHz operation, especially with high I/O activity. XPC8260ZUHFBC datasheet Rev. 2 confirms this rating under recommended operating conditions (VDD = 2.4–2.7 V, TA ≤ 70 °C).

Does the XPC8260ZUHFBC support DDR SDRAM?

No, the XPC8260ZUHFBC does not support DDR SDRAM. Its memory controller is designed for SDR SDRAM (single-data-rate), SRAM, Flash, EPROM, and DRAM with page-mode support. DDR interface logic, differential strobes, and termination controls are absent. For DDR-capable successors, see the MPC8360 or MPC8548 families. XPC8260ZUHFBC documentation explicitly lists only "page mode SDRAM" in the memory controller features.

How many Ethernet MACs does the XPC8260ZUHFBC integrate?

The XPC8260ZUHFBC integrates three Fast Communications Controllers (FCCs), each capable of implementing a full 10/100-Mbps Ethernet MAC with MII interface support. These are distinct from the four SCCs, which support Ethernet only in legacy 10BASE-T half-duplex mode via Manchester encoding. XPC8260ZUHFBC hardware specifications confirm FCC1–FCC3 as the primary Ethernet engines with full-duplex, auto-negotiation, and flow-control capability.

What is the purpose of the 24 KB dual-port RAM in the XPC8260ZUHFBC?

The 24 KB on-chip dual-port RAM serves as the exclusive, zero-latency communication channel between the G2 core and the CPM. It stores shared descriptors, buffers, and control structures, enabling lock-free data exchange without bus arbitration overhead. This architecture allows the CPM to process serial protocols (HDLC, ATM, TDM) autonomously while the core handles TCP/IP stack and application logic. XPC8260ZUHFBC block diagram and memory map documentation confirm its dedicated allocation and dual-access ports.

Is the XPC8260ZUHFBC pin-compatible with the MPC8255?

No, the XPC8260ZUHFBC is not pin-compatible with the MPC8255. Although both belong to the PowerQUICC II family and share the same 516-pin TBGA package outline, key signal allocations differ: the MPC8255 omits FCC3 and one MCC, repurposes several PA/PB pins, and lacks UTOPIA interface signals present on XPC8260ZUHFBC. Pinout tables in MPC8260EC Rev. 2 explicitly list functional differences per pin group, confirming non-interchangeability without PCB redesign.