NXP Semiconductors XPC8260ZUIFBC

Overview

XPC8260ZUIFBC from Freescale Semiconductor is a PowerQUICC II integrated communications processor featuring a dual-issue EC603e-derived G2 core (133–200 MHz), a dedicated 32-bit RISC communications processor module (CPM), and integrated memory controller supporting SRAM, SDRAM, and Flash. It delivers 280 Dhrystone MIPS at 200 MHz and includes three Fast Communications Controllers (FCCs), four Serial Communications Controllers (SCCs), two Serial Management Controllers (SMCs), SPI, I²C, and eight TDM interfaces - deployed in telecom access equipment, industrial gateways, and legacy network infrastructure.

For engineers reviewing the XPC8260ZUIFBC datasheet, XPC8260ZUIFBC pinout, XPC8260ZUIFBC application, or XPC8260ZUIFBC equivalent, key selection considerations include its 2.5 V core/PLL supply with 3.3 V I/O, TBGA-516 package, dual PLL architecture enabling independent CPM/core clocking, and support for IEEE 802.3 10/100-Mbit Ethernet, HDLC up to T3, ATM SAR at 155 Mbps, and ISDN/T1/E1 TDM protocols.

Technical Context

The XPC8260ZUIFBC implements a split-architecture design: the G2 core handles general-purpose processing and system control, while the autonomous CPM offloads protocol-intensive serial communications tasks via dedicated microcode and 24 KB dual-port RAM. Its memory subsystem supports glueless interfacing to multiple memory types using programmable bank machines, including pipeline SDRAM and page-mode DRAM.

Timing is governed by two independent PLLs - one for the G2 core (1.5×–6× multiplier) and one for the CPM (2×–6× multiplier) - allowing optimized power/performance trade-offs. The 60x bus operates at up to 133 MHz (64-bit, 32-bit address), and the local bus runs at up to 66 MHz (32-bit data, 18-bit address), both supporting burst transfers and parity/ECC protection.

Key Specifications

Pinout & Package

TBGA-516 package with 27 × 27 mm body size, 1.27 mm ball pitch, and standard JEDEC MO-205AC footprint. Thermal pad on underside requires solder paste stencil opening per Freescale AN2291.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar integrated communications processor applications.

Compared with XPC8260ZUIFBC, MPC8272ZQUBC offers higher compute headroom and integrated crypto but reduced TDM flexibility, while MPC8360EVRAGDB represents a generational shift toward unified memory architecture and software-defined communications - requiring PCB redesign and firmware re-architecture.

Availability

XPC8260ZUIFBC is available at Aetrix Electronics and suitable for telecom infrastructure, industrial protocol conversion, and legacy network equipment requiring stable component supply across extended product lifecycles.

Supply support for XPC8260ZUIFBC includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Freescale Semiconductor (now part of NXP Semiconductors) was a pioneer in embedded communications processors, delivering high-integration SoCs for networking, automotive, and industrial markets before its 2015 acquisition.

The XPC8260ZUIFBC belongs to the PowerQUICC II family - designed specifically for cost-sensitive, high-channel-count communications equipment where hardware-accelerated protocol offload and deterministic real-time I/O were critical.

FAQ

What is the maximum operating frequency of the G2 core in the XPC8260ZUIFBC?

The XPC8260ZUIFBC G2 core operates at up to 200 MHz, confirmed in Freescale document MPC8260EC Rev. 2 Section 1 (Features) and Table 12 (Clock Default Modes). This frequency is achieved using a 66 MHz input clock with a 3× core PLL multiplier. Higher configurations (e.g., 233 MHz) require non-default MODCK/RSTCONF settings and are not supported for XPC8260ZUIFBC per its rated specifications.

Does the XPC8260ZUIFBC support DDR SDRAM?

No, the XPC8260ZUIFBC does not support DDR SDRAM. Its memory controller is designed for single-data-rate SDRAM (SDR SDRAM), page-mode DRAM, SRAM, EPROM, and Flash - as specified in Section 1 (Features) and Section 5 (Package Description) of MPC8260EC Rev. 2. DDR support was introduced in later PowerQUICC III (MPC85xx) devices.

What is the function of the RSTCONF pin on the XPC8260ZUIFBC?

The RSTCONF pin on the XPC8260ZUIFBC enables extended clock configuration beyond the basic eight modes defined by MODCK[1–3]. When asserted during HRESET, it allows selection among 49 additional clock configurations (Table 13, MPC8260EC Rev. 2), permitting fine-grained tuning of CPM and core frequencies for specific bandwidth or power targets.

Can the XPC8260ZUIFBC operate with a 3.3 V-only supply scheme?

No - the XPC8260ZUIFBC requires three distinct supply domains: 2.4–2.7 V for VDD (core) and VCCSYN (PLL), and 3.135–3.465 V for VDDH (I/O). These must track within ±5% and ±0.1 Vdc per Section 2.1 (Table 2) of MPC8260EC Rev. 2. A single 3.3 V rail cannot meet both core voltage and tracking requirements.

How many independent TDM interfaces does the XPC8260ZUIFBC support?

The XPC8260ZUIFBC supports up to eight independent TDM interfaces, as explicitly stated in Section 1 (Features) of MPC8260EC Rev. 2: "Up to eight TDM interfaces (4 on the MPC8255)" - confirming full eight-TDM capability for the MPC8260 variant, including XPC8260ZUIFBC.