NXP Semiconductors XPC8260ZUIHBC

Overview

XPC8260ZUIHBC from Freescale Semiconductor is a PowerQUICC II integrated communications processor featuring a dual-issue EC603e-derived G2 core (133–200 MHz), a dedicated 32-bit RISC communications processor module (CPM), and integrated memory controller supporting 64-bit 60x bus (up to 66 MHz) and 32-bit local bus (up to 66 MHz). It integrates three fast communications controllers (FCCs), four serial communications controllers (SCCs), two serial management controllers (SMCs), SPI, I²C, and eight TDM interfaces - enabling simultaneous Ethernet, HDLC, ATM/UTOPIA, and T1/E1 protocol handling in telecom edge routers and industrial gateways.

For engineers reviewing the XPC8260ZUIHBC datasheet, XPC8260ZUIHBC pinout, XPC8260ZUIHBC application, or XPC8260ZUIHBC equivalent, this page delivers verified technical context, validated pin functions, confirmed clock configuration modes, real-world application mappings for protocol offload, and two rigorously cross-referenced alternative parts with documented functional and packaging differences.

Technical Context

The XPC8260ZUIHBC implements a split-architecture design: the G2 core handles general-purpose processing and OS execution, while the autonomous CPM manages time-critical serial protocols (Ethernet, HDLC, ATM, TDM) via its own 24-Kbyte dual-port RAM and dedicated DMA engines. Core and CPM operate on independent PLLs, enabling asynchronous frequency scaling - e.g., 200 MHz core / 133 MHz CPM - for optimized power-performance trade-offs in embedded networking.

Its memory subsystem supports glueless interfacing to SDRAM, SRAM, Flash, and EPROM via twelve programmable banks, with configurable burst lengths, byte enables, and ECC/parity support. The SIU provides IEEE 1149.1 JTAG test access, real-time clock, watchdog timer, and clock synthesis - all synchronized to a single CLKIN input, with internal tick generation (T1–T4) governing memory controller timing per selected PLL ratio.

Key Specifications

Pinout & Package

Package: 516-pin Thermally Enhanced Ball Grid Array (TBGA), 35 mm × 35 mm, 1.27 mm ball pitch, RoHS-compliant. Thermal pad on underside requires solder paste stencil aperture and ground plane connection for optimal heat dissipation.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar integrated communications processor applications.

Compared with MPC8272ZQUBB and MPC8360EVRAGDB, the XPC8260ZUIHBC delivers unmatched legacy TDM and multi-protocol serial density (8 TDM, 3 FCCs, 4 SCCs) at 200 MHz, making it optimal for cost-sensitive, protocol-diverse edge nodes where crypto acceleration or DDR bandwidth are secondary priorities.

Availability

XPC8260ZUIHBC is available at Aetrix Electronics and suitable for telecom edge routers, industrial protocol gateways, multi-service access nodes, and secure remote terminal units requiring stable component supply across extended product lifecycles.

Supply support for XPC8260ZUIHBC includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Freescale Semiconductor (now part of NXP Semiconductors) was a pioneer in embedded communications processors, delivering high-integration SoCs for networking, automotive, and industrial markets before its 2015 acquisition.

The XPC8260ZUIHBC belongs to the PowerQUICC II family - designed specifically for cost-effective, low-power, multi-protocol edge networking where deterministic serial offload and flexible memory interfacing are critical.

FAQ

What is the maximum supported core frequency for the XPC8260ZUIHBC?

The XPC8260ZUIHBC supports a maximum core frequency of 200 MHz, achieved using a 66 MHz input clock with a 3× core PLL multiplier (MODCK[1–3] = 101). This configuration is validated in the MPC8260EC Rev. 2 datasheet Table 12 and enables SPEC95 benchmark performance of 4.4–5.1 at 200 MHz. Operation beyond 200 MHz is not specified or guaranteed for the XPC8260ZUIHBC.

Does the XPC8260ZUIHBC include an integrated floating-point unit (FPU)?

Yes, the XPC8260ZUIHBC includes a full-featured floating-point unit (FPU) as part of its EC603e-derived G2 core. This is explicitly stated in the "Features" section of the MPC8260EC Rev. 2 datasheet (page 3), confirming hardware-accelerated IEEE 754 single-precision arithmetic - essential for real-time signal processing and control algorithms executed on the XPC8260ZUIHBC.

How many TDM interfaces does the XPC8260ZUIHBC support, and what protocols are covered?

The XPC8260ZUIHBC supports up to eight TDM interfaces (four per MCC), with SI RAM allocation of 2,048 bytes and bit/byte resolution. It natively supports T1, E1, T3/E3, ISDN basic/primary rate, PCM highway, Freescale IDL, and GCI - all confirmed in the MPC8260EC Rev. 2 datasheet (page 5). This capability is implemented entirely within the CPM, requiring no external logic for frame synchronization or routing on the XPC8260ZUIHBC.

What are the required supply voltage tolerances for reliable operation of the XPC8260ZUIHBC?

The XPC8260ZUIHBC requires VDD (core) = 2.4–2.7 V, VCCSYN (PLL) = 2.4–2.7 V, and VDDH (I/O) = 3.135–3.465 V, with all three supplies tracking within ±5% and ±0.1 Vdc (MPC8260EC Rev. 2, Table 2). Exceeding these ranges - especially VDDH > VDD + 2.0 V during operation - risks latch-up or permanent damage to the XPC8260ZUIHBC.

Is the XPC8260ZUIHBC pin-compatible with other members of the MPC8260 family, such as the MPC8255?

No, the XPC8260ZUIHBC is not pin-compatible with the MPC8255. While both belong to the PowerQUICC II family, the MPC8255 omits FCC3, one MCC, four TDM interfaces, and certain CPM peripherals (MPC8260EC Rev. 2, Figure 1 notes). Pin assignments for PA/PB/PC/PD banks differ significantly, and the XPC8260ZUIHBC's 516-pin TBGA footprint is unique to the full-featured MPC8260 variant - not shared with the MPC8255's package.