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NXP Semiconductors XPC850DECZT50BU
- Part No.:
- XPC850DECZT50BU
- Manufacturer:
- NXP Semiconductors
- Category:
- Microprocessors
- Package:
- 256-BGA
- Datasheet:
-
XPC850DECZT50BU.pdf
- Description:
- IC MPU MPC8XX 50MHZ 256BGA
- Quantity:
- Payment:
- Shipping:
Inventory:4,890
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Product details
Overview
XPC850DECZT50BU from NXP Semiconductors (formerly Freescale) is a PowerQUICC™ integrated communications processor combining a 32-bit MPC8xx core with a dedicated RISC communications processor (CP), dual-port RAM, Ethernet-capable SCCs, USB 1.1 controller, and CPM-based serial peripherals. It targets cost-sensitive remote-access gateways, DSL/CPE edge devices, and telecom infrastructure requiring deterministic real-time packet handling at up to 50 MHz CPU clock frequency.
For engineers reviewing the XPC850DECZT50BU datasheet, XPC850DECZT50BU pinout, XPC850DECZT50BU application, or XPC850DECZT50BU equivalent, key selection criteria include its dual SCC support for concurrent Ethernet/HDLC, 8-Kbyte dual-port RAM allocation for CP offload, 3.3-V I/O with 5-V tolerance, BGA-352 package thermal profile, and PowerPC architecture compatibility with legacy MPC860 software stacks.
Technical Context
The XPC850DECZT50BU implements a Harvard-architecture MPC8xx core with 2-Kbyte instruction cache and 1-Kbyte data cache, MMU with 8-entry TLB supporting 4–8 Mbyte page sizes, and static design enabling operation from 0 to 50 MHz. Its CPM contains a separate 32-bit RISC communications processor executing microcode for protocol acceleration.
It integrates two serial communications controllers (SCCs) supporting IEEE 802.3 10-Mbps Ethernet, HDLC/SDLC up to 2 Mbps, and transparent bit-stream modes; one USB 1.1 controller (host/slave, 1.5/12 Mbps); two SMCs; one SPI; one I²C port; and time-slot assigner for TDM multiplexing across SCC/SMC channels.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | MPC8xx 32-bit PowerPC core with branch prediction, no conditional execution - enables deterministic interrupt latency in real-time comms tasks. |
| Max Clock Frequency | 50 MHz - defines maximum instruction throughput and bus timing margin for synchronous peripheral interfaces. |
| Dual-Port RAM | 8 Kbytes - allocated between CPU and CPM for zero-copy buffer sharing in packet forwarding applications. |
| SCC Count | 2 - supports simultaneous Ethernet + HDLC/PPP links without external bridging logic. |
| USB Support | USB 1.1 controller (1.5/12 Mbps host/slave) - enables direct connection to modems, management interfaces, or firmware update ports. |
| I/O Voltage | 3.3 V core / 5-V tolerant I/O - allows direct interfacing with legacy 5-V peripherals without level shifters. |
| Package | BGA-352 (27 × 27 mm, 1.27 mm pitch) - requires multilayer PCB with thermal vias per θJA = 24 °C/W spec under 1 W dissipation. |
Pinout & Package
Package: 352-ball plastic ball grid array (PBGA), 27 mm × 27 mm, 1.27 mm ball pitch, RoHS-compliant. Thermal pad on underside requires solder paste stencil opening and thermal via array per AN-1231/D layout guidelines.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDDH, VDDL, KAPWR, VDDSYN | Core & I/O power supply inputs | Four independent 3.0–3.6 V supplies - enable voltage domain isolation for noise reduction and low-power mode control. |
| A[6:31], D[0:31] | Address/data bus signals | 32-bit multiplexed address/data bus - supports glueless interface to SDRAM, SRAM, flash, and PCMCIA via programmable memory controller. |
| CLKOUT, EXTCLK, EXTAL | System clock generation and input | CLKOUT provides buffered system clock; EXTCLK accepts external 50-MHz reference; EXTAL drives internal PLL oscillator - supports frequency synthesis for CPM and core clocks. |
| SCC1_TXD/SCC1_RXD, SCC2_TXD/SCC2_RXD | Ethernet/HDLC serial interface pins | Differential or single-ended signaling per external PHY - enables 10BASE-T Ethernet and synchronous HDLC framing without external transceivers. |
| USBTXP/USBTXN, USBRXP/USBRXN | USB differential pair | Full-speed (12 Mbps) or low-speed (1.5 Mbps) USB physical layer - requires 1.5-kΩ pull-up on D+ for device enumeration. |
| HRESET, SRESET | Hardware and software reset inputs | Asynchronous active-low reset assertion - triggers full chip initialization including CPM microcode reload and cache/MMU state clear. |
Key Features
| Feature | Design Value |
|---|---|
| Communications Processor Module (CPM) | Dedicated RISC CP handles protocol processing (Ethernet, HDLC, USB) offloading CPU - reduces host interrupt load and improves packet throughput consistency. |
| Memory Controller | Eight-bank controller with programmable timing supports SDRAM, DRAM, SRAM, flash, and PCMCIA - eliminates need for external bus logic in gateway designs. |
| Low-Power Modes | Five states (Full High/Low, Doze, Sleep, Deep Sleep) - enables sub-100 µA RTC-only operation for battery-backed remote nodes. |
| Debug Interface | IEEE 1149.1 JTAG + eight hardware watchpoint comparators - supports non-intrusive real-time trace and breakpoint debugging of both CPU and CP code. |
| Time Slot Assigner (TSA) | Configurable TDM routing engine for SCC/SMC channels - enables ISDN BRI/PRI, PCM highway, or custom time-division multiplexing without FPGA glue logic. |
Applications
| DSL/CPE Gateway | Industrial Protocol Converter |
|---|---|
|
Use Scenario: Residential DSL modem with integrated routing, firewall, and VoIP media gateway functions. IC Role / Device Role / Timing Role: Primary communications processor managing ADSL line interface (via SCC2 HDLC), Ethernet LAN (via SCC1), USB management port, and real-time VoIP packet scheduling. Use Value: Dual SCCs enable concurrent line-side and network-side packet processing; 8-Kbyte dual-port RAM minimizes CPU-CP data copy overhead in SIP/RTP forwarding paths. |
Use Scenario: Fieldbus-to-Ethernet bridge converting Modbus RTU over RS-485 to TCP/IP for SCADA systems. IC Role / Device Role / Timing Role: Protocol translation engine using SMC1 for RS-485 UART, SCC1 for 10-Mbps Ethernet MAC, and CPM microcode for Modbus frame parsing and TCP segmentation. Use Value: Hardware-accelerated CRC generation and HDLC framing in CPM reduce CPU utilization below 15% during 100-frame/sec Modbus polling. |
| Remote Access Concentrator | Telecom Signaling Gateway |
|
Use Scenario: Cellular backhaul unit aggregating PPP sessions from multiple GSM base stations over leased lines. IC Role / Device Role / Timing Role: Multi-channel HDLC controller using QUICC multichannel mode on SCC1 to manage 32 concurrent PPP links with per-channel TxBD/RxBD descriptors. Use Value: QMC microcode supports GRACEFUL STOP TRANSMIT and CLOSE RXBD commands - ensures no frame loss during link teardown or failover events. |
Use Scenario: SS7 signaling point (STP) interface card translating MTP2 frames between T1/E1 lines and IP-based MTP3 stack. IC Role / Device Role / Timing Role: Time-slot assigner routes T1 timeslots to SCC1/SMC1; CPM executes MTP2 link-layer state machines with hardware CRC-16 and bit stuffing. Use Value: Deterministic 25-µs worst-case interrupt latency from HDLC flag detection to CPU notification meets ITU-T Q.703 timing requirements. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar integrated communications processor applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MPC850DEZT50B | Same die, identical pinout and electrical specs; differs only in tape-and-reel packaging and RoHS status (non-lead-free). | Legacy industrial designs requiring same thermal/mechanical footprint but unrestricted by lead-free compliance. | Select when sourcing legacy BOMs where Pb-free certification is not mandated and existing PCBs were qualified with non-RoHS variants. |
| MPC850SRZT50B | Adds UTOPIA Level 1 interface and ATM cell processing capability; otherwise identical CPU/CPM architecture and pinout. | ATM-based DSLAM line cards or broadband access multiplexers requiring native cell relay transport. | Choose only if UTOPIA/ATM functionality is required; otherwise XPC850DECZT50BU offers lower cost and same performance for pure Ethernet/HDLC use cases. |
Compared with MPC850DEZT50B, XPC850DECZT50BU provides identical functionality with RoHS compliance; compared with MPC850SRZT50B, it omits UTOPIA/ATM hardware to reduce cost and power in Ethernet-centric deployments.
Availability
XPC850DECZT50BU is available at Aetrix Electronics and suitable for DSL/CPE gateways, industrial protocol converters, remote access concentrators, and telecom signaling gateways requiring stable component supply and long-term lifecycle support.
Supply support for XPC850DECZT50BU includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors acquired Freescale in 2015 and maintains full technical support, documentation, and product change notifications for the PowerQUICC family.
The MPC850 series was designed as a cost-optimized communications processor for entry-level networking equipment, emphasizing integration of Ethernet, HDLC, USB, and PCMCIA in a single chip to replace multi-chip controller solutions.
FAQ
What is the maximum operating frequency of the XPC850DECZT50BU?
The XPC850DECZT50BU is rated for a maximum CPU clock frequency of 50 MHz. At this speed, the internal memory controller operates in half-speed bus mode (25 MHz), and all AC timing parameters in Table 6 assume 50-MHz CLKOUT with 50-pF load. Operation above 50 MHz is not supported per Freescale MPC850EC Rev. 2 specifications.
Does the XPC850DECZT50BU support USB host mode?
Yes, the XPC850DECZT50BU includes a full-speed USB 1.1 controller that supports both host and peripheral (slave) modes at 12 Mbps and low-speed mode at 1.5 Mbps. The USB PHY interface uses differential pairs USBTXP/USBTXN and USBRXP/USBRXN, requiring external 1.5-kΩ pull-up on D+ for device enumeration.
How much dual-port RAM does the XPC850DECZT50BU provide?
The XPC850DECZT50BU integrates 8 Kbytes of on-chip dual-port RAM, shared between the MPC8xx core and the communications processor (CP). This memory is used for descriptor tables, packet buffers, and microcode variables, enabling zero-copy data movement between CPU and CPM for high-throughput packet processing.
What package type is used for the XPC850DECZT50BU?
The XPC850DECZT50BU is packaged in a 352-ball plastic BGA (PBGA) with 27 mm × 27 mm body size and 1.27 mm ball pitch. Thermal management requires a copper thermal pad on the underside connected to internal ground planes via ≥20 thermal vias, per Freescale AN-1231/D layout guidelines.
Is the XPC850DECZT50BU pin-compatible with other MPC850 family members?
Yes, the XPC850DECZT50BU shares the same BGA-352 pinout as MPC850DEZT50B and MPC850SRZT50B. All three variants are electrically and mechanically interchangeable; differences are limited to internal microcode (ATM support in SR variant) and RoHS compliance (XPC850DECZT50BU is lead-free).
XPC850DECZT50BU Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Package/Case:
- 256-BGA
- Series:
- MPC8xx
- Packaging:
- Tray
- Product Status:
- Obsolete
- Core Processor:
- MPC8xx
- Number of Cores/Bus Width:
- 1 Core, 32-Bit
- Speed:
- 50MHz
- Co-Processors/DSP:
- Communications; CPM
- RAM Controllers:
- DRAM
- Graphics Acceleration:
- No
- Display & Interface Controllers:
- -
- Ethernet:
- 10Mbps (1)
- SATA:
- -
- USB:
- USB 1.x (1)
- Voltage - I/O:
- 3.3V
- Operating Temperature:
- -40°C ~ 95°C (TA)
- Grade:
- -
- Qualification:
- -
- Security Features:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 256-PBGA (23x23)
- Additional Interfaces:
- HDLC/SDLC, I2C, IrDA, PCMCIA-ATA, TDM, UART/USART
XPC850DECZT50BU FAQ
1.How can I place an order for XPC850DECZT50BU through Aetrix?
Please submit a Request for Quotation (RFQ) for XPC850DECZT50BU on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XPC850DECZT50BU reliable?
The price and inventory of XPC850DECZT50BU are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XPC850DECZT50BU is usually 5 days.
3.What payment methods are accepted for XPC850DECZT50BU?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XPC850DECZT50BU transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XPC850DECZT50BU?
XPC850DECZT50BU orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XPC850DECZT50BU order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XPC850DECZT50BU?
For technical support, including XPC850DECZT50BU datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XPC850DECZT50BU requirements.
6.How does Aetrix verify that XPC850DECZT50BU is sourced from the original manufacturer or authorized distributors?
All XPC850DECZT50BU products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XPC850DECZT50BU meets industry standards.
7.What is the process for return or replacement of XPC850DECZT50BU?
All XPC850DECZT50BU units undergo pre-shipment inspection (PSI). If there is an issue with XPC850DECZT50BU, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XPC850DECZT50BU part is unused and in its original packaging.
Return procedure for XPC850DECZT50BU:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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