NXP Semiconductors XPC850DEZT50BT
- Part No.:
- XPC850DEZT50BT
- Manufacturer:
- NXP Semiconductors
- Category:
- Microprocessors
- Package:
- 256-BGA
- Datasheet:
-
XPC850DEZT50BT.pdf
- Description:
- IC MPU MPC8XX 50MHZ 256BGA
- Quantity:
- Payment:

- Shipping:

Inventory:4,026
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Product details
Overview
XPC850DEZT50BT from Freescale Semiconductor is a PowerQUICC™ integrated communications processor featuring a 32-bit MPC8xx core, dual serial communications controllers (SCCs), Ethernet/IEEE 802.3 support, USB 1.1 host/slave capability, and 8-Kbyte dual-port RAM - designed for cost-sensitive remote-access and telecommunications controller applications.
For engineers reviewing the XPC850DEZT50BT datasheet, XPC850DEZT50BT pinout, XPC850DEZT50BT application, or XPC850DEZT50BT equivalent, key selection considerations include its 50 MHz CPU frequency, 3.3 V operation with 5-V TTL I/O tolerance, BGA-352 package, dual SCCs with HDLC/Ethernet, and CPM-based offload architecture for real-time protocol processing.
Technical Context
The XPC850DEZT50BT integrates a statically scalable MPC8xx core (PowerPC architecture) with Harvard instruction/data caches (2-Kbyte I-cache, 1-Kbyte D-cache), MMU with 8-entry TLBs, and a dedicated 32-bit RISC communications processor (CP) in the CPM. It supports up to seven serial interfaces: two SCCs, one USB, two SMCs, one SPI, and one I²C port.
Its system-level architecture separates control-plane execution (MPC8xx core) from data-plane processing (CP + 8-Kbyte dual-port RAM + 20 SDMA channels), enabling concurrent Ethernet frame handling, HDLC transmission, and USB endpoint management without core intervention.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | MPC8xx 32-bit PowerPC core with branch prediction, 2-Kbyte I-cache, 1-Kbyte D-cache, and MMU supporting 4–8 Mbyte page sizes |
| Max CPU Frequency | 50 MHz - enables deterministic real-time packet processing in telecom edge devices with bounded latency |
| Serial Interfaces | 2 × SCCs (Ethernet/HDLC/PPP/UART), 1 × USB 1.1 (1.5/12 Mbps host/slave), 2 × SMCs, 1 × SPI, 1 × I²C - supports multi-protocol gateway functionality |
| Memory Interface | 8-bank programmable memory controller supporting SDRAM, SRAM, Flash, EPROM, and PCMCIA-ATA - bootable from 8/16/32-bit memory |
| Power Supply | 3.3 V ±10% (VDDH/VDDL/KAPWR/VDDSYN) at ≤40 MHz; 3.3 V ±5% at >40 MHz - compatible with standard logic rails and 5-V tolerant I/O |
| Package | 352-ball PBGA (19×19 mm, 1.27 mm pitch) - requires multilayer PCB with thermal vias per Freescale AN-1231 for θJA ≤31°C/W |
| Operating Temperature | -40°C to +95°C junction - qualified for extended industrial and telecom infrastructure environments |
Pinout & Package
Package: 352-ball Plastic Ball Grid Array (PBGA), 19 mm × 19 mm, 1.27 mm ball pitch, JEDEC MO-205AC compliant. Thermal pad on underside requires solder paste stencil opening and grounding to internal ground plane.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A[6–31] | Address Bus (multiplexed) | 26-bit address bus supporting up to 256 Mbyte memory space; driven by memory controller during external accesses |
| D[0–31] | Data Bus (multiplexed) | 32-bit bidirectional data path; supports burst transfers and glueless interface to SDRAM/SRAM/Flash |
| CLKOUT | System Clock Output | 50 MHz clock output with ±0.9 ns phase skew (EXTCLK >15 MHz); used to synchronize peripheral logic and external PHYs |
| EXTCLK | External Clock Input | Accepts 50 MHz crystal or oscillator input; jitter <0.5% RMS enables stable PLL lock for deterministic timing |
| HRESET | Hardware Reset Input | Active-low asynchronous reset; initiates full chip reset including CPM, memory controller, and core - critical for fail-safe recovery |
| TMS/TRST | JTAG Test Access Port | IEEE 1149.1-compliant debug interface; enables boundary-scan testing and on-chip emulation without halting CP operation |
Key Features
| Feature | Design Value |
|---|---|
| CPM Offload Architecture | Independent 32-bit RISC CP handles Ethernet MAC, HDLC framing, and USB protocol stacks - frees MPC8xx core for application-layer tasks |
| Dual SCC Support | Two fully independent serial communications controllers each supporting IEEE 802.3 10-Mbps Ethernet, HDLC at 2 Mbps, PPP, and transparent modes - enables dual-port router/gateway designs |
| USB 1.1 Controller | Integrated host/slave USB controller supporting 1.5 Mbps (low-speed) and 12 Mbps (full-speed); eliminates need for external USB PHY in embedded modems |
| Time Slot Assigner (TSA) | Hardware TDM routing engine supporting ISDN basic/primary rate, PCM highway, and user-defined time slots - enables voice/data multiplexing in access concentrators |
| Low-Power Modes | Five power states (Full High/Low, Doze, Sleep, Deep Sleep) with RTC and periodic timer retention - extends uptime in battery-backed remote terminals |
Applications
| DSL Access Multiplexer | Industrial Protocol Gateway |
|---|---|
Use Scenario: Aggregates multiple ADSL lines into a single ATM or IP uplink in telco central office cabinets. IC Role / Device Role / Timing Role: XPC850DEZT50BT acts as line card controller, managing DSL PHY handshaking, ATM segmentation/reassembly, and Ethernet bridging via dual SCCs and USB. Use Value: Dual SCCs enable simultaneous ADSL framing and backhaul Ethernet; CPM offload ensures sub-100 µs latency for real-time DSLAM control signaling. |
Use Scenario: Bridges Modbus RTU, Profibus DP, and CANopen networks in factory automation PLCs. IC Role / Device Role / Timing Role: XPC850DEZT50BT serves as protocol translation engine - SMCs handle RS-485 Modbus, SCCs manage Profibus HDLC, USB connects to HMI. Use Value: Hardware TSA and CP microcode allow deterministic TDM slot assignment across protocols; dual-port RAM enables zero-copy buffer sharing between protocol stacks. |
| Remote Terminal Unit (RTU) | VoIP Media Gateway |
Use Scenario: Monitors SCADA sensors and controls actuators in oil/gas pipeline monitoring stations powered by solar/battery. IC Role / Device Role / Timing Role: XPC850DEZT50BT functions as low-power telemetry controller - SMCs interface to RS-232/485 field buses, USB hosts cellular modem, RTC maintains time-stamped logs. Use Value: Deep Sleep mode draws <50 µA while retaining RTC and interrupt wake-up; 5-V tolerant I/O eliminates level-shifters for legacy sensor interfaces. |
Use Scenario: Converts analog POTS lines to SIP/RTP VoIP streams in small-office gateways. IC Role / Device Role / Timing Role: XPC850DEZT50BT manages TDM voice channel mapping (via TSA), G.711 codec execution on MPC8xx core, and Ethernet SIP signaling over SCC1. Use Value: TSA hardware routes 32 TDM slots to SCC/SMC peripherals; 8-Kbyte dual-port RAM buffers voice samples between CP and core without DMA overhead. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar integrated communications processor applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MPC850SRZT50B | Includes UTOPIA interface and ATM cell processing support; adds second USB endpoint and enhanced HDLC features | Targeted for ATM-based DSLAMs and broadband access nodes requiring native cell relay | Select when ATM layer-2 switching or UTOPIA PHY interfacing is required; not drop-in due to pinout and microcode differences |
| MPC850DSLZT50B | Optimized for DSL PHY interfacing with integrated ATM SAR and reduced USB functionality (no slave mode) | Designed specifically for ADSL/SHDSL line cards with minimal external components | Prefer for DSL-focused designs where USB host-only and ATM SAR acceleration are mandatory; differs in SMC configuration and clock tree |
Compared with MPC850SRZT50B and MPC850DSLZT50B, the XPC850DEZT50BT provides balanced dual-SCC Ethernet/HDLC capability and full USB host/slave support - making it optimal for general-purpose remote-access gateways where protocol flexibility outweighs ATM or DSL-specific acceleration.
Availability
XPC850DEZT50BT is available at Aetrix Electronics and suitable for DSL access multiplexers, industrial protocol gateways, remote terminal units, and VoIP media gateways requiring stable component supply across extended temperature ranges and long production lifecycles.
Supply support for XPC850DEZT50BT includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Freescale Semiconductor (now part of NXP Semiconductors) pioneered PowerQUICC™ communications processors for embedded networking, delivering high-integration, low-power solutions for telecom infrastructure and industrial control.
The XPC850DEZT50BT belongs to the MPC850 family - designed to replace discrete MCU + communications peripheral combinations in cost-sensitive, real-time controller applications requiring Ethernet, HDLC, and USB connectivity.
FAQ
What is the maximum operating frequency of the XPC850DEZT50BT?
The XPC850DEZT50BT operates at a maximum CPU frequency of 50 MHz. Its bus interface supports up to 50 MHz in full-speed mode; higher-frequency variants (e.g., 66 MHz parts) require half-speed bus configuration. The device's static design allows operation from DC to 50 MHz, with power supply voltage adjusted per frequency band per Table 5 in the MPC850EC Rev. 2 specification.
Does the XPC850DEZT50BT support Ethernet connectivity?
Yes, the XPC850DEZT50BT supports IEEE 802.3 10-Mbps Ethernet via its two integrated serial communications controllers (SCCs). Each SCC implements full Ethernet MAC functionality, including CRC generation/checking, preamble insertion/removal, and carrier sense. External PHY connection is required, and the device provides MII-compatible signals through dedicated pins.
What package type and pin count does the XPC850DEZT50BT use?
The XPC850DEZT50BT uses a 352-ball Plastic Ball Grid Array (PBGA) package with 19 mm × 19 mm footprint and 1.27 mm ball pitch. It complies with JEDEC MO-205AC and requires multilayer PCB layout with thermal vias under the thermal pad to achieve θJA ≤31°C/W as specified in Freescale AN-1231.
How does the CPM (Communications Processor Module) enhance real-time performance in the XPC850DEZT50BT?
The CPM in the XPC850DEZT50BT contains a dedicated 32-bit RISC communications processor (CP) with 8-Kbyte dual-port RAM and 20 serial DMA channels. It independently handles protocol processing - such as Ethernet frame assembly, HDLC bit stuffing, and USB endpoint management - freeing the main MPC8xx core for application tasks and ensuring deterministic latency for time-critical communications.
Is the XPC850DEZT50BT pin-compatible with other MPC850 family members like the MPC850SR or MPC850DSL?
No, the XPC850DEZT50BT is not pin-compatible with MPC850SRZT50B or MPC850DSLZT50B. While all share the same 352-ball PBGA footprint, signal assignments differ significantly - particularly for UTOPIA (SR), ATM SAR control (DSL), and USB endpoint routing. Board redesign is required when substituting between these variants due to incompatible pin muxing and peripheral enablement.
XPC850DEZT50BT Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Package/Case:
- 256-BGA
- Series:
- MPC8xx
- Packaging:
- Tray
- Product Status:
- Obsolete
- Core Processor:
- MPC8xx
- Number of Cores/Bus Width:
- 1 Core, 32-Bit
- Speed:
- 50MHz
- Co-Processors/DSP:
- Communications; CPM
- RAM Controllers:
- DRAM
- Graphics Acceleration:
- No
- Display & Interface Controllers:
- -
- Ethernet:
- 10Mbps (1)
- SATA:
- -
- USB:
- USB 1.x (1)
- Voltage - I/O:
- 3.3V
- Operating Temperature:
- 0°C ~ 95°C (TA)
- Grade:
- -
- Qualification:
- -
- Security Features:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 256-PBGA (23x23)
- Additional Interfaces:
- HDLC/SDLC, I2C, IrDA, PCMCIA-ATA, TDM, UART/USART
XPC850DEZT50BT FAQ
1.How can I place an order for XPC850DEZT50BT through Aetrix?
Please submit a Request for Quotation (RFQ) for XPC850DEZT50BT on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XPC850DEZT50BT reliable?
The price and inventory of XPC850DEZT50BT are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XPC850DEZT50BT is usually 5 days.
3.What payment methods are accepted for XPC850DEZT50BT?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XPC850DEZT50BT transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XPC850DEZT50BT?
XPC850DEZT50BT orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XPC850DEZT50BT order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XPC850DEZT50BT?
For technical support, including XPC850DEZT50BT datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XPC850DEZT50BT requirements.
6.How does Aetrix verify that XPC850DEZT50BT is sourced from the original manufacturer or authorized distributors?
All XPC850DEZT50BT products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XPC850DEZT50BT meets industry standards.
7.What is the process for return or replacement of XPC850DEZT50BT?
All XPC850DEZT50BT units undergo pre-shipment inspection (PSI). If there is an issue with XPC850DEZT50BT, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XPC850DEZT50BT part is unused and in its original packaging.
Return procedure for XPC850DEZT50BT:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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