NXP Semiconductors XPC850DEZT50BU

Overview

XPC850DEZT50BU from Freescale Semiconductor is a PowerQUICC™ integrated communications processor featuring a 32-bit MPC8xx core, dual serial communications controllers (SCCs), USB 1.1 host/slave support, and 8-Kbyte dual-port RAM. It operates at up to 50 MHz with 3.3-V core I/O and 5-V-tolerant GPIO, targeting cost-sensitive remote-access and telecom edge devices requiring Ethernet, HDLC, and PCMCIA-ATA connectivity.

For engineers reviewing the XPC850DEZT50BU datasheet, XPC850DEZT50BU pinout, XPC850DEZT50BU application, or XPC850DEZT50BU equivalent, this page delivers verified electrical specs, bus timing constraints at 50 MHz, CPM peripheral mapping, thermal resistance (θ_JA = 31°C/W), and validated alternative parts for migration or second-sourcing in embedded networking hardware.

Technical Context

The XPC850DEZT50BU integrates a dedicated 32-bit RISC communications processor (CP) alongside the main MPC8xx core, enabling concurrent protocol handling across two SCCs, one USB channel, two SMCs, SPI, and I²C - all sharing 8-Kbyte dual-port RAM. Its memory controller supports DRAM, SDRAM, SRAM, and flash with programmable bank sizing (32 Kbytes–256 Mbytes) and boot-selectable 8/16/32-bit interface.

Bus operation is constrained to 50 MHz maximum; higher-frequency variants (e.g., 66/80 MHz) require half-speed bus mode configuration. The device implements IEEE 1149.1 JTAG debug, advanced power states (Doze/Sleep/Deep Sleep), and dynamic voltage scaling between 2.2 V (≤25 MHz) and 3.3 V (≥40 MHz).

Key Specifications

Pinout & Package

Package: 324-pin Plastic Ball Grid Array (PBGA), 27 mm × 27 mm body, 1.27 mm ball pitch, RoHS-compliant.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar integrated communications processor applications.

Compared with MPC850SRZQ50B and MPC852TVR50B, the XPC850DEZT50BU uniquely balances dual-SCC Ethernet throughput, USB 1.1 flexibility, and PCMCIA-ATA host capability within a single 324-pin PBGA - making it optimal for compact, feature-rich remote access concentrators where board space and peripheral integration are critical.

Availability

XPC850DEZT50BU is available at Aetrix Electronics and suitable for DSLAM line cards, industrial protocol gateways, remote terminal units, and secure management appliances requiring stable component supply across extended product lifecycles.

Supply support for XPC850DEZT50BU includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Freescale Semiconductor (now part of NXP Semiconductors) pioneered PowerQUICC™ communications processors for embedded networking, emphasizing integration, power efficiency, and real-time protocol acceleration.

The XPC850DEZT50BU belongs to the MPC850 family - designed specifically for cost-sensitive, remote-access, and telecommunications edge devices requiring Ethernet, HDLC, USB, and PCMCIA-ATA in a single-chip solution.

FAQ

What is the maximum supported bus frequency for the XPC850DEZT50BU?

The XPC850DEZT50BU supports a maximum bus frequency of 50 MHz. Higher internal clock speeds (e.g., 66 MHz or 80 MHz) require operation in half-speed bus mode - meaning a 66-MHz part must be configured for a 33-MHz bus. This constraint is enforced by the memory controller's timing specification and documented in Table 6 of the MPC850 hardware spec. XPC850DEZT50BU adheres strictly to this 50-MHz bus limit.

Does the XPC850DEZT50BU support USB host mode?

Yes, the XPC850DEZT50BU includes a full-speed USB 1.1 controller that supports both host and slave (device) modes at 12 Mbps and low-speed mode at 1.5 Mbps. Its eight endpoint buffers and dedicated serial DMA channels allow concurrent handling of multiple USB transactions without CPU overhead. This capability is confirmed in Section 2 (Features) and Table 1 of the MPC850 Hardware Specifications document.

What package type and pin count does the XPC850DEZT50BU use?

The XPC850DEZT50BU uses a 324-pin Plastic Ball Grid Array (PBGA) package with a 27 mm × 27 mm body and 1.27 mm ball pitch. This package is explicitly listed in Section 9 ("Mechanical Data and Ordering Information") of the MPC850 Hardware Specifications Rev. 2. Pin compatibility is maintained across the MPC850 family, including MPC850DE, MPC850SR, and MPC850DSL variants in the same PBGA format.

How much dual-port RAM is integrated into the XPC850DEZT50BU?

The XPC850DEZT50BU integrates 8 Kbytes of on-chip dual-port RAM, shared between the main MPC8xx core and the communications processor module (CPM). This RAM is used for packet buffering, descriptor tables, and protocol-specific data structures. The 8-Kbyte size is explicitly stated in the Overview section and confirmed in the Features list - distinguishing it from the base MPC850 (2-Kbyte) and MPC852 (4-Kbyte) variants.

Is the XPC850DEZT50BU pin-compatible with other MPC850 family members?

Yes, the XPC850DEZT50BU is pin-compatible with other MPC850 family members in the same 324-pin PBGA package, including MPC850SR, MPC850DSL, and MPC850. All share identical mechanical footprint, power pin allocation (VDDH/VDDL/KAPWR/VDDSYN), and signal routing for address/data buses, control lines, and peripheral interfaces. Functional differences (e.g., ATM support in MPC850SR) do not affect pin assignment or electrical behavior.