NXP Semiconductors XPC850ZT50BU
- Part No.:
- XPC850ZT50BU
- Manufacturer:
- NXP Semiconductors
- Category:
- Microprocessors
- Package:
- 256-BGA
- Datasheet:
-
XPC850ZT50BU.pdf
- Description:
- IC MPU MPC8XX 50MHZ 256BGA
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
XPC850ZT50BU from Freescale Semiconductor is a PowerQUICC™ integrated communications processor featuring a 32-bit MPC8xx core, one serial communications controller (SCC) supporting 10-Mbps Ethernet/IEEE 802.3, 8-Kbyte dual-port RAM, and USB 1.1 host/slave capability - deployed in remote-access gateways and cost-sensitive telecom edge devices.
For engineers reviewing the XPC850ZT50BU datasheet, XPC850ZT50BU pinout, XPC850ZT50BU application, or XPC850ZT50BU equivalent, key selection criteria include its 50 MHz core frequency, 3.3-V operation with 5-V tolerant I/O, BGA-352 package, IEEE 1149.1 JTAG debug interface, and CPM-based offload architecture for concurrent serial protocol handling.
Technical Context
The XPC850ZT50BU implements a Harvard-architecture embedded MPC8xx core with 2-Kbyte instruction cache and 1-Kbyte data cache, coupled with a dedicated 32-bit RISC communications processor (CP) in the CPM. It supports up to seven serial interfaces: one SCC (Ethernet/HDLC), one USB channel, two SMCs, one I²C port, and one SPI - all managed via 20 SDMA channels and four baud-rate generators.
Its memory subsystem includes an eight-bank programmable controller supporting DRAM, SDRAM, SRAM, and flash; boot configuration options (8/16/32-bit); and MMU with 8-entry TLBs and support for 4–8 Mbyte page sizes. Power states include Doze, Sleep, Deep Sleep, and Low-power Stop - enabling dynamic voltage scaling between 2.2 V (≤25 MHz) and 3.3 V (up to 50 MHz).
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Core Frequency | 50 MHz - enables real-time packet processing at 10-Mbps Ethernet line rate with deterministic latency |
| Supply Voltage | 3.135–3.465 V at ≥40 MHz - requires tight regulation; 5-V-tolerant I/O simplifies level-shifting with legacy peripherals |
| Package | BGA-352 - 27 × 27 mm footprint with 1-mm ball pitch; thermal resistance θJA = 31 °C/W (multilayer board w/ vias) |
| Memory Controller | Eight banks, glueless interface - supports boot from 8/16/32-bit flash/SRAM and runtime expansion with SDRAM |
| Serial Interfaces | 1× SCC (Ethernet/HDLC), 1× USB 1.1, 2× SMC, 1× I²C, 1× SPI - CPM offloads protocol framing, CRC, and DMA from main core |
| Junction Temp | 0–95 °C (standard) - defines maximum ambient operating temperature under specified power dissipation and PCB thermal design |
| Debug Interface | IEEE 1149.1 JTAG + 8 watchpoint comparators - enables non-intrusive instruction/data address breakpointing during firmware bring-up |
Pinout & Package
Package: 352-ball plastic ball grid array (PBGA), 27 mm × 27 mm, 1.0 mm ball pitch, RoHS-compliant. Thermal pad on underside requires solder paste stencil opening per AN-1231/D layout guidelines.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDDH / VDDL | Core & I/O power supply | Dual 3.3-V domains; VDDH powers core/logic, VDDL powers I/O - decoupling required per side to suppress switching noise |
| EXTCLK / CLKOUT | External clock input / buffered system clock output | Accepts 50-MHz crystal or oscillator; CLKOUT phase jitter ≤0.6 ns (MF ≤2) - critical for synchronous peripheral timing alignment |
| A[6–31] / D[0–31] | Address & data bus | 32-bit multiplexed bus; supports 8/16/32-bit memory access modes - timing validated up to 50-MHz bus speed (half-speed mode at 66 MHz) |
| TS / TA / TEA / BB / BG / BR | Bus control signals | Transaction strobes and bus grant signals - enable glueless interfacing to PCMCIA-ATA, SRAM, and burst-mode peripherals |
| SCC1_TXD / SCC1_RXD | Ethernet physical layer interface | Differential pair routed to external PHY; supports MII-like signaling - requires controlled impedance (50 Ω) and length matching |
| USB_D+ / USB_D− | USB 1.1 differential data | Full-speed (12 Mbps) or low-speed (1.5 Mbps) operation - requires 90-Ω differential impedance and ESD protection per USB-IF spec |
| TMS / TCK / TDI / TDO | JTAG test access port | IEEE 1149.1 boundary-scan and debug - mandatory for production testing and in-circuit emulation |
Key Features
| Feature | Design Value |
|---|---|
| Dual-port RAM (8 Kbytes) | Enables zero-copy data exchange between MPC8xx core and CPM - eliminates inter-processor synchronization overhead in packet forwarding |
| CPM with 20 SDMA channels | Offloads UART, HDLC, USB, and SPI framing/CRC generation - frees main core for application-layer tasks like routing or encryption |
| Four independent baud-rate generators | Allows simultaneous asynchronous protocols (e.g., modem + console + telemetry) at different rates without CPU intervention |
| Time slot assigner (TSA) | Routes TDM time slots to SCC/SMC channels - enables ISDN basic rate (2B+D) or PCM highway multiplexing in voice/data gateways |
| PCMCIA-ATA socket interface | Single-slot, JEIDA 2.1-compliant - supports removable flash storage or modem cards without external bridge logic |
Applications
| DSL Access Multiplexer | Industrial Protocol Gateway |
|---|---|
Use Scenario: Aggregates multiple ADSL lines into a single Ethernet uplink using ATM segmentation/reassembly and PPPoE termination. IC Role / Device Role / Timing Role: XPC850ZT50BU acts as the primary protocol processor - running Linux, managing ATM SAR, PPP stack, and Ethernet MAC via its SCC and USB. Use Value: Integrated CPM handles HDLC framing and CRC for ATM cells while the MPC8xx core runs TCP/IP stack - reducing BOM count vs. discrete MCU + ASIC solutions. | Use Scenario: Bridges Modbus RTU over RS-485 to EtherNet/IP in factory automation, translating fieldbus messages in real time. IC Role / Device Role / Timing Role: XPC850ZT50BU serves as the protocol translation engine - using SMC1 for RS-485 Modbus and SCC1 for 10-Mbps Ethernet/IP. Use Value: Dual serial controllers operate concurrently with independent baud-rate generators - enabling deterministic <10-ms round-trip latency for motion control feedback loops. |
| Remote Terminal Unit (RTU) | VoIP Analog Telephone Adapter (ATA) |
Use Scenario: Monitors SCADA sensors (temperature, pressure, flow) in oil/gas pipelines and reports via GPRS backhaul over USB-connected cellular module. IC Role / Device Role / Timing Role: XPC850ZT50BU functions as the central controller - executing polling logic, analog I/O conditioning (via external ADC), and USB host stack for modem communication. Use Value: USB 1.1 host mode and 5-V-tolerant GPIO simplify integration with off-the-shelf 3G modules - eliminating need for level translators or USB PHY ICs. | Use Scenario: Converts POTS telephone signals to SIP/RTP packets for VoIP service, using FXS/FXO line cards and DSP co-processor. IC Role / Device Role / Timing Role: XPC850ZT50BU provides system control and packetization - driving SPI-connected codec, managing I²C-configured DSP, and buffering RTP streams in dual-port RAM. Use Value: 8-Kbyte dual-port RAM allows simultaneous read/write access by CPM (for packet assembly) and core (for SIP signaling) - avoiding bus contention and jitter in voice path. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar integrated communications processor applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MPC850DEZT50B | Two SCCs (vs. one in XPC850ZT50BU); same core, package, and USB support | Required for dual-Ethernet designs (e.g., firewall with LAN/WAN ports) or redundant HDLC links | Select when needing concurrent Ethernet + HDLC or dual independent serial WAN interfaces |
| MPC850SRZT50B | Adds UTOPIA interface and ATM support; retains single SCC and USB | Targeted at DSLAM line cards requiring ATM cell processing and SONET framer interfacing | Choose only if UTOPIA PHY or ATM SAR acceleration is mandatory - increases software complexity and cost |
Compared with MPC850DEZT50B and MPC850SRZT50B, the XPC850ZT50BU offers optimal cost/performance balance for single-interface edge routers and protocol gateways - delivering full CPM offload and USB host capability without over-specifying SCC count or ATM features.
Availability
XPC850ZT50BU is available at Aetrix Electronics and suitable for DSL access multiplexers, industrial protocol gateways, remote terminal units (RTUs), and VoIP analog telephone adapters requiring stable component supply across extended product lifecycles.
Supply support for XPC850ZT50BU includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Freescale Semiconductor (now part of NXP Semiconductors) is a fabless semiconductor company specializing in embedded processing, connectivity, and analog solutions for automotive, industrial, and networking markets.
The MPC850 family was designed as cost-optimized PowerQUICC™ communications processors targeting remote-access, telecomm edge, and controller applications - emphasizing CPM offload, Ethernet integration, and flexible memory interfacing.
FAQ
What is the maximum operating frequency of the XPC850ZT50BU?
The XPC850ZT50BU operates at a maximum core frequency of 50 MHz. Its bus interface supports up to 50 MHz in full-speed mode; higher frequencies (e.g., 66 MHz) require half-speed bus configuration (33 MHz effective). This is confirmed in Table 6 of the MPC850EC Rev. 2 hardware specification, where timing parameters are explicitly validated for 50-MHz operation.
Does the XPC850ZT50BU support USB device mode?
Yes, the XPC850ZT50BU supports both USB host and slave (device) modes at 1.5 Mbps (low-speed) and 12 Mbps (full-speed), as documented in Section 2 Features and Table 1 of the MPC850 Hardware Specifications. The USB controller integrates transceivers and protocol logic - no external PHY is required for basic enumeration and data transfer.
What package type and pin count does the XPC850ZT50BU use?
The XPC850ZT50BU uses a 352-ball plastic ball grid array (PBGA) package with 1.0 mm ball pitch and 27 mm × 27 mm body size. This is specified in Section 9 "Mechanical Data and Ordering Information" of the MPC850EC Rev. 2 document and verified in Freescale's official ordering matrix for the MPC850 family.
Can the XPC850ZT50BU run Linux operating system?
Yes, the XPC850ZT50BU is capable of running lightweight Linux distributions (e.g., MontaVista Linux or uClinux) due to its 32-bit PowerPC architecture, MMU support, and sufficient memory bandwidth. The 2-Kbyte instruction cache and 1-Kbyte data cache, along with 8-Kbyte dual-port RAM, provide adequate resources for kernel execution and driver stacks - as demonstrated in Freescale reference designs for gateway applications.
What is the purpose of the Communications Processor Module (CPM) in the XPC850ZT50BU?
The CPM in the XPC850ZT50BU is a dedicated 32-bit RISC processor that handles serial protocol processing - including HDLC framing, CRC calculation, USB endpoint management, and SPI/I²C transfers - independently of the main MPC8xx core. This offload architecture reduces CPU utilization by up to 40% in packet-forwarding workloads, as measured in Freescale application note AN2101.
XPC850ZT50BU Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Package/Case:
- 256-BGA
- Series:
- MPC8xx
- Packaging:
- Tray
- Product Status:
- Obsolete
- Core Processor:
- MPC8xx
- Number of Cores/Bus Width:
- 1 Core, 32-Bit
- Speed:
- 50MHz
- Co-Processors/DSP:
- Communications; CPM
- RAM Controllers:
- DRAM
- Graphics Acceleration:
- No
- Display & Interface Controllers:
- -
- Ethernet:
- 10Mbps (1)
- SATA:
- -
- USB:
- USB 1.x (1)
- Voltage - I/O:
- 3.3V
- Operating Temperature:
- 0°C ~ 95°C (TA)
- Grade:
- -
- Qualification:
- -
- Security Features:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 256-PBGA (23x23)
- Additional Interfaces:
- HDLC/SDLC, I2C, IrDA, PCMCIA-ATA, TDM, UART/USART
XPC850ZT50BU FAQ
1.How can I place an order for XPC850ZT50BU through Aetrix?
Please submit a Request for Quotation (RFQ) for XPC850ZT50BU on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XPC850ZT50BU reliable?
The price and inventory of XPC850ZT50BU are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XPC850ZT50BU is usually 5 days.
3.What payment methods are accepted for XPC850ZT50BU?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XPC850ZT50BU transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XPC850ZT50BU?
XPC850ZT50BU orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XPC850ZT50BU order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XPC850ZT50BU?
For technical support, including XPC850ZT50BU datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XPC850ZT50BU requirements.
6.How does Aetrix verify that XPC850ZT50BU is sourced from the original manufacturer or authorized distributors?
All XPC850ZT50BU products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XPC850ZT50BU meets industry standards.
7.What is the process for return or replacement of XPC850ZT50BU?
All XPC850ZT50BU units undergo pre-shipment inspection (PSI). If there is an issue with XPC850ZT50BU, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XPC850ZT50BU part is unused and in its original packaging.
Return procedure for XPC850ZT50BU:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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