STMicroelectronics XS0015/TR

Overview

XS0015/TR from STMicroelectronics is a 14-pad surface-mount socket designed exclusively for the VS6502 VGA CMOS image sensor module. It enables reflow-compatible PCB mounting of the SmOP (Small Optical Package) sensor, supports 4- or 5-wire digital video interface (D[4:0], QCLK), and maintains precise mechanical alignment for optical performance with 47° HFOV lens compatibility. Used in miniature USB webcams and embedded handheld cameras.

For engineers reviewing the XS0015/TR datasheet, XS0015/TR pinout, XS0015/TR application, or XS0015/TR equivalent, this socket's mechanical tolerance (±0.05 mm pad pitch), thermal reflow compatibility (JEDEC J-STD-020 compliant), and direct mating with VS6502's 10.6 × 8.7 × 5.8 mm SmOP package are critical selection criteria.

Technical Context

The XS0015/TR is a passive mechanical interconnect-not an active component-and provides zero electrical functionality. Its sole purpose is to enable standardized, solder-reflow-compatible attachment of the VS6502 sensor module to host PCBs while preserving optical axis alignment and signal integrity for D[4:0], SDA/SCL, CLKIN, CHIPEN, and power rails.

It mates precisely with the VS6502's 14-pad SmOP1.5 footprint (pad pitch 0.5 mm, pad width 0.25 mm, pad length 0.6 mm), accommodates 0.15 mm maximum coplanarity deviation, and is rated for ≥500 thermal cycles per JEDEC standards. No electrical parameters, timing, or logic behavior apply.

Key Specifications

Availability

XS0015/TR is available at Aetrix Electronics and suitable for miniature USB webcams, embedded handheld cameras, and network camera modules requiring stable component supply and repeatable optical assembly processes.

Supply support for XS0015/TR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

STMicroelectronics is a global semiconductor leader headquartered in Geneva, Switzerland, specializing in analog, MEMS, imaging, and microcontroller technologies for industrial, automotive, and consumer applications.

The XS0015/TR belongs to ST's SmOP (Small Optical Package) ecosystem, engineered to simplify optical module integration by decoupling sensor mounting mechanics from electrical design-enabling rapid prototyping and high-yield manufacturing of compact vision systems.

FAQ

Is XS0015/TR electrically active or does it contain circuitry?

No. XS0015/TR is a purely passive mechanical socket with no internal traces, vias, or conductive layers beyond its 14 gold-plated contact pads. It provides zero signal conditioning, impedance matching, or ESD protection-its function is strictly physical interconnection and optical alignment for the VS6502 sensor module.

Can XS0015/TR be used with sensors other than VS6502?

No. XS0015/TR is dimensionally and mechanically tailored to the VS6502's SmOP1.5 package (10.6 × 8.7 × 5.8 mm, 14-pad layout, 0.5 mm pitch). Its pad geometry, cavity depth, and lens clearance are not compatible with any other ST sensor or third-party module-even those sharing "SmOP" nomenclature but differing in mechanical spec.

What reflow profile is recommended for XS0015/TR soldering?

XS0015/TR is qualified for standard Pb-free reflow per JEDEC J-STD-020: peak temperature 260°C, time above liquidus (TAL) 60–150 seconds, ramp-up rate ≤3°C/s. Preheat must stay below 150°C for ≤90 seconds to prevent LCP housing warpage or pad delamination.

Does XS0015/TR include mounting hardware or retention features?

No. XS0015/TR is a bare socket without screws, clips, or adhesive. Mechanical retention relies entirely on solder joint strength after reflow. ST recommends using stencil-applied solder paste (type 4 or 5) with 0.12 mm thickness and verifying post-reflow coplanarity ≤0.15 mm before VS6502 insertion.