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Home > Products > Integrated Circuits (ICs) > Clock/Timing > Application Specific Clock/Timing

Microchip Technology ZL30270LDG1S

Name: ZL30270LDG1S
Brand: Microchip Technology
SKU: ZL30270LDG1S
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

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Part No.:: ZL30270LDG1S

Manufacturer:: Microchip Technology

Category:: Application Specific Clock/Timing

Package:: 48-VFQFN Exposed Pad

Datasheet:: ZL30270LDG1S.pdf

Description:: 6-OUTPUT CLOCK GENERATOR (APLL-O

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Product details

Overview

ZL30270LDG1S from Microchip Technology is a 6-output, 5-synthesizer any-to-any frequency clock generator with ultra-low jitter (100 fsRMS typical at 156.25 MHz), supporting differential (LVDS/LVPECL) and dual-CMOS outputs, and integrated JESD204B/C/D SYSREF generation for high-speed data converter timing in 5G wireless infrastructure and optical transport systems.

For engineers reviewing the ZL30270LDG1S datasheet, ZL30270LDG1S pinout, ZL30270LDG1S application, or ZL30270LDG1S equivalent, key selection criteria include per-output phase alignment (1 ps resolution), crystal or CMOS input flexibility (24–400 MHz), programmable output voltage (1.5–3.3 V), and self-configuration from internal Flash memory - critical for deterministic boot in telecom and FPGA-based systems.

Technical Context

The ZL30270LDG1S implements five independent APLL-based synthesizers enabling simultaneous generation of up to six differential or twelve single-ended output clocks, each configurable for LVDS, LVPECL, Low-VCM, or 2xCMOS formats with per-output duty cycle and glitchless start/stop control. Input reference sources include either a 24–60 MHz crystal or a 10–400 MHz CMOS clock on OSCB.

Each synthesizer supports numerically controlled oscillator (NCO) behavior with sub-0.005 ppt frequency steering resolution, spread-spectrum modulation (PCIe-compliant), and precise phase alignment across outputs via per-synth and per-output phase adjustment. Output jitter meets OC-192, STM-64, and 100G Ethernet requirements (12 kHz–20 MHz integration band).

Key Specifications

Parameter	Value and Actual Design Meaning
Output count	6 differential (OUT0P/N to OUT5P/N) or up to 12 CMOS outputs - enables multi-domain clocking for FPGAs and ASICs without external fanout buffers.
Frequency range	0.5 Hz to 750 MHz (250 MHz max for CMOS) - covers PCIe Gen1–5, Synchronous Ethernet, OTN, and JESD204B/C/D base clocks.
Jitter (RMS)	100 fs typical at 156.25 MHz (12 kHz–20 MHz) - meets IEEE 1588 PTP Class C and ITU-T G.8262 EEC-2 requirements.
Input reference	Crystal (24–60 MHz) or CMOS clock (10–400 MHz on OSCB) - eliminates need for external VCXO or loop filter components.
Phase resolution	1 ps per-output and per-synthesizer adjustment - compensates for PCB trace skew and enables deterministic SYSREF alignment.
Power supply	1.8 V core (VDD18), 3.3 V core (VDD33), and programmable 1.5–3.3 V per-output supplies (VDDO0–VDDO5) - supports mixed-voltage system interfacing.
Interface	SPI or I²C host interface with 7 factory-configurable Flash profiles - enables zero-configuration power-up in carrier-grade equipment.

Pinout & Package

Package: 48-lead 7 mm × 7 mm VQFN (0.5 mm pitch), RoHS-compliant, exposed thermal pad (VSS/E-pad).

Pin/Terminal	Circuit Role	Design Meaning
OUT0P / OUT0N	Differential clock output pair	Configurable as LVDS, LVPECL, Low-VCM, or dual-CMOS; supports independent frequencies (e.g., 125 MHz / 25 MHz) in 2xCMOS mode.
OUT1P / OUT1N to OUT5P / OUT5N	Differential clock output pairs	Five additional synthesizer-driven outputs; each pair has dedicated VDDO supply (VDDO1–VDDO5) for noise isolation and voltage flexibility (1.5–3.3 V).
OSCB	Single-ended clock input	Accepts 10–400 MHz CMOS reference; used instead of crystal when low-phase-noise local oscillator is available.
OSCI / OSCO	Crystal oscillator interface	Supports 24–60 MHz fundamental-mode crystals; on-chip driver eliminates external load capacitors.
VDD18 / VDD33 / VDDIO	Core and I/O power supplies	Separate 1.8 V (core logic), 3.3 V (core analog), and 1.8–3.3 V (GPIO/SPI/I²C) rails - ensures clean switching and level compatibility.
RST_B	Active-low reset input	Must be held low ≥2 ms after power-up; internal 85 kΩ pull-up to VDD33 - guarantees deterministic initialization before register access.
SCK_SCL / SI_SDA / SO_IF1 / CS_B_IF0	SPI/I²C host interface	Configurable at power-up via IF0/IF1 pins; supports LSB/MSB-first SPI burst mode and standard I²C addressing (7-bit device address).
GPIO0_AC0 to GPIO4_AC4	General-purpose I/O / auto-configuration	Five pins support status indication, interrupt output, or Flash configuration selection (000–110 = config 0–6; 111 = factory default).

Key Features

Feature	Design Value
Any-to-any frequency synthesis	Five independent synthesizers generate exact output frequencies (0.5 Hz–750 MHz) with 0 ppm error - eliminates need for multiple discrete clock ICs.
JESD204B/C/D clock + SYSREF	Integrated SYSREF generation with per-output skew adjustment - enables deterministic multi-device synchronization in high-speed ADC/DAC arrays.
Per-output glitchless enable/disable	Each output can be started/stopped without transient spikes or metastability - critical for hot-plug and power-gating applications.
Internal Flash configuration	Seven user-programmable configurations stored in nonvolatile memory - allows field-upgradable timing profiles without host processor involvement.
Programmable output common-mode	LVDS/LVPECL/Low-VCM outputs support adjustable common-mode voltage - ensures robust signal integrity across diverse receiver inputs.
Numerically controlled oscillator (NCO)	Software-controlled frequency tuning with <0.005 ppt resolution - supports dynamic clock compensation in precision timing applications like IEEE 1588 grandmasters.

Applications

5G Radio Unit Timing	Optical Transport Network (OTN) Line Cards
Use Scenario: Synchronizing massive MIMO RF front-ends and fronthaul interfaces in Open RAN radio units requiring sub-nanosecond inter-clock alignment. IC Role / Device Role / Timing Role: Primary clock generator providing JESD204B/C/D sampling clocks and SYSREF signals to multiple ADCs/DACs and FPGA-based digital front-end processors. Use Value: 1 ps per-output phase resolution and deterministic SYSREF skew control ensure coherent beamforming across distributed antenna elements.	Use Scenario: Generating line-rate clocks (e.g., 10.709 GHz derived, 12.5 GHz, 25 GHz) and client-layer clocks (e.g., 156.25 MHz, 311.04 MHz) in OTN multiplexers/demultiplexers. IC Role / Device Role / Timing Role: Multi-synthesizer clock source delivering SDH/SONET, OTU2/3/4, and SyncE-compliant clocks with jitter below ITU-T G.8262 EEC-2 limits. Use Value: 100 fsRMS jitter at 156.25 MHz and 12 kHz–20 MHz integration meets stringent BER requirements for 400G ZR coherent optics.
FPGA-Based Test Equipment	High-Performance Computing Accelerators
Use Scenario: Providing precisely aligned clocks to high-speed serial transceivers, memory controllers, and custom logic in automated test equipment (ATE) platforms. IC Role / Device Role / Timing Role: Reference clock generator feeding multiple FPGA banks with independent frequency domains (e.g., 250 MHz for PCIe, 300 MHz for DDR4, 1 GHz for sampling). Use Value: Five synthesizers and 6 differential outputs eliminate external clock trees, reducing layout complexity and jitter accumulation.	Use Scenario: Clocking AI accelerators and GPU interconnects requiring PCIe Gen5 (32 GT/s), CXL 3.0, and HBM3 memory interfaces with tight skew budgets. IC Role / Device Role / Timing Role: System-level clock hub generating PCIe REFCLK, CXL SYSCLK, and HBM3 PHY clocks with per-lane phase alignment. Use Value: Per-output duty cycle adjustment and glitchless start/stop enable safe power-state transitions during dynamic voltage/frequency scaling (DVFS).

5G Radio Unit Timing

Optical Transport Network (OTN) Line Cards

Use Scenario: Synchronizing massive MIMO RF front-ends and fronthaul interfaces in Open RAN radio units requiring sub-nanosecond inter-clock alignment.

IC Role / Device Role / Timing Role: Primary clock generator providing JESD204B/C/D sampling clocks and SYSREF signals to multiple ADCs/DACs and FPGA-based digital front-end processors.

Use Value: 1 ps per-output phase resolution and deterministic SYSREF skew control ensure coherent beamforming across distributed antenna elements.

Use Scenario: Generating line-rate clocks (e.g., 10.709 GHz derived, 12.5 GHz, 25 GHz) and client-layer clocks (e.g., 156.25 MHz, 311.04 MHz) in OTN multiplexers/demultiplexers.

IC Role / Device Role / Timing Role: Multi-synthesizer clock source delivering SDH/SONET, OTU2/3/4, and SyncE-compliant clocks with jitter below ITU-T G.8262 EEC-2 limits.

Use Value: 100 fsRMS jitter at 156.25 MHz and 12 kHz–20 MHz integration meets stringent BER requirements for 400G ZR coherent optics.

FPGA-Based Test Equipment

High-Performance Computing Accelerators

Use Scenario: Providing precisely aligned clocks to high-speed serial transceivers, memory controllers, and custom logic in automated test equipment (ATE) platforms.

IC Role / Device Role / Timing Role: Reference clock generator feeding multiple FPGA banks with independent frequency domains (e.g., 250 MHz for PCIe, 300 MHz for DDR4, 1 GHz for sampling).

Use Value: Five synthesizers and 6 differential outputs eliminate external clock trees, reducing layout complexity and jitter accumulation.

Use Scenario: Clocking AI accelerators and GPU interconnects requiring PCIe Gen5 (32 GT/s), CXL 3.0, and HBM3 memory interfaces with tight skew budgets.

IC Role / Device Role / Timing Role: System-level clock hub generating PCIe REFCLK, CXL SYSCLK, and HBM3 PHY clocks with per-lane phase alignment.

Use Value: Per-output duty cycle adjustment and glitchless start/stop enable safe power-state transitions during dynamic voltage/frequency scaling (DVFS).

Equivalent & Alternatives

The following parts are listed as comparable options for similar clock generator applications.

Alternative Part	Technical Difference	Application Difference	Selection Advice
Si5341-B-GM	4-output, 4-input, 12-output fanout variant; higher integration (integrated LDOs); 80 fsRMS jitter at 156.25 MHz; requires external loop filter for some modes.	Better suited for compact, low-power systems with integrated power management; less flexible for mixed-differential/CMOS output routing.	Select Si5341-B-GM when board space and power delivery simplicity outweigh need for 6 independent synthesizers and 2xCMOS mode.
LMK04832RHAT	3-output, dual-loop architecture; supports JESD204B only (no C/D); 110 fsRMS jitter; requires external VCXO and loop filter for best performance.	Targeted at radar and instrumentation where dual-loop holdover stability is prioritized over multi-frequency flexibility.	Choose LMK04832RHAT when long-term holdover accuracy and dual-loop redundancy are required, and 6-output synthesis is unnecessary.

Compared with Si5341-B-GM and LMK04832RHAT, the ZL30270LDG1S offers superior configurability for heterogeneous clock domains - its five independent synthesizers, 2xCMOS output mode, and Flash-based self-configuration provide greater design reuse across 5G, OTN, and compute platforms without hardware changes.

Availability

ZL30270LDG1S is available at Aetrix Electronics and suitable for 5G infrastructure, optical transport line cards, FPGA-based test equipment, and high-performance computing accelerators requiring stable component supply, long-term lifecycle assurance, and full traceability.

Supply support for ZL30270LDG1S includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Microchip Technology is a global semiconductor company specializing in microcontrollers, analog devices, and timing solutions, with broad IP portfolios in secure communication and embedded control.

The ZL30270LDG1S belongs to Microchip's ZL30270/ZL30271 family of high-performance clock generators, designed specifically for carrier-grade synchronization in 5G, OTN, and JESD204B/C/D-based data converter systems.

FAQ

What is the maximum output frequency supported by ZL30270LDG1S in LVDS mode?

ZL30270LDG1S supports differential output frequencies up to 750 MHz in LVDS, LVPECL, or Low-VCM modes. This capability enables direct clocking of high-speed SerDes lanes in 400G Ethernet and OTU4 interfaces. The 750 MHz limit applies regardless of input reference source - whether crystal (24–60 MHz) or CMOS clock (10–400 MHz). Electrical specifications for LVDS outputs are defined in Table 9-6 of the DS20006639F datasheet.

Does ZL30270LDG1S support JESD204C SYSREF generation?

Yes, ZL30270LDG1S natively supports JESD204B, JESD204C, and JESD204D SYSREF generation with programmable skew adjustment per output. This allows precise alignment of SYSREF edges across multiple converters in multi-chip synchronization scenarios. The device's per-output phase adjustment (1 ps resolution) and dedicated SYSREF output path ensure sub-cycle alignment accuracy required by JESD204C Subclass 2 and 3 implementations.

Can ZL30270LDG1S operate without an external crystal?

Yes, ZL30270LDG1S can operate using only the OSCB pin as a single-ended CMOS clock input (10–400 MHz), bypassing the crystal oscillator circuit entirely. In this configuration, OSCI and OSCO are left unconnected (OSCI tied to ground via 1 kΩ resistor), and OSCA is left floating. This mode is commonly used when a low-jitter local oscillator is already present in the system, eliminating crystal-related layout constraints and startup delays.

How many independent power supplies does ZL30270LDG1S require?

ZL30270LDG1S requires three primary supply domains: VDD18 (1.8 V ±5% for core logic), VDD33 (3.3 V ±5% for analog/PLL circuits), and VDDIO (1.8–3.3 V for GPIO/SPI/I²C). Additionally, it has six dedicated output power supplies - VDDO0 through VDDO5 - each configurable from 1.5 V to 3.3 V to match connected receivers' voltage requirements. All supplies must be independently filtered per datasheet recommendations in Section 5.4.

Is ZL30270LDG1S pin-compatible with ZL30271?

No, ZL30270LDG1S is not pin-compatible with ZL30271. ZL30270LDG1S uses a 48-lead 7 mm × 7 mm VQFN package (DS20006639F, Figure 3-2), while ZL30271 uses a 64-lead 9 mm × 9 mm VQFN package (Figure 3-1). Although both share functional pin naming (e.g., OUT0P, OSCB), their pin counts, layouts, and power supply pin allocations differ significantly - requiring separate PCB footprints and layout validation.

ZL30270LDG1S Specifications

Product attributes: Attribute value

Manufacturer:: Microchip Technology

Series:: -

Package/Case:: 48-VFQFN Exposed Pad

Packaging:: Tray

Product Status:: Active

Programmable:: Not Verified

PLL:: Yes

Main Purpose:: Memory, PCI Express (PCIe), SONET/SDH

Input:: CMOS, Crystal

Output:: CMOS, LVDS, LVPECL

Number of Circuits:: 1

Ratio - Input:Output:: 3:6

Differential - Input:Output:: No/Yes

Frequency - Max:: 750MHz

Voltage - Supply:: 1.71V ~ 1.89V, 3.135V ~ 3.465V

Operating Temperature:: -40°C ~ 85°C (TA)

Mounting Type:: Surface Mount

Grade:: -

Qualification:: -

Supplier Device Package:: 48-VQFN (7x7)

ZL30270LDG1S FAQ

1.How can I place an order for ZL30270LDG1S through Aetrix?

Please submit a Request for Quotation (RFQ) for ZL30270LDG1S on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for ZL30270LDG1S reliable?

The price and inventory of ZL30270LDG1S are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for ZL30270LDG1S is usually 5 days.

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ZL30270LDG1S orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your ZL30270LDG1S order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for ZL30270LDG1S?

For technical support, including ZL30270LDG1S datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your ZL30270LDG1S requirements.

6.How does Aetrix verify that ZL30270LDG1S is sourced from the original manufacturer or authorized distributors?

All ZL30270LDG1S products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that ZL30270LDG1S meets industry standards.

7.What is the process for return or replacement of ZL30270LDG1S?

All ZL30270LDG1S units undergo pre-shipment inspection (PSI). If there is an issue with ZL30270LDG1S, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The ZL30270LDG1S part is unused and in its original packaging.

Return procedure for ZL30270LDG1S:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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