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Renesas ZSC31010CEB
- Part No.:
- ZSC31010CEB
- Manufacturer:
- Renesas
- Category:
- Sensor and Detector Interfaces
- Package:
- -
- Datasheet:
-
ZSC31010CEB.pdf
- Description:
- WAFER (UNSAWN) - BOX
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Inventory:2,135
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Product details
Overview
ZSC31010CEB from Integrated Device Technology (IDT) is a die-form sensor signal conditioner IC designed to digitally calibrate resistive bridge sensors via on-chip EEPROM. It performs second-order temperature compensation for offset and gain, supports 3–105 mV/V bridge spans, delivers ±0.25% FSO accuracy over –50°C to +150°C, and provides rail-to-rail ratiometric analog output or ZACwire™ digital output. It is used in industrial pressure transducers and automotive load cells where high-temperature stability and trimming-free calibration are required.
For engineers reviewing the ZSC31010CEB datasheet, ZSC31010CEB pinout, ZSC31010CEB application, or ZSC31010CEB equivalent, key selection considerations include its 14-bit chopper-stabilized ADC, 11-bit buffered DAC, ZACwire™ one-wire interface, –50°C to +150°C operating range, and die-level form factor requiring custom packaging integration.
Technical Context
The ZSC31010CEB integrates a true differential chopper-stabilized 14-bit ADC with programmable analog gain (6/12/24/48), a DSP engine executing second-order polynomial correction for bridge offset, gain, and linearity versus temperature, and an on-chip bandgap PTAT temperature sensor. Its digital core includes 128-byte EEPROM for storing calibration coefficients and configuration bits.
It features dual output paths: a buffered 11-bit DAC delivering 0–1 V absolute or rail-to-rail ratiometric analog voltage, and a ZACwire™ serial interface supporting Manchester-encoded one-wire communication at up to 1 kHz update rate. Power management includes a POR oscillator and power-save mode enabling 0.25 mA minimum supply current.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| ADC Resolution | 14-bit chopper-stabilized; enables ≥12-bit effective resolution across 3–105 mV/V bridge inputs with selectable gain. |
| Analog Output DAC | 11-bit buffered DAC; delivers 0–1 V absolute or rail-to-rail ratiometric output with ±10 mV absolute error. |
| Accuracy (Analog) | ±0.25% FSO over –50°C to +150°C; specifies total error including INL, DNL, and temperature drift of internal signal chain. |
| Operating Temperature | –50°C to +150°C; validated for die-level use in harsh environments such as engine bay pressure sensing. |
| Supply Voltage Range | 2.7–5.5 V (direct); 5.5–30 V (with external JFET); supports both low-power portable and high-voltage industrial systems. |
| Interface | ZACwire™ one-wire serial interface; Manchester-encoded, single-pin bidirectional communication with host MCU. |
| EEPROM | 128-byte EEPROM; stores calibration coefficients, gain/offset trim values, and system configuration for unattended operation. |
Pinout & Package
ZSC31010CEB is supplied as unsawn die on wafer, requiring customer-defined packaging and interconnect. No standardized leadframe or surface-mount package is assigned; thermal and electrical interface design must follow IDT's die handling guidelines.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDD | Analog supply input | Primary power rail (2.7–5.5 V); powers analog front-end, regulator, and digital core. |
| VSS | Analog ground reference | Return path for bridge excitation and analog signal chain; must be low-impedance and isolated from digital noise. |
| VBP / VBN | Differential bridge input | True differential inputs accepting 3–105 mV/V bridge outputs; support common-mode voltage from 1 V to VDD–1.3 V. |
| SIG™ | Analog output | Buffered DAC output; configurable as 0–1 V absolute or rail-to-rail ratiometric (0–VDD) voltage. |
| OUT/OWI | ZACwire™ bidirectional data | Single-wire digital interface; requires external pull-up; supports read/write commands and sequential bridge+temp data. |
| Bsink | Bridge sink control | Optional active-low output enabling current sinking for bridge excitation; nominal RDS(ON) = 10 Ω at VDD = 5 V. |
| Vgate | JFET gate drive | Drives external JFET for high-voltage regulation (5.5–30 V); enables operation beyond 5.5 V supply limit. |
Key Features
| Feature | Design Value |
|---|---|
| Second-order temperature compensation | Corrects offset and gain drift using PTAT-based coefficients stored in EEPROM; eliminates need for external thermistors. |
| Chopper-stabilized AFE | Reduces 1/f noise and offset drift in preamp and ADC; ensures stable 14-bit performance over full temperature range. |
| Rail-to-rail analog output | Delivers full-scale output from 0 V to VDD without headroom loss; simplifies interfacing with 5 V or 3.3 V ADCs. |
| ZACwire™ one-wire interface | Enables calibration and readout using only one GPIO pin; reduces MCU pin count and PCB routing complexity. |
| Factory-trimmable oscillator | POR clock trimmed to ±1% accuracy; eliminates need for external crystal while maintaining reliable startup timing. |
Applications
| Industrial Pressure Transducers | Automotive Load Cells |
|---|---|
|
Use Scenario: High-temperature pressure sensing in hydraulic systems and process control valves exposed to –40°C to +125°C ambient. IC Role / Device Role / Timing Role: Signal conditioner performing real-time digital correction of bridge nonlinearity and thermal drift before analog output. Use Value: Enables ±0.25% FSO accuracy without external trimming components or temperature sensors, reducing BOM cost and calibration labor. |
Use Scenario: Axle load monitoring in commercial vehicles where sensor electronics must survive under-hood temperatures up to +150°C. IC Role / Device Role / Timing Role: Bridge interface IC providing ratiometric analog output synchronized to vehicle battery voltage and compensating for thermal coefficient mismatch. Use Value: Maintains measurement integrity across extreme thermal cycling due to integrated second-order PTAT compensation and die-level thermal coupling. |
| White Goods Level Sensors | Office Automation Weighing Modules |
|
Use Scenario: Water level detection in washing machines and dishwashers using strain-gauge-based diaphragm sensors. IC Role / Device Role / Timing Role: Low-power signal conditioner delivering 0–1 V absolute analog output compatible with 8-bit microcontroller ADCs. Use Value: Achieves <0.5% FSO error over –25°C to +85°C with 0.25 mA quiescent current, extending battery life in cordless models. |
Use Scenario: Compact document weighing modules in multifunction printers requiring fast response and minimal footprint. IC Role / Device Role / Timing Role: Digital calibration engine using ZACwire™ to perform one-pass factory calibration and field re-trim via USB adapter. Use Value: Reduces calibration time by >70% versus manual potentiometer adjustment; supports automated test fixtures with PC-based software. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar sensor signal conditioning applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MAX1452AUA+ | 16-bit sigma-delta ADC, SPI interface, no integrated EEPROM; requires external memory for calibration data. | Requires additional SPI lines and external EEPROM; better suited for designs needing higher resolution than 14-bit. | Select when higher ADC resolution and flexible digital interface outweigh added component count and layout complexity. |
| AD8555ARZ | Chopper-stabilized instrumentation amplifier + DAC; analog-only signal path; no digital correction or EEPROM. | No built-in temperature compensation or digital calibration; relies on external MCU for polynomial correction. | Select when system already includes a capable MCU for real-time compensation and analog output suffices without embedded intelligence. |
Compared with MAX1452AUA+ and AD8555ARZ, the ZSC31010CEB uniquely integrates EEPROM-based second-order digital compensation, ZACwire™ one-wire interface, and die-level form factor-enabling compact, trimming-free, high-temperature sensor modules without external memory or host processor dependency.
Availability
ZSC31010CEB is available at Aetrix Electronics and suitable for industrial pressure transducers, automotive load cells, white goods level sensors, and office automation weighing modules requiring stable component supply across extended temperature ranges and long product lifecycles.
Supply support for ZSC31010CEB includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Integrated Device Technology (IDT), now part of Renesas Electronics, is a fabless semiconductor company specializing in timing, memory interface, RF, and sensor signal conditioning solutions.
The ZSC31010CEB belongs to IDT's RBicLite™ family of sensor signal conditioners, engineered specifically for cost-sensitive, high-temperature industrial and automotive bridge sensor applications requiring embedded calibration and minimal external components.
FAQ
What is the functional difference between ZSC31010CEB and ZSC31010CEG1?
ZSC31010CEB is an unsawn die on wafer intended for custom packaging integration, while ZSC31010CEG1 is the same IC in an SOP-8 package. The ZSC31010CEB requires customer-defined thermal and electrical interface design, whereas ZSC31010CEG1 offers plug-and-play mounting with standard solder-reflow compatibility. Both share identical electrical specifications, calibration capabilities, and ZACwire™ functionality.
Does ZSC31010CEB support both analog and digital output simultaneously?
No, ZSC31010CEB does not support simultaneous analog and digital output. Its SIG™ pin delivers either rail-to-rail ratiometric analog voltage or 0–1 V absolute analog voltage, while OUT/OWI provides ZACwire™ digital output. The output mode is configured during EEPROM programming and remains fixed until reprogrammed via ZACwire™ interface.
What is the maximum bridge resistance supported by ZSC31010CEB when using the Bsink feature?
When using the Bsink feature, ZSC31010CEB supports bridge resistances down to 200 Ω. The Bsink transistor has a nominal RDS(ON) of 10 Ω at VDD = 5 V, introducing ratiometricity error that increases with lower bridge resistance. For optimal accuracy, bridge resistance should exceed 1 kΩ when Bsink is enabled.
Can ZSC31010CEB operate without an external JFET at 12 V supply?
No, ZSC31010CEB cannot operate directly at 12 V supply without an external JFET. Its absolute maximum VDD rating is 6.0 V, and recommended operating range is 2.7–5.5 V. To operate from 12 V, the Vgate pin must drive an external JFET (e.g., MMFB4392) configured as a series regulator to deliver regulated 5.0 V to VDD.
How is temperature compensation implemented in ZSC31010CEB?
ZSC31010CEB implements temperature compensation using an on-chip bandgap PTAT (proportional-to-absolute-temperature) sensor and second-order polynomial correction stored in EEPROM. The DSP core applies real-time offset and gain corrections based on measured temperature, supporting compensation of bridge linearity, TCG, and TCO without external components.
ZSC31010CEB Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Renesas
- Package/Case:
- -
- Series:
- *
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Type:
- -
- Input Type:
- -
- Output Type:
- -
- Current - Supply:
- -
- Operating Temperature:
- -
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- -
- Supplier Device Package:
- -
ZSC31010CEB FAQ
1.How can I place an order for ZSC31010CEB through Aetrix?
Please submit a Request for Quotation (RFQ) for ZSC31010CEB on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for ZSC31010CEB reliable?
The price and inventory of ZSC31010CEB are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for ZSC31010CEB is usually 5 days.
3.What payment methods are accepted for ZSC31010CEB?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for ZSC31010CEB transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for ZSC31010CEB?
ZSC31010CEB orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your ZSC31010CEB order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for ZSC31010CEB?
For technical support, including ZSC31010CEB datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your ZSC31010CEB requirements.
6.How does Aetrix verify that ZSC31010CEB is sourced from the original manufacturer or authorized distributors?
All ZSC31010CEB products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that ZSC31010CEB meets industry standards.
7.What is the process for return or replacement of ZSC31010CEB?
All ZSC31010CEB units undergo pre-shipment inspection (PSI). If there is an issue with ZSC31010CEB, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The ZSC31010CEB part is unused and in its original packaging.
Return procedure for ZSC31010CEB:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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