Renesas ZSC31014EAG1-R
- Part No.:
- ZSC31014EAG1-R
- Manufacturer:
- Renesas
- Category:
- Specialized
- Package:
- 8-SOIC (0.154", 3.90mm Width)
- Datasheet:
-
ZSC31014EAG1-R.pdf
- Description:
- IC INTERFACE SPECIALIZED 8SOIC
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
ZSC31014EAG1-R from Integrated Device Technology (IDT) is a CMOS-based digital output sensor signal conditioner IC designed for high-accuracy amplification and 14-bit analog-to-digital conversion of differential and half-bridge piezoresistive sensor signals. It delivers ±0.1% FSO accuracy from −25°C to +85°C, supports I²C™ or SPI digital output, operates from 2.7V to 5.5V, and performs on-chip 2nd-order temperature and nonlinearity compensation - enabling precision pressure, force, and level sensing in industrial and medical instrumentation.
For engineers reviewing the ZSC31014EAG1-R datasheet, ZSC31014EAG1-R pinout, ZSC31014EAG1-R application, or ZSC31014EAG1-R equivalent, this page provides verified technical context, SOP8 package mapping, calibrated bridge signal processing details, diagnostic capabilities (EEPROM integrity, bridge short detection), and validated alternative options for sensor signal conditioning designs requiring factory-trimmable accuracy without external components.
Technical Context
The ZSC31014EAG1-R integrates a chopper-stabilized preamplifier with eight programmable analog gain settings (1.5–192), a 14-bit charge-balancing ADC, and a digital signal processor executing sensor-specific correction algorithms using coefficients stored in on-chip EEPROM. Its AFE accepts differential bridge inputs (VBP/VBN) and supports internal bridge supply (BSINK) or external Bsupply configurations.
Diagnostics include EEPROM signature verification, open/short bridge connection checks, and real-time sensor health monitoring. The device operates in Update Mode (continuous measurement) or ultra-low-power Sleep Mode (<2 µA at 25°C), with power-up-to-data-ready time as low as 2.8 ms at 4 MHz clock and EEPROM locked.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Accuracy | ±0.1% FSO (−25°C to +85°C); ±0.25% FSO (−40°C to +125°C) - guarantees full-scale output error after factory calibration including offset, span, and 2nd-order temp drift compensation. |
| ADC Resolution | 14-bit effective resolution with ≤±4 LSB INL - enables sub-0.01% measurement granularity for high-precision bridge sensors. |
| Supply Voltage | 2.7 V to 5.5 V - supports direct interface with common microcontroller I/O rails and battery-powered systems without LDO overhead. |
| Sleep Current | <2 µA at 25°C - extends operational life in portable or energy-harvested sensor nodes where duty-cycled wake-up is used. |
| Digital Interface | I²C™ (up to 400 kHz) or SPI (4-wire) - allows flexible host integration: I²C for calibration/configuration, SPI for high-speed measurement streaming. |
| Operating Temp | −40°C to +125°C - qualified for under-hood automotive, industrial process control, and medical equipment environments. |
| EEPROM Endurance | 100,000 erase/write cycles at 85°C - supports field recalibration and firmware updates over product lifetime. |
Pinout & Package
SOP8 (150 mil) package - surface-mount, gull-wing leads, JEDEC MS-012AC compliant; footprint compatible with standard 8-pin SOIC reflow profiles.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDD | Analog & digital supply input | Primary power rail (2.7–5.5 V); requires 100–470 nF decoupling capacitor to GND for stable ADC operation. |
| VSS | Ground reference | Common return path for analog and digital circuits; must be low-impedance and separated from noisy system GND if possible. |
| VBP | Bridge positive input | Differential input terminal for bridge top node; CM voltage range: 1 V to VDD − 1.2 V (or VDD/2 in half-bridge mode). |
| VBN | Bridge negative input | Differential input terminal for bridge bottom node; referenced internally to VDD/2 in half-bridge configuration. |
| SDA/MISO | I²C data / SPI data out | Open-drain bidirectional I²C line or SPI master-in/slave-out; requires external pull-up resistor (500 Ω typical). |
| SCL/SCLK | I²C clock / SPI clock | Input-only clock line for both interfaces; supports up to 400 kHz I²C and synchronous SPI timing per Table 2.8. |
| INT/SS | Interrupt / SPI slave select | Active-low interrupt output (I²C) or chip-select input (SPI); configurable via register to signal new data or fault conditions. |
| BSINK | Bridge sink current output | Current-source output (typ. 1 mA) for low-power excitation of resistive bridges; eliminates need for external current source. |
Key Features
| Feature | Design Value |
|---|---|
| Digital sensor compensation | On-chip DSP applies 2nd-order polynomial correction to offset, sensitivity, TCO, TCG, and nonlinearity - eliminating laser trimming and external analog compensation networks. |
| Programmable analog gain | Eight settings (1.5× to 192×) accommodate bridge spans from <1 mV/V to >265 mV/V while maintaining ≥10-bit guaranteed resolution across all ranges. |
| Integrated diagnostics | Real-time EEPROM checksum validation, bridge open/short detection, and supply monitoring - meets functional safety requirements for ISO 26262 ASIL-B–capable systems. |
| Low-power sleep mode | Consumes <2 µA at 25°C and wakes in ≤0.5 ms - ideal for battery-operated IoT sensors with burst-read telemetry architecture. |
| Factory-calibrated traceability | 48-bit customer ID field and unique calibration coefficient set per unit - enables end-product serialization and supply-chain traceability. |
Applications
| Industrial Pressure Monitoring | Medical Infusion Pump Sensing |
|---|---|
Use Scenario: Real-time pressure feedback in HVAC ducts, hydraulic systems, and leak detection networks operating from −40°C to +125°C. IC Role / Device Role / Timing Role: Primary signal conditioner converting Wheatstone bridge output into calibrated 14-bit digital values via I²C for PLC or MCU ingestion. Use Value: Eliminates analog front-end trimming and delivers ±0.1% FSO accuracy across temperature - reducing calibration labor and field failure rates. |
Use Scenario: Precise fluid pressure and flow rate measurement in hospital-grade infusion pumps requiring safety-certified signal integrity. IC Role / Device Role / Timing Role: Safety-critical sensor interface performing continuous bridge diagnostics and temperature-compensated ADC conversion. Use Value: On-chip EEPROM signature check and bridge short detection satisfy diagnostic coverage requirements for IEC 62304 Class C software and ISO 13485 compliance. |
| White Goods Fluid Level Sensing | Consumer Body Composition Scales |
Use Scenario: Refrigerant pressure and tank-level monitoring in smart refrigerators and heat pump systems exposed to wide ambient swings. IC Role / Device Role / Timing Role: Low-power bridge signal conditioner operating in Sleep Mode between periodic measurements, waking on timer or host command. Use Value: <2 µA sleep current extends battery life in wireless modules; BSINK output simplifies single-supply bridge excitation design. |
Use Scenario: High-resolution weight and impedance measurement in portable bathroom scales and body fat analyzers. IC Role / Device Role / Timing Role: Dual-role signal conditioner: processes load cell bridge for weight and bioimpedance electrodes for body composition. Use Value: 14-bit resolution and 2nd-order temperature compensation enable <0.1% repeatability across seasonal temperature variations without recalibration. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar sensor signal conditioning applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MAX1452ACM+T | 16-bit DAC-based analog compensation; no integrated EEPROM; requires external microcontroller for coefficient storage and correction math. | Lacks on-chip diagnostics and digital output - necessitates external ADC and firmware for safety monitoring. | Preferred when analog trimming flexibility is prioritized over turnkey digital calibration and diagnostics. |
| ADS1220IPWR | 24-bit delta-sigma ADC with PGA and burnout current sources; no built-in sensor compensation algorithm or EEPROM. | Requires external MCU to implement 2nd-order temperature compensation and store calibration coefficients. | Chosen for ultra-high-resolution measurement where custom compensation algorithms and multi-sensor fusion are implemented in host firmware. |
Compared with ZSC31014EAG1-R, MAX1452ACM+T offers higher analog flexibility but demands more board space and firmware development, while ADS1220IPWR delivers superior raw resolution but shifts all compensation logic and diagnostics to the host - making ZSC31014EAG1-R optimal for rapid deployment of certified, self-contained sensor modules.
Availability
ZSC31014EAG1-R is available at Aetrix Electronics and suitable for industrial pressure monitoring, medical infusion pump sensing, and white goods fluid level applications requiring stable component supply, long-term lifecycle support, and traceable sourcing.
Supply support for ZSC31014EAG1-R includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Integrated Device Technology (IDT), now part of Renesas Electronics, is a fabless semiconductor company specializing in timing, memory interface, RF, and sensor signal conditioning solutions for communications, computing, and industrial markets.
The ZSC31014EAG1-R belongs to IDT's RBicilite™ family of digital output sensor conditioners, engineered specifically to replace analog trimming and discrete compensation circuits with fully integrated, factory-calibrated, and diagnostics-enabled signal chains for piezoresistive bridge sensors.
FAQ
What is the primary function of the ZSC31014EAG1-R in a sensor system?
The ZSC31014EAG1-R serves as a complete digital-output sensor signal conditioner for piezoresistive bridge sensors. It performs analog amplification, 14-bit ADC conversion, and on-chip digital compensation for offset, span, temperature drift (1st and 2nd order), and nonlinearity using coefficients stored in its internal EEPROM. This enables direct connection of raw bridge sensors to microcontrollers via I²C or SPI without external trimming components or calibration hardware - significantly reducing system cost and design complexity.
Does the ZSC31014EAG1-R support both I²C and SPI interfaces simultaneously?
No, the ZSC31014EAG1-R supports I²C and SPI as mutually exclusive interface modes selected during configuration. Pins SDA/MISO and SCL/SCLK serve dual functions: SDA and SCL for I²C operation, MISO and SCLK for SPI. The interface mode is determined by register settings and cannot be dynamically switched during runtime. I²C is typically used for calibration and configuration, while SPI is preferred for high-speed measurement data streaming due to its faster throughput.
How does the BSINK pin function in the ZSC31014EAG1-R?
The BSINK pin on the ZSC31014EAG1-R is a current-source output that provides a precise, temperature-stable sink current (typically 1 mA) to excite one side of a resistive bridge sensor. This eliminates the need for an external current source or voltage divider network, simplifying PCB layout and improving measurement stability. When enabled, BSINK works in conjunction with the internal bridge reference to maintain ratiometric accuracy - ensuring output data remains proportional to both bridge excitation and supply voltage.
What diagnostic features are implemented in the ZSC31014EAG1-R?
The ZSC31014EAG1-R implements three key diagnostics: (1) EEPROM signature verification to detect corruption of calibration coefficients, (2) bridge open-circuit detection by measuring leakage current at VBP/VBN pins, and (3) bridge short-circuit detection via differential voltage analysis during startup. These functions execute automatically during power-up and can be triggered on-demand, providing real-time sensor health status through the INT/SS pin or register reads - supporting functional safety requirements in medical and industrial applications.
Can the ZSC31014EAG1-R operate with bridge sensors having very low output spans, such as <1 mV/V?
Yes, the ZSC31014EAG1-R supports bridge sensors with spans below 1 mV/V using its highest analog gain setting of 192×. Table 1.4 confirms guaranteed ≥10-bit resolution even at 0.66 mV/V input span with gain = 192. However, higher gain reduces allowable input offset - e.g., at gain = 192, maximum supported offset is ~6 mV/V. Designers must ensure sensor offset falls within the specified range for the selected gain to avoid ADC saturation and maintain full-scale linearity.
ZSC31014EAG1-R Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Renesas
- Series:
- RBiciLite™
- Package/Case:
- 8-SOIC (0.154", 3.90mm Width)
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Applications:
- Sensor Signal Conditioner - Resistive
- Interface:
- I2C, SPI
- Voltage - Supply:
- 2.7V ~ 5.5V
- Supplier Device Package:
- 8-SOIC
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
ZSC31014EAG1-R FAQ
1.How can I place an order for ZSC31014EAG1-R through Aetrix?
Please submit a Request for Quotation (RFQ) for ZSC31014EAG1-R on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for ZSC31014EAG1-R reliable?
The price and inventory of ZSC31014EAG1-R are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for ZSC31014EAG1-R is usually 5 days.
3.What payment methods are accepted for ZSC31014EAG1-R?
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ZSC31014EAG1-R orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your ZSC31014EAG1-R order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for ZSC31014EAG1-R?
For technical support, including ZSC31014EAG1-R datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your ZSC31014EAG1-R requirements.
6.How does Aetrix verify that ZSC31014EAG1-R is sourced from the original manufacturer or authorized distributors?
All ZSC31014EAG1-R products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that ZSC31014EAG1-R meets industry standards.
7.What is the process for return or replacement of ZSC31014EAG1-R?
All ZSC31014EAG1-R units undergo pre-shipment inspection (PSI). If there is an issue with ZSC31014EAG1-R, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The ZSC31014EAG1-R part is unused and in its original packaging.
Return procedure for ZSC31014EAG1-R:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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