Renesas ZSPM402309KITV3P0

Overview

ZSPM402309KITV3P0 from Integrated Device Technology (IDT) is an evaluation kit for the ZSPM4023-09 synchronous buck regulator IC - a 4.5V–28V input, 0.8V–5.5V adjustable output, 9A DC/DC converter in a 28-pin 5mm × 6mm QFN package. It implements adaptive on-time control, integrated 5V LDO bias supply, power-good signaling, and hiccup-mode short-circuit protection. The kit enables rapid validation of high-efficiency point-of-load designs for telecom and server power rails.

For engineers reviewing the ZSPM402309KITV3P0 datasheet, ZSPM402309KITV3P0 application notes, ZSPM402309KITV3P0 board layout, or ZSPM402309KITV3P0 compatible alternatives, this page delivers verified functional context, supply-chain readiness, and design-integration guidance specific to the ZSPM4023-09 evaluation platform - including thermal derating curves, soft-start timing, and pre-biased load startup behavior.

Technical Context

The ZSPM402309KITV3P0 provides hardware access to the ZSPM4023-09's full feature set: adaptive on-time control enabling stable operation across wide VIN/VOUT ratios (e.g., 24V→0.8V), ultra-light-load discontinuous-mode operation preserving >80% efficiency at 10mA, and internal current sensing eliminating external sense resistors. Its PCB integrates all critical passive components - including low-ESR ceramic input/output capacitors and a shielded power inductor - optimized for minimal voltage ripple and fast transient response.

This kit supports full characterization of the ZSPM4023-09's protection architecture: foldback current limiting with 12.5–20A threshold (temperature-dependent), thermal shutdown at 160°C with 15°C hysteresis, and PG assertion at 92% VOUT with 5.5% hysteresis. The board includes test points for SW, FB, CS, and PG nodes, plus dedicated pads for optional RC snubbers and ripple injection circuits per datasheet Section 3.1.4.

Key Specifications

Availability

ZSPM402309KITV3P0 is available at Aetrix Electronics and suitable for telecom infrastructure, server power management, and industrial embedded power supply development requiring stable component supply, traceable sourcing, and rapid prototyping support.

Supply support for ZSPM402309KITV3P0 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Integrated Device Technology (IDT), now part of Renesas Electronics, is a fabless semiconductor company specializing in timing, memory interface, power management, and RF solutions for communications, computing, and industrial markets.

ZSPM402309KITV3P0 supports IDT's Power Management product line - designed to accelerate adoption of high-efficiency, integrated DC/DC regulators for dense, thermally constrained point-of-load applications in datacenter and networking equipment.

FAQ

What is the primary function of the ZSPM402309KITV3P0 evaluation kit?

The ZSPM402309KITV3P0 is a fully assembled evaluation platform for the ZSPM4023-09 synchronous buck regulator IC. It enables engineers to validate performance metrics - including efficiency, transient response, thermal behavior, and protection features - under real-world conditions. The kit includes the ZSPM4023-09 IC mounted on a reference PCB with optimized layout, input/output filtering, and test points for key signals like SW, FB, CS, and PG. ZSPM402309KITV3P0 does not contain the ZSPM4023-09 IC as a standalone component but ships with it pre-soldered and configured per the typical application circuit in the datasheet.

Does ZSPM402309KITV3P0 support adjustable output voltages, and how is it configured?

Yes, ZSPM402309KITV3P0 supports output voltage adjustment from 0.8V to 5.5V using an external resistor divider connected to the FB pin, per the ZSPM4023-09's feedback architecture. The evaluation board includes solder jumpers or pads allowing users to select standard output voltages (e.g., 1.2V, 1.8V, 3.3V) or populate custom resistors. The FB reference voltage is tightly regulated at 0.8V ±1% over temperature, ensuring accurate output regulation. Configuration follows Equation (2) in the ZSPM4023-09 datasheet: VOUT = 0.8V × (1 + R1/R2). ZSPM402309KITV3P0's layout maintains Kelvin sensing for the CS pin to preserve current-limit accuracy during adjustment.

Can ZSPM402309KITV3P0 be used to evaluate light-load efficiency, and what is the measured performance?

Yes, ZSPM402309KITV3P0 enables direct measurement of light-load efficiency thanks to the ZSPM4023-09's ultra-light-load architecture, which transitions to variable-frequency discontinuous conduction mode below ~1A. Per the datasheet, ZSPM4023-09 achieves up to 80% efficiency at 10mA output current with 24V input and 1.8V output - a result reproducible on ZSPM402309KITV3P0 using its calibrated test points and low-noise measurement paths. The board's low-ESR ceramic output capacitors and optimized gate-drive loop minimize switching losses critical to sustaining high efficiency at sub-100mA loads.

How does ZSPM402309KITV3P0 demonstrate the ZSPM4023-09's power-good (PG) functionality?

ZSPM402309KITV3P0 implements the ZSPM4023-09's open-drain PG output with a 10kΩ pull-up resistor to VDD, matching the typical application circuit in the datasheet. PG asserts high when VOUT reaches ≥92% of the nominal setpoint and de-asserts low with 5.5% hysteresis upon undervoltage. Test points on the board allow oscilloscope monitoring of PG timing - including the 100µs delay from VOUT crossing threshold to PG assertion - validating sequencing compatibility with FPGAs, ASICs, and processors requiring precise power-rail coordination. ZSPM402309KITV3P0's layout isolates PG routing from noisy SW traces to prevent false triggering.

Is thermal performance characterized on ZSPM402309KITV3P0, and what cooling provisions are included?

Yes, ZSPM402309KITV3P0 supports thermal characterization per the ZSPM4023-09's specified junction-to-ambient thermal resistance (θJA = 28°C/W) and junction-to-case (θJC = 2.5°C/W). The PCB uses 2oz copper layers, thermal vias under the QFN exposed pad, and a large PGND plane to dissipate heat. Datasheet Figure 1.4 Thermal Derating curves - showing output current reduction vs. ambient temperature - were generated using this board configuration. No external heatsink is required for ≤9A operation at ≤75°C ambient; forced airflow extends capability to 100°C. ZSPM402309KITV3P0 includes a thermal pad footprint aligned with the IC's exposed die attach pad for optional heatsink attachment.