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Renesas ZSSC3018BA1C
- Part No.:
- ZSSC3018BA1C
- Manufacturer:
- Renesas
- Category:
- Sensor and Detector Interfaces
- Package:
- Die
- Datasheet:
-
ZSSC3018BA1C.pdf
- Description:
- DICE (WAFER SAWN) - FRAME
- Quantity:
- Payment:
- Shipping:
Inventory:1,217
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Product details
Overview
ZSSC3018BA1C from Renesas Electronics is a high-accuracy sensor signal conditioner IC designed for resistive bridge and absolute voltage sensors, featuring an 18-bit ADC, programmable gain amplifier (6.6–216×), digital offset/span/temperature compensation (1st & 2nd order), internal temperature sensor (<0.003K/LSB resolution), and configurable I²C (≤3.4 MHz) or SPI (≤10 MHz) digital output. It delivers fully corrected 18-bit sensor data for pressure, thermopile, and altitude sensing modules operating from –40°C to +125°C.
For engineers reviewing the ZSSC3018BA1C datasheet, ZSSC3018BA1C pinout, ZSSC3018BA1C application, or ZSSC3018BA1C equivalent, key selection criteria include its on-chip 26-bit DSP calibration engine, MTP memory for one-pass coefficient programming, ultra-low sleep current (20 nA @ ≤85°C), 1.68–3.6 V supply range, and 24-PQFN (4 × 4 mm) package compatibility with die-die bonding for chip-on-board assembly.
Technical Context
The ZSSC3018BA1C integrates a dual-stage programmable gain amplifier (PGA) followed by an 18-bit successive-approximation ADC, with dedicated analog paths for external sensor (INP/INN) and internal temperature reference (VTP/VTN). Its system control unit orchestrates automatic measurement sequences-including offset, sensor, and temperature acquisition-enabling full correction without host intervention.
Digital signal processing is performed by a dedicated 26-bit DSP core executing calibrated math for bridge signal compensation (offset, span, 1st/2nd-order temp drift) and temperature signal compensation, using coefficients stored in reprogrammable MTP memory. The interface supports both SPI (CPHA=0/1, SS-controlled) and I²C (7-bit address, repeated start) protocols with independent status and data registers.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| ADC Resolution | 18-bit max; enables <±0.001% FSO quantization error for high-precision pressure/temperature digitization |
| Programmable Gain Range | 6.6 to 216× linear; allows direct interfacing with mV-level bridge outputs (e.g., 10–100 mV full-scale) without external amplification |
| Temperature Resolution | <0.003 K/LSB (16-bit internal sensor); supports sub-millikelvin thermal drift tracking in compensated measurements |
| Supply Voltage Range | 1.68 V to 3.6 V; compatible with single-cell Li-ion, coin-cell, and industrial 3.3 V rails |
| Active Current Consumption | 1.05 mA typical; enables >10-year battery life in low-duty-cycle sensing (e.g., 1 Hz sampling) |
| Sleep Current | 20 nA typical at ≤85°C; reduces quiescent power to <35 nW for always-on environmental monitoring |
| Digital Output Interface | I²C (≤3.4 MHz) or SPI (≤10 MHz); supports real-time streaming of corrected 18-bit sensor values with interrupt-driven EOC signaling |
Pinout & Package
The ZSSC3018BA1C is supplied in a 24-pin PQFN package (4 mm × 4 mm, 0.5 mm pitch) with wettable flank terminations for automated optical inspection. Thermal pad (EP) is electrically connected to VSS and must be soldered to PCB ground plane for optimal thermal performance and noise immunity.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDD | Digital supply input | 1.68–3.6 V main power rail; powers digital logic, interface, and internal regulators |
| VSS | Digital ground | Reference for digital circuitry and I/O pins; tied to EP thermal pad |
| VDDB | Analog bridge supply output | Internally regulated 1.68 V ±40 mV; powers external resistive bridge with PSRR >60 dB |
| VSSB | Analog ground | Separate analog return path; minimizes digital switching noise coupling into sensor front-end |
| INP / INN | Differential analog inputs | Accepts bridge or voltage-source signals; common-mode range 0.65–1.05 V referenced to VSSB |
| EOC | End-of-conversion interrupt | Open-drain output pulses low after each completed measurement; triggers host read without polling |
| SCLK/SCL | Clock input (SPI/I²C) | Shared pin: SPI mode uses SCLK; I²C mode uses SCL; supports up to 10 MHz (SPI) or 3.4 MHz (I²C) |
| MISO/SDA | Data output/input (SPI/I²C) | Shared pin: SPI uses MISO for read; I²C uses SDA bidirectionally; requires pull-up for I²C |
| MOSI/SDA | Data input (SPI) / bidirectional (I²C) | Shared pin: SPI uses MOSI for write; I²C uses same SDA line; no separate I²C address pin |
| SS | SPI slave select | Active-low enable for SPI communication; ignored in I²C mode; resets interface state on falling edge |
| RES | Reset input | Low-active hardware reset; forces full internal initialization independent of VDD ramp conditions |
| VTP / VTN | Internal temperature sensor terminals | Connect internally to CMOS temperature diode; used automatically during temperature-compensation cycles |
Key Features
| Feature | Design Value |
|---|---|
| On-chip 26-bit DSP calibration engine | Executes full 1st/2nd-order offset, gain, and temperature drift compensation in real time using stored coefficients-no host CPU overhead required |
| Reprogrammable MTP memory | Stores calibration coefficients with 10,000-program cycle endurance and 10-year data retention at 125°C-enables field recalibration and multi-sensor binning |
| Ultra-low-power sleep mode | 20 nA typical current at ≤85°C allows continuous monitoring in battery-powered IoT nodes with multi-year lifetime |
| Integrated bridge bias supply (VDDB) | Provides stable 1.68 V excitation with >60 dB PSRR up to 100 kHz-eliminates need for external LDO or filtering components |
| Configurable digital interface | Single footprint supports either I²C or SPI via pin-strapping or register setting-simplifies BOM management across design variants |
Applications
| Barometric Pressure Sensing | Thermopile-Based Object Temperature |
|---|---|
Use Scenario: Portable navigation devices requiring altitude change detection within ±0.1 m resolution for emergency call (eCall) systems. IC Role / Device Role / Timing Role: Sensor signal conditioner performing real-time 18-bit digitization, 2nd-order temperature compensation, and I²C streaming of corrected pressure values. Use Value: Achieves <±0.10% FSO accuracy over –40°C to +125°C without external trimming, enabling reliable altitude inference from MEMS piezoresistive bridges. |
Use Scenario: Non-contact infrared thermometers measuring human body or industrial surface temperature via thermopile voltage output. IC Role / Device Role / Timing Role: Absolute voltage sensor conditioner acquiring thermopile mV output and internal die temperature simultaneously for radiation compensation. Use Value: Delivers <0.003 K/LSB temperature resolution and 16-bit compensated thermopile output-supporting medical-grade ±0.2°C accuracy in compact form factors. |
| Industrial Pneumatic Pressure Monitoring | Automotive HVAC Fan Control |
Use Scenario: Factory-floor pressure transducers monitoring compressed air lines in ISO 13849-compliant safety systems. IC Role / Device Role / Timing Role: High-reliability SSC providing SPI-streamed 18-bit conditioned data with EOC-triggered read for deterministic control loop timing. Use Value: Enables <270 Hz fully corrected measurement rate with built-in diagnostics (MTP checksum, POR validation)-reducing firmware validation burden. |
Use Scenario: In-vehicle cabin climate systems adjusting blower speed based on differential pressure across evaporator fins. IC Role / Device Role / Timing Role: Low-voltage (1.8 V) SSC interfacing with micro-power bridge sensors while maintaining <1.05 mA active current for extended ECU runtime. Use Value: Supports operation down to 1.68 V supply and 20 nA sleep current-extending battery backup runtime during vehicle ignition-off periods. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar sensor signal conditioning applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MAX1452ACD+T | 16-bit DAC-based analog compensation; no integrated temperature sensor; requires external reference and oscillator | Lacks on-chip 2nd-order temperature compensation and digital output-requires external µC for correction math | Preferred where analog-loop tuning is mandated or when legacy 16-bit resolution suffices |
| AD7793BRUZ | 24-bit ΣΔ ADC with PGA; no built-in compensation DSP or MTP memory; serial interface only SPI | Requires external microcontroller to implement sensor-specific correction algorithms-increases BOM and firmware complexity | Chosen when ultra-high-resolution raw ADC data is needed before host-side compensation |
Compared with MAX1452ACD+T and AD7793BRUZ, the ZSSC3018BA1C uniquely integrates a 26-bit DSP, internal temperature sensor, and MTP memory to deliver fully corrected digital output with zero host computation-reducing system latency, firmware effort, and component count in calibrated sensor modules.
Availability
ZSSC3018BA1C is available at Aetrix Electronics and suitable for barometric altitude measurement, thermopile-based object temperature sensing, and industrial pneumatic pressure monitoring requiring stable component supply, long-term lifecycle support, and automotive-grade reliability.
Supply support for ZSSC3018BA1C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Renesas Electronics is a global semiconductor leader delivering microcontrollers, analog, power, and SoC products for automotive, industrial, infrastructure, and IoT applications-with emphasis on functional safety and energy efficiency.
The ZSSC3018BA1C belongs to Renesas' precision sensor signal conditioner product line, engineered specifically for high-accuracy, low-power, factory-calibrated resistive and voltage-output sensor modules in harsh environments.
FAQ
What is the primary function of the ZSSC3018BA1C in a sensor system?
The ZSSC3018BA1C serves as a complete sensor signal conditioner that acquires, amplifies, digitizes, and digitally compensates analog signals from resistive bridge or absolute voltage sensors. It performs real-time offset, span, and 1st/2nd-order temperature compensation using on-chip 26-bit DSP math and stores calibration coefficients in MTP memory-delivering fully corrected 18-bit digital output via I²C or SPI without host processor involvement. This makes the ZSSC3018BA1C ideal for high-accuracy, low-power sensor modules where minimal external components and deterministic correction are required.
Does the ZSSC3018BA1C support both I²C and SPI interfaces simultaneously?
No-the ZSSC3018BA1C supports either I²C or SPI operation, selected at power-up via configuration bits in its control register or hardware pin strapping (SS pin state). Both protocols share the same physical pins (SCLK/SCL, MISO/SDA, MOSI/SDA), but only one interface is active per configuration. Switching between them requires reinitialization and register reconfiguration; concurrent use is not supported. The ZSSC3018BA1C does not multiplex protocols dynamically during operation.
How is calibration performed for the ZSSC3018BA1C?
Calibration of the ZSSC3018BA1C is performed off-line using Renesas' PC-based SSC Calibration Software, which applies known stimuli (temperature, pressure, or voltage) to the sensor and computes correction coefficients. These 26-bit coefficients-including offset, gain, and temperature drift terms-are then programmed into the device's on-chip MTP memory via the serial interface. The ZSSC3018BA1C executes the correction algorithm autonomously during operation, eliminating the need for in-system recalibration or host-based math. One-pass calibration reduces production test time and cost.
What is the role of the VDDB pin on the ZSSC3018BA1C?
The VDDB pin on the ZSSC3018BA1C provides a regulated 1.68 V ±40 mV analog supply specifically for exciting external resistive bridge sensors. It features high power supply rejection (>60 dB up to 100 kHz) and low noise, enabling accurate bridge measurements without external regulation. VDDB is internally generated from VDD and cannot be bypassed or overridden. For absolute voltage sensors, VDDB is unused but must remain connected to VSS via a 100 nF capacitor for stability, as specified in the layout guidelines.
Can the ZSSC3018BA1C operate from a 1.8 V supply in automotive environments?
Yes-the ZSSC3018BA1C operates across 1.68 V to 3.6 V, making it compatible with nominal 1.8 V and 3.3 V automotive domains. It maintains full functionality-including 18-bit ADC performance, 26-bit DSP correction, and I²C/SPI communication-at 1.8 V. Its guaranteed operation from –40°C to +125°C, combined with 20 nA sleep current at ≤85°C and robust ESD tolerance (4 kV HBM), ensures reliability in under-hood and cabin HVAC applications where voltage transients and thermal stress are present.
ZSSC3018BA1C Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Renesas
- Package/Case:
- Die
- Series:
- -
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- -
- Type:
- Signal Conditioner
- Input Type:
- Differential
- Output Type:
- I2C, Serial, SPI
- Current - Supply:
- 1.5 mA
- Operating Temperature:
- -40°C ~ 125°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- Die
ZSSC3018BA1C FAQ
1.How can I place an order for ZSSC3018BA1C through Aetrix?
Please submit a Request for Quotation (RFQ) for ZSSC3018BA1C on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for ZSSC3018BA1C reliable?
The price and inventory of ZSSC3018BA1C are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for ZSSC3018BA1C is usually 5 days.
3.What payment methods are accepted for ZSSC3018BA1C?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for ZSSC3018BA1C transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for ZSSC3018BA1C?
ZSSC3018BA1C orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your ZSSC3018BA1C order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for ZSSC3018BA1C?
For technical support, including ZSSC3018BA1C datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your ZSSC3018BA1C requirements.
6.How does Aetrix verify that ZSSC3018BA1C is sourced from the original manufacturer or authorized distributors?
All ZSSC3018BA1C products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that ZSSC3018BA1C meets industry standards.
7.What is the process for return or replacement of ZSSC3018BA1C?
All ZSSC3018BA1C units undergo pre-shipment inspection (PSI). If there is an issue with ZSSC3018BA1C, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The ZSSC3018BA1C part is unused and in its original packaging.
Return procedure for ZSSC3018BA1C:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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