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Renesas ZSSC3018BA3W
- Part No.:
- ZSSC3018BA3W
- Manufacturer:
- Renesas
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- Specialized
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ZSSC3018BA3W.pdf
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- IC INTFACE SPECIALIZED SGNL COND
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Product details
Overview
ZSSC3018BA3W from Renesas Electronics is a high-accuracy sensor signal conditioner IC designed for resistive bridge and absolute voltage sensors, featuring 18-bit ADC resolution, programmable gain (6.6–216), digital 1st/2nd-order temperature compensation, and I²C/SPI digital output (≤3.4 MHz / ≤10 MHz). It delivers fully corrected sensor data with ±0.10% FSO accuracy over –40°C to +125°C and supports low-power operation (50 nA sleep current) in pressure, altitude, and thermopile measurement systems.
For engineers reviewing the ZSSC3018BA3W datasheet, ZSSC3018BA3W pinout, ZSSC3018BA3W application, or ZSSC3018BA3W equivalent, this page provides verified technical context, calibrated performance metrics, package-specific pin assignments, real-world use cases, and validated alternative options for precision analog sensor front-end design.
Technical Context
The ZSSC3018BA3W integrates a dual-stage programmable gain amplifier (PGA) with 64-step gain control and an 18-bit successive-approximation ADC clocked at 0.9–1.1 MHz. Its 26-bit DSP core executes on-chip correction math for offset, span, and 1st/2nd-order temperature drift using coefficients stored in reprogrammable MTP memory.
Digital interface operation supports both SPI (CPHA=0/1, up to 10 MHz) and I²C (standard/fast-mode, up to 3.4 MHz), with EOC interrupt signaling and configurable command/response protocols. The device operates from 1.68–3.6 V, draws 1.05 mA typical active current, and achieves <140 pJ/step energy efficiency at 16-bit resolution.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| ADC Resolution | 18-bit max; enables 262,144 discrete steps for high-precision bridge or thermopile sensor digitization. |
| Programmable Gain Range | 6.6 to 216 (linear); allows direct interfacing with mV-level bridge outputs without external amplification. |
| Temperature Compensation | 1st & 2nd order digital compensation for both offset and sensitivity drift; eliminates need for external thermistors or lookup tables. |
| Output Interface | I²C (≤3.4 MHz) or SPI (≤10 MHz); supports standard microcontroller host connectivity with interrupt-driven EOC signaling. |
| Accuracy | ±0.10% FSO over –40°C to +125°C; guaranteed after on-chip calibration with stored MTP coefficients. |
| Supply Current | 1.05 mA typical active; 50 nA typical sleep (≤125°C); enables battery-powered, long-life sensor modules. |
| Operating Voltage | 1.68–3.6 V; compatible with single-cell Li-ion, coin-cell, and industrial 3.3 V rails. |
Pinout & Package
Delivered in 24-PQFN (4 × 4 mm, 0.5 mm pitch) package with wettable flank leads for automated optical inspection. Thermal pad exposed on underside for enhanced heat dissipation.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDD | Digital supply input | 1.68–3.6 V main power rail for digital logic, interface, and internal regulators. |
| VSS | Digital ground reference | Return path for digital circuitry; separate from analog ground (VSSB) to minimize noise coupling. |
| INP / INN | Differential analog inputs | Accepts bridge sensor outputs or absolute voltage sources; input range 0.65–1.05 V referenced to VSSB. |
| VDDB | Bridge bias supply output | Internally regulated 1.68 V ±0.07 V supply for excitation of resistive bridges (max 1.8 mA). |
| VSSB | Analog ground reference | Isolated ground for analog section; must be connected to sensor bridge ground to maintain PSRR. |
| SCLK/SCL | Clock input (SPI/I²C) | Master-generated clock; supports SPI up to 10 MHz or I²C up to 3.4 MHz. |
| MISO / SDA | Data output (SPI) / bidirectional (I²C) | Serial data output for read operations; functions as open-drain I²C bus line when configured for I²C. |
| MOSI / SDA | Data input (SPI) / bidirectional (I²C) | Serial data input for write/programming commands; shares pin with SDA in I²C mode. |
| SS | SPI slave select | Active-low chip enable for SPI communication; pulled high internally via weak pull-up. |
| EOC | End-of-conversion interrupt | Open-drain output signals completion of full sensor+temperature measurement cycle; configurable threshold. |
| RES | Reset input | Low-active hardware reset; forces full internal initialization independent of VDD ramp behavior. |
Key Features
| Feature | Design Value |
|---|---|
| Integrated 26-bit DSP core | Executes full sensor correction math (offset, span, temp drift, non-linearity) in real time without host CPU involvement. |
| On-chip MTP memory | Stores calibration coefficients with 10,000-program-cycle endurance and 10-year data retention at 125°C. |
| Auto-compensated internal temperature sensor | 16-bit resolution (0.003 K/LSB) referenced to die temperature; used directly in compensation algorithms. |
| Flexible interface configuration | Single hardware footprint supports either SPI or I²C via register setting-no PCB change required for protocol selection. |
| Dual-regulator architecture | Separate analog (VDDB/VSSB) and digital (VDD/VSS) supplies suppress cross-domain noise and improve PSRR >60 dB. |
Applications
| Barometric Pressure Sensing | Thermopile-Based Temperature |
|---|---|
|
Use Scenario: Portable navigation devices requiring altitude estimation within ±0.5 m accuracy under dynamic thermal conditions. IC Role / Device Role / Timing Role: Signal conditioner performing real-time 18-bit digitization, 2nd-order temperature compensation, and I²C output of corrected pressure values at ≥270 Hz. Use Value: Eliminates external op-amps, filters, and thermistor networks while maintaining ±0.10% FSO accuracy across –40°C to +125°C. |
Use Scenario: Non-contact object temperature measurement in HVAC or industrial safety systems using thermopile sensors. IC Role / Device Role / Timing Role: Digitizes microvolt-level thermopile output, applies digital offset/gain/temperature correction, and delivers calibrated 16-bit temperature data via SPI. Use Value: Achieves <0.003 K/LSB temperature resolution and sub-100 nA sleep current for battery-operated thermal cameras. |
| Industrial Pneumatic Control | Automotive Cabin Pressure Monitoring |
|
Use Scenario: Closed-loop pressure regulation in factory automation systems where sensor drift must remain below 0.05% FSO over 10 years. IC Role / Device Role / Timing Role: Front-end conditioner for Wheatstone bridge pressure transducers, executing on-device 1st/2nd-order compensation and delivering SPI-ready digital output. Use Value: On-chip MTP memory retains calibration across power cycles and field reprogramming enables lifetime drift correction without hardware replacement. |
Use Scenario: Real-time cabin altitude tracking in automotive infotainment systems for emergency call (eCall) altitude reporting. IC Role / Device Role / Timing Role: High-speed sensor conditioner providing 18-bit corrected barometric readings at ≥270 Hz via I²C to vehicle MCU with EOC-triggered interrupt timing. Use Value: Meets AEC-Q100 Grade 2 (–40°C to +105°C) operating range and supports functional safety requirements through deterministic correction math and watchdog-free operation. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar sensor signal conditioning applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| TDK InvenSense ICM-20948 | 9-axis IMU with integrated 3-axis accelerometer, gyroscope, and magnetometer; includes basic sensor fusion but no dedicated 18-bit bridge signal conditioning or MTP-based 2nd-order temperature compensation. | Targets motion sensing, not precision static pressure or thermopile measurement; lacks programmable PGA and bridge excitation supply (VDDB). | Select only if motion + pressure co-location is required; not a functional substitute for bridge signal conditioning. |
| Analog Devices AD7798 | 16-bit Σ-Δ ADC with PGA and internal reference; no on-chip DSP, no MTP memory, no temperature compensation engine, and no digital output formatting-requires external microcontroller for correction math. | Requires full external firmware implementation of offset/span/temp compensation; increases BOM, layout area, and calibration complexity. | Choose when ultra-low-cost analog front-end is acceptable and host MCU resources are available for real-time correction. |
Compared with the ZSSC3018BA3W, the ICM-20948 offers motion sensing but no bridge-specific signal conditioning, while the AD7798 provides raw ADC functionality without integrated correction-both require external computation or lack critical features like VDDB excitation, 18-bit resolution, or on-chip 2nd-order temperature compensation.
Availability
ZSSC3018BA3W is available at Aetrix Electronics and suitable for barometric pressure sensing, thermopile-based temperature measurement, and industrial pneumatic control requiring stable component supply, long-term calibration retention, and automotive-grade thermal robustness.
Supply support for ZSSC3018BA3W includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Renesas Electronics is a global semiconductor leader specializing in microcontrollers, analog, power, and sensor interface solutions for automotive, industrial, and IoT applications.
The ZSSC3018BA3W belongs to Renesas' Sensor Signal Conditioner product line, engineered specifically for high-accuracy, low-power, single-chip conditioning of resistive bridge and absolute voltage sensors in harsh thermal environments.
FAQ
What is the primary function of the ZSSC3018BA3W in a sensor system?
The ZSSC3018BA3W serves as a complete analog front-end and digital signal conditioner for resistive bridge and absolute voltage sensors. It performs high-resolution (up to 18-bit) analog-to-digital conversion, programmable gain amplification, and on-chip digital compensation-including 1st and 2nd order temperature drift correction-delivering fully calibrated digital output via I²C or SPI. This eliminates the need for external amplifiers, ADCs, or compensation firmware in designs using the ZSSC3018BA3W.
Does the ZSSC3018BA3W support both I²C and SPI interfaces simultaneously?
No-the ZSSC3018BA3W supports either I²C or SPI operation, selected via configuration registers during initialization; it does not operate both protocols concurrently. Pin assignments are shared (e.g., MOSI/SDA, SCLK/SCL), and interface mode is determined by firmware setup-not hardware strapping. The ZSSC3018BA3W requires no PCB modification to switch between protocols, as the same 24-PQFN footprint accommodates both configurations.
How is calibration performed for the ZSSC3018BA3W, and where are coefficients stored?
Calibration of the ZSSC3018BA3W is performed off-line using Renesas' PC-based software tool, which collects raw sensor data across temperature and stimulus points, computes correction coefficients, and programs them into the device's on-chip MTP memory. These 26-bit coefficients-covering offset, gain, and 1st/2nd order temperature terms-are retained for ≥10 years at 125°C and support ≥1,000 reprogramming cycles. The ZSSC3018BA3W executes all compensation autonomously using these stored values.
What is the role of the VDDB pin on the ZSSC3018BA3W, and what load can it drive?
The VDDB pin on the ZSSC3018BA3W is an internally regulated 1.68 V ±0.07 V supply output dedicated to biasing resistive bridge sensors. It delivers up to 1.8 mA continuous current with full PSRR capability when bridge resistance is 1–50 kΩ; operation with 100 Ω–999 Ω bridges is supported but with reduced PSRR. This integrated excitation source removes the need for external voltage references or current sources in bridge-based pressure or load-cell applications using the ZSSC3018BA3W.
Can the ZSSC3018BA3W operate in ultra-low-power modes, and what is its minimum sleep current?
Yes-the ZSSC3018BA3W features a dedicated Sleep Mode with typical current consumption of 50 nA at ≤125°C and 20 nA at ≤85°C. Wake-up to full active operation takes ≤2 ms, and the EOC interrupt pin enables event-driven measurement scheduling. This makes the ZSSC3018BA3W suitable for battery-powered wireless sensor nodes where multi-year operation from coin cells is required, without compromising on 18-bit resolution or on-chip correction fidelity.
ZSSC3018BA3W Specifications
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ZSSC3018BA3W FAQ
1.How can I place an order for ZSSC3018BA3W through Aetrix?
Please submit a Request for Quotation (RFQ) for ZSSC3018BA3W on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for ZSSC3018BA3W reliable?
The price and inventory of ZSSC3018BA3W are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for ZSSC3018BA3W is usually 5 days.
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Once your ZSSC3018BA3W order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for ZSSC3018BA3W?
For technical support, including ZSSC3018BA3W datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your ZSSC3018BA3W requirements.
6.How does Aetrix verify that ZSSC3018BA3W is sourced from the original manufacturer or authorized distributors?
All ZSSC3018BA3W products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that ZSSC3018BA3W meets industry standards.
7.What is the process for return or replacement of ZSSC3018BA3W?
All ZSSC3018BA3W units undergo pre-shipment inspection (PSI). If there is an issue with ZSSC3018BA3W, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The ZSSC3018BA3W part is unused and in its original packaging.
Return procedure for ZSSC3018BA3W:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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