Renesas ZSSC3027AI1D ES
- Part No.:
- ZSSC3027AI1D ES
- Manufacturer:
- Renesas
- Category:
- Sensor and Detector Interfaces
- Package:
- -
- Datasheet:
-
ZSSC3027AI1D ES.pdf
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- DICE (WAFER SAWN) - WAFFLE PACK
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Product details
Overview
ZSSC3027AI1D ES from Integrated Device Technology (IDT) is a low-power, 16-bit sensor signal conditioner IC designed for high-accuracy amplification and digital correction of resistive bridge sensor outputs. It delivers ±0.10% FSO accuracy from –40°C to +85°C, supports I²C (≤3.4 MHz) or SPI (≤20 MHz) digital output, and integrates an 18-bit DSP for 1st/2nd-order temperature and nonlinearity compensation - enabling precision barometric altitude measurement in portable navigation systems.
For engineers reviewing the ZSSC3027AI1D ES datasheet, ZSSC3027AI1D ES pinout, ZSSC3027AI1D ES application, or ZSSC3027AI1D ES equivalent, key selection considerations include its die-level delivery format, 20 nA sleep current, programmable 13.2–72 gain amplifier, on-chip MTP memory for calibration coefficients, and support for calibrated resistive sensor modules without external trimming components.
Technical Context
The ZSSC3027AI1D ES implements a two-stage programmable gain amplifier with auto-zero and chopper stabilization to suppress 1/f noise and offset drift. Its 16-bit charge-balancing ADC uses VDDB (1.67 V typical) as reference and supports configurable resolution from 10 to 16 bits, with conversion rates up to 355 Hz for raw measurements and 175 Hz for fully corrected outputs.
Digital signal conditioning is executed by an 18-bit internal DSP core that applies offset, span, and 1st/2nd-order temperature compensation using coefficients stored in on-chip multiple-time programmable (MTP) memory. The IC features dual operational modes (Normal and Command), automatic wake-up from 20 nA sleep state in ≤2 ms, and a ring oscillator delivering 4 MHz clocking for timing-critical sensing loops.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Supply Voltage | 1.7–3.6 V - enables direct integration into battery-powered systems including coin-cell and Li-ion platforms. |
| Active Current | 930 µA typical - ensures minimal power draw during continuous high-resolution sensing cycles. |
| Sleep Current | 20 nA typical - allows multi-year operation in always-on environmental monitoring nodes. |
| Accuracy | ±0.10% FSO @ –40°C to +85°C - guarantees calibrated pressure/temperature output without system-level recalibration. |
| Digital Interface | I²C (≤3.4 MHz) or SPI (≤20 MHz) - provides flexible host MCU connectivity with no protocol translation required. |
| ADC Resolution | Programmable 10–16 bits - balances speed (up to 355 Hz raw) and precision (16-bit corrected at 175 Hz). |
| Temperature Resolution | <0.003 K/LSB - supports ultra-fine thermal drift compensation for altimeter-grade stability. |
Pinout & Package
Package: Die form factor for wafer-level bonding; delivered unsawn on 304 µm wafer (ZSSC3027AC1B variant). Not packaged in leaded or surface-mount IC housing.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| INP / INN | Differential bridge input | Accepts Wheatstone bridge sensor outputs; supports common-mode range of 0.65–1.05 V referenced to AGND/CM. |
| VDD | Main supply input | 1.7–3.6 V digital/analog rail; powers internal regulators and generates 1.67 V VDDB for ADC reference. |
| VSS | Digital ground | Reference for digital logic, SPI/I²C interface, and MTP programming circuitry. |
| VSSB | Analog ground | Separate analog return path minimizes coupling between digital switching noise and sensitive bridge signals. |
| VDDB | Bridge supply output | Internally generated 1.67 V ±0.07 V bias for excitation of resistive bridge sensors; optimized for PSRR. |
| SCLK/SCL | Clock input | Accepts SPI clock (≤20 MHz) or I²C clock (≤3.4 MHz); synchronous interface timing critical for coefficient read/write. |
| MOSI/SDA | Data input | Serial data line for command transmission and MTP memory programming via SPI or I²C protocol. |
| MISO | Data output | Read-only output for calibrated bridge/temperature values and status registers; open-drain compatible. |
| SS | Chip select | Active-low SPI slave select; enables multi-device bus sharing without arbitration overhead. |
| SEL | Interface mode select | Hardware pin configures primary interface: high = I²C, low = SPI - eliminates software configuration dependency. |
| EOC | End-of-conversion flag | Open-drain output pulses low upon completion of full measurement sequence (bridge + temp + offset). |
Key Features
| Feature | Design Value |
|---|---|
| 18-bit DSP-based correction engine | Executes real-time 1st/2nd-order temperature compensation and nonlinearity correction without host MCU intervention. |
| On-chip MTP memory (multiple-time programmable) | Stores calibration coefficients permanently; programmed once during module calibration - no external EEPROM needed. |
| Programmable 13.2–72 gain amplifier | Accommodates diverse bridge sensitivities (14–72 linear factor) across production batches without hardware change. |
| Auto-zero and chopper-stabilized front end | Reduces amplifier offset drift to sub-µV level over temperature - essential for long-term altimeter stability. |
| Dual-rail voltage regulation (VDDB + Vreg_int) | Isolates analog bridge supply from digital noise; achieves >32 dB PSRR at 2 V supply for clean sensor excitation. |
Applications
| Barometric Altimeter Module | Industrial Pressure Sensing |
|---|---|
|
Use Scenario: Portable GPS navigation devices and eCall emergency systems requiring precise altitude change detection (<1 m resolution) under varying ambient conditions. IC Role / Device Role / Timing Role: Primary signal conditioner converting MEMS pressure bridge output into temperature-compensated digital altitude data via I²C. Use Value: Delivers ±0.10% FSO accuracy over –40°C to +85°C with single-pass calibration - eliminating field recalibration and reducing BOM cost by removing external trim components. |
Use Scenario: Factory automation systems monitoring pneumatic/hydraulic line pressure in harsh industrial environments. IC Role / Device Role / Timing Role: High-stability bridge signal conditioner providing SPI-streamed 16-bit corrected pressure values at 175 Hz for closed-loop control. Use Value: 20 nA sleep current enables energy harvesting integration; programmable gain accommodates aging sensor drift without firmware update. |
| Hard Disk Drive Pressure Monitor | Weather Station Sensor Node |
|
Use Scenario: Internal HDD chamber pressure monitoring to detect seal failure or contamination before head crash events. IC Role / Device Role / Timing Role: Ultra-low-power signal conditioner operating in standby mode until triggered by host controller for diagnostic measurement. Use Value: 2 ms wake-up time and 20 nA quiescent current extend drive lifetime; on-die temperature sensor enables simultaneous thermal derating. |
Use Scenario: Battery-powered outdoor weather stations measuring atmospheric pressure trends over months with minimal maintenance. IC Role / Device Role / Timing Role: Core sensor interface IC converting barometric transducer output into I²C-accessible compensated data for microcontroller logging. Use Value: Single-chip solution replaces discrete op-amp, ADC, and temperature sensor - reducing PCB area by >40% and improving long-term drift stability. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar sensor signal conditioning applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| Melexis MLX90393 | Tri-axis magnetic sensor conditioner with integrated Hall elements; lacks dedicated bridge excitation and 2nd-order temperature compensation. | Targeted at position sensing, not pressure/altimetry; requires external bridge if used for resistive sensing. | Select when magnetic field measurement dominates; avoid for high-accuracy bridge-based pressure systems. |
| Analog Devices AD7798 | 24-bit Σ-Δ ADC with PGA but no embedded DSP or MTP memory; requires external microcontroller for compensation math. | Demands host-side calibration algorithm implementation; increases firmware complexity and validation burden. | Choose only if existing platform already implements custom compensation; ZSSC3027AI1D ES reduces total system latency and code size. |
Compared with MLX90393 and AD7798, the ZSSC3027AI1D ES uniquely integrates bridge excitation, 18-bit DSP-based 2nd-order compensation, and one-time programmable memory - enabling drop-in deployment in calibrated altimeter modules without host CPU involvement or external passive components.
Availability
ZSSC3027AI1D ES is available at Aetrix Electronics and suitable for barometric altitude measurement, industrial pressure monitoring, and weather station sensor nodes requiring stable component supply across extended product lifecycles.
Supply support for ZSSC3027AI1D ES includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Integrated Device Technology (IDT), now part of Renesas Electronics, designs high-performance timing, memory interface, and sensor signal conditioning solutions for communications, computing, and industrial markets.
The ZSSC3027AI1D ES belongs to IDT's ZSSC30x6 family of sensor signal conditioners, engineered specifically for high-resolution, low-power correction of resistive bridge sensors in altimeter, pressure, and temperature modules.
FAQ
What is the package type of ZSSC3027AI1D ES?
ZSSC3027AI1D ES is supplied as a bare die on a 304 µm-thick unsawn wafer, intended for chip-on-board (COB) or stacked-die bonding assembly. It does not have a molded plastic or ceramic IC package and requires wire bonding or flip-chip integration into the target module substrate.
Does ZSSC3027AI1D ES support both I²C and SPI interfaces simultaneously?
No - ZSSC3027AI1D ES supports either I²C or SPI, selected at power-up via the SEL pin (high = I²C, low = SPI). Both protocols share the same physical pins (SCLK/SCL, MOSI/SDA, MISO, SS), but only one interface is active per configuration; concurrent use is not supported.
How is calibration performed for ZSSC3027AI1D ES?
Calibration of ZSSC3027AI1D ES is performed externally using a PC-controlled procedure that writes sensor-specific coefficients into its on-chip MTP memory via the serial interface. The process collects raw bridge and temperature data across temperature and pressure points, computes correction parameters, and stores them - enabling fully autonomous compensation during operation.
What is the role of the VDDB pin on ZSSC3027AI1D ES?
The VDDB pin on ZSSC3027AI1D ES outputs a regulated 1.67 V supply used to excite the connected resistive bridge sensor. This internally generated voltage serves as both bridge bias and ADC reference, ensuring matched thermal drift and high PSRR - critical for maintaining ±0.10% FSO accuracy across temperature.
Can ZSSC3027AI1D ES operate from a 1.8 V supply?
Yes - ZSSC3027AI1D ES operates across 1.7 V to 3.6 V, making 1.8 V fully compliant. At 1.8 V, it delivers 930 µA typical active current and maintains full functionality including 20 MHz SPI, 3.4 MHz I²C, and 16-bit corrected output at 175 Hz, with PSRR improved to 32 dB.
ZSSC3027AI1D ES Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Renesas
- Package/Case:
- -
- Series:
- *
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Type:
- -
- Input Type:
- -
- Output Type:
- -
- Current - Supply:
- -
- Operating Temperature:
- -
- Grade:
- -
- Qualification:
- -
- Mounting Type:
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- Supplier Device Package:
- -
ZSSC3027AI1D ES FAQ
1.How can I place an order for ZSSC3027AI1D ES through Aetrix?
Please submit a Request for Quotation (RFQ) for ZSSC3027AI1D ES on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for ZSSC3027AI1D ES reliable?
The price and inventory of ZSSC3027AI1D ES are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for ZSSC3027AI1D ES is usually 5 days.
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ZSSC3027AI1D ES orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your ZSSC3027AI1D ES order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for ZSSC3027AI1D ES?
For technical support, including ZSSC3027AI1D ES datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your ZSSC3027AI1D ES requirements.
6.How does Aetrix verify that ZSSC3027AI1D ES is sourced from the original manufacturer or authorized distributors?
All ZSSC3027AI1D ES products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that ZSSC3027AI1D ES meets industry standards.
7.What is the process for return or replacement of ZSSC3027AI1D ES?
All ZSSC3027AI1D ES units undergo pre-shipment inspection (PSI). If there is an issue with ZSSC3027AI1D ES, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The ZSSC3027AI1D ES part is unused and in its original packaging.
Return procedure for ZSSC3027AI1D ES:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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