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Renesas ZSSC3036CI4W
- Part No.:
- ZSSC3036CI4W
- Manufacturer:
- Renesas
- Category:
- Specialized
- Package:
- Die
- Datasheet:
-
ZSSC3036CI4W.pdf
- Description:
- IC INTFACE SPECIALIZED SGNL COND
- Quantity:
- Payment:
- Shipping:
Inventory:3,837
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Product details
Overview
ZSSC3036CI4W from Integrated Device Technology (IDT) is a low-power, high-resolution sensor signal conditioner IC designed for precision resistive bridge sensor interfacing in altimeter and pressure modules. It delivers 16-bit conditioned digital output via I²C or SPI, performs 1st/2nd-order temperature compensation, and achieves ±0.10% FSO accuracy from –40°C to +110°C using an 18-bit DSP core and on-chip MTP memory.
For engineers reviewing the ZSSC3036CI4W datasheet, ZSSC3036CI4W pinout, ZSSC3036CI4W application, or ZSSC3036CI4W equivalent, key selection considerations include its die-level delivery for chip-on-board bonding, 50nA sleep current, programmable 13.2–72 gain range, and support for calibrated barometric altitude measurement in portable navigation and automotive systems.
Technical Context
The ZSSC3036CI4W implements a two-stage programmable gain amplifier with auto-zero and chopper stabilization to suppress 1/f noise and offset drift. Its switched-capacitor ADC uses VDDB (1.67V typical) as reference and supports 10–16-bit resolution with conversion rates up to 1015 Hz for raw measurements and 245 Hz for fully compensated outputs.
Digital correction is executed by an 18-bit DSP core applying stored calibration coefficients for bridge offset, span, and 1st/2nd-order temperature-induced gain/offset drift. The MTP memory enables single-pass PC-controlled calibration without external trimming components, and the internal charge pump generates programming voltage from VDD (2.9–3.6V).
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Resolution | 16-bit fully compensated digital output; enables <0.003K/LSB temperature resolution and sub-0.1% FSO accuracy. |
| Supply Voltage | 1.8–3.6V operation; supports battery-powered portable and automotive applications with minimal external regulation. |
| Current Consumption | 1mA active mode; 50nA typical sleep current at ≤110°C - critical for long-life IoT and emergency call sensors. |
| Interface Speed | SPI up to 20MHz or I²C up to 3.4MHz; allows fast host polling and real-time control loop integration. |
| Temperature Range | –40°C to +110°C extended qualification; validated for under-hood automotive and industrial pressure sensing. |
| Gain Range | Programmable 13.2× to 72×; accommodates bridge sensors from 1 kΩ to 50 kΩ with full PSRR capability. |
| Calibration Memory | On-chip multiple-time programmable (MTP) memory; stores all compensation coefficients - no external EEPROM required. |
Pinout & Package
Package: Die form (304 µm thickness), intended for wafer-level bonding or die-on-frame assembly; no leadframe or molded package.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDD | Digital supply input | 1.8–3.6V main power; supplies digital logic, interface, and internal charge pump for MTP programming. |
| VSS | Digital ground | Reference for digital I/O and internal logic; separate from analog ground to minimize noise coupling. |
| VDDB | Bridge supply / ADC reference | Internally regulated 1.67V ±0.07V output; powers sensor bridge and serves as precise ADC reference voltage. |
| VSSB | Analog ground | Isolated analog return path for bridge and amplifier; critical for achieving <±0.10% FSO accuracy. |
| INP / INN | Differential bridge inputs | Accepts Wheatstone bridge outputs; supports programmable gain polarity reversal to accommodate wiring flexibility. |
| SCLK/SCL | Clock input | Accepts SPI clock (≤20MHz) or I²C clock (≤3.4MHz); dual-mode pin selected via SEL or configuration register. |
| MOSI/SDA | Data input/output | Shared serial data line for both SPI (MOSI/MISO) and I²C (SDA); bidirectional with open-drain option for I²C. |
| SS / SEL | Chip select / interface mode | Active-low SPI chip select; when pulled high, enables I²C mode and disables SPI functionality. |
Key Features
| Feature | Design Value |
|---|---|
| Two-stage programmable gain amplifier | Stage 1: 12×–40×; Stage 2: 1.1×–1.8×; total gain 13.2×–72× - matches wide range of bridge sensitivities without external amplification. |
| Auto-zero and chopper-stabilized front end | Eliminates amplifier offset and 1/f noise before each measurement - ensures stable baseline for high-precision altimetry. |
| 18-bit DSP-based digital compensation | Applies factory- or user-programmed coefficients for offset, span, and 1st/2nd-order temperature drift - removes need for analog trimming. |
| Integrated temperature sensor | On-die resistive element with <0.003K/LSB resolution - enables simultaneous bridge and temperature measurement for accurate thermal compensation. |
| Single-pass calibration architecture | PC-controlled via serial interface; programs full coefficient set in one session - reduces production test time and cost. |
Applications
| Barometric Altimetry | Automotive Cabin Pressure Sensing |
|---|---|
|
Use Scenario: Portable GPS devices and eCall systems requiring altitude change detection with <1 m resolution. IC Role / Device Role / Timing Role: Primary signal conditioner converting MEMS pressure bridge output into temperature-compensated 16-bit digital altitude data. Use Value: Achieves ±0.10% FSO accuracy over –40°C to +110°C, enabling reliable emergency location reporting without external calibration hardware. |
Use Scenario: HVAC control in premium vehicles monitoring cabin pressure differentials for comfort and air quality management. IC Role / Device Role / Timing Role: High-stability bridge conditioner delivering fast (<245 Hz) corrected pressure readings to vehicle body controller. Use Value: 50nA sleep current extends battery backup life; programmable gain adapts to diverse OEM pressure sensor bridges without redesign. |
| Hard Disk Drive (HDD) Internal Pressure Monitoring | Industrial Pneumatic Control Systems |
|
Use Scenario: Real-time internal pressure tracking inside sealed HDD enclosures to prevent head crash during altitude shifts. IC Role / Device Role / Timing Role: Low-noise, low-power signal conditioner interfacing with miniature silicon pressure bridges in space-constrained modules. Use Value: Die-level packaging enables direct die-to-die bonding with sensor; <0.003K/LSB temperature resolution supports tight thermal error budgeting. |
Use Scenario: Factory automation systems measuring compressed air pressure in pneumatic actuators and valves. IC Role / Device Role / Timing Role: Ruggedized bridge conditioner providing calibrated digital output for PLC analog input modules or local microcontroller processing. Use Value: Extended –40°C to +110°C qualification ensures reliability in hot industrial cabinets; MTP memory retains calibration across power cycles. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar sensor signal conditioning applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MEAS MS5837-02BA | Integrated pressure sensor + ASIC in stainless steel housing; fixed 24-bit output; no programmable gain or external bridge support. | Pre-calibrated submersible pressure module; not suitable for custom bridge interfacing or chip-on-board integration. | Select when needing a complete, IP68-rated pressure transducer - not a drop-in replacement for ZSSC3036CI4W's discrete bridge conditioning role. |
| TI PGA309AIPW | Analog output only; 16-bit DAC-based trimming; no integrated temperature sensor or digital compensation engine. | Requires external MCU for digital processing and temperature compensation; higher BOM count and layout complexity. | Choose if system already includes a capable host processor and analog signal chain is preferred - lacks ZSSC3036CI4W's self-contained digital correction. |
Compared with MEAS MS5837-02BA and TI PGA309AIPW, the ZSSC3036CI4W uniquely combines die-level integration, on-chip 18-bit DSP compensation, and programmable analog front-end - enabling compact, high-accuracy, low-power bridge sensor modules without external processors or trimming components.
Availability
ZSSC3036CI4W is available at Aetrix Electronics and suitable for barometric altimetry, automotive cabin pressure sensing, and industrial pneumatic control applications requiring stable component supply, extended temperature qualification, and chip-on-board assembly compatibility.
Supply support for ZSSC3036CI4W includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Integrated Device Technology (IDT), now part of Renesas Electronics, is a fabless semiconductor company specializing in timing, memory interface, RF, and sensor signal conditioning solutions for communications, computing, and industrial markets.
The ZSSC3036CI4W belongs to IDT's ZSSC30x6 family of sensor signal conditioners, engineered specifically for high-accuracy, low-power resistive bridge sensor modules used in altimeters, pressure transducers, and environmental monitoring systems.
FAQ
What is the operating temperature range qualified for the ZSSC3036CI4W?
The ZSSC3036CI4W is qualified for –40°C to +110°C operation with extended qualification, as indicated by the "I" suffix in the part number. This rating is verified per IDT's reliability testing and supports under-hood automotive and industrial environments where thermal stability is critical for pressure and altitude sensing accuracy.
Does the ZSSC3036CI4W require external components for basic operation?
No, the ZSSC3036CI4W requires no external trimming, filtering, or buffering components for standard operation. Its integrated charge pump, voltage regulator, auto-zero amplifier, and MTP memory enable full functionality with only decoupling capacitors on VDD and VDDB - simplifying PCB layout and reducing BOM cost for the ZSSC3036CI4W.
How is calibration performed for the ZSSC3036CI4W?
Calibration of the ZSSC3036CI4W is performed via its SPI or I²C interface using PC-based software that applies sensor characterization data to compute and program 18-bit compensation coefficients into on-chip MTP memory. The process is single-pass, requires no external hardware beyond the interface cable, and is fully supported by IDT's official calibration tools for the ZSSC3036CI4W.
What digital interfaces does the ZSSC3036CI4W support?
The ZSSC3036CI4W supports both SPI (up to 20MHz) and I²C (up to 3.4MHz) interfaces on shared pins (SCLK/SCL, MOSI/SDA, SS/SEL). Interface mode is selected either by hardware (pulling SEL high for I²C) or via configuration register - allowing flexible host MCU integration without changing board layout for the ZSSC3036CI4W.
Is the ZSSC3036CI4W supplied in a packaged IC format?
No, the ZSSC3036CI4W is delivered as a bare die (304 µm thick) on wafer or frame, intended for chip-on-board or die-bonding assembly with matching pressure or altimeter sensors. It does not include a plastic or ceramic package - this die-level form factor enables ultra-compact, high-density sensor modules optimized for the ZSSC3036CI4W's target applications.
ZSSC3036CI4W Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Renesas
- Series:
- -
- Package/Case:
- Die
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Discontinued at Digi-Key
- Applications:
- Sensor Signal Conditioner - Resistive
- Interface:
- Digital, I2C, SPI
- Voltage - Supply:
- 1.8V ~ 3.6V
- Supplier Device Package:
- Die
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
ZSSC3036CI4W FAQ
1.How can I place an order for ZSSC3036CI4W through Aetrix?
Please submit a Request for Quotation (RFQ) for ZSSC3036CI4W on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for ZSSC3036CI4W reliable?
The price and inventory of ZSSC3036CI4W are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for ZSSC3036CI4W is usually 5 days.
3.What payment methods are accepted for ZSSC3036CI4W?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for ZSSC3036CI4W transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for ZSSC3036CI4W?
ZSSC3036CI4W orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your ZSSC3036CI4W order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for ZSSC3036CI4W?
For technical support, including ZSSC3036CI4W datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your ZSSC3036CI4W requirements.
6.How does Aetrix verify that ZSSC3036CI4W is sourced from the original manufacturer or authorized distributors?
All ZSSC3036CI4W products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that ZSSC3036CI4W meets industry standards.
7.What is the process for return or replacement of ZSSC3036CI4W?
All ZSSC3036CI4W units undergo pre-shipment inspection (PSI). If there is an issue with ZSSC3036CI4W, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The ZSSC3036CI4W part is unused and in its original packaging.
Return procedure for ZSSC3036CI4W:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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