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Renesas ZSSC3123AA6B

Part No.:
ZSSC3123AA6B
Manufacturer:
Renesas
Category:
Sensor and Detector Interfaces
Package:
Die
Datasheet:
AetrixZSSC3123AA6B.pdf
Description:
OPN - WAFER (UNSAWN) - BOX
Quantity:
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Product details

Overview

ZSSC3123AA6B from Renesas Electronics is a CMOS capacitive sensor signal conditioner IC that performs high-accuracy capacitance-to-digital conversion and digital compensation of sensor offset, sensitivity, and temperature drift using on-chip EEPROM-stored calibration coefficients. It supports single or differential capacitive sensors up to 260 pF, offers I²C/SPI/PDM outputs, and operates from 2.3 V to 5.5 V across –40°C to +125°C - used in industrial pressure, level, and proximity sensing systems.

For engineers reviewing the ZSSC3123AA6B datasheet, ZSSC3123AA6B pinout, ZSSC3123AA6B application, or ZSSC3123AA6B equivalent, key selection criteria include its 14-TSSOP package, programmable resolution (8–14 bit), dual alarm outputs with push-pull/open-drain configuration, ±0.25% FSO accuracy over temperature, and support for die-bonded chip-on-board assembly.

Technical Context

The ZSSC3123AA6B integrates a capacitance-to-digital converter (CDC) with configurable multiplier settings (Mult1–Mult8), enabling full-scale input ranges from 2 pF to 260 pF. Its digital signal processor executes piecewise 1st/2nd-order or single-region 3rd-order sensor compensation and 1st/2nd-order temperature gain/offset drift correction.

It features an internal temperature reference sensor, no external components required for thermal compensation, and supports four output modes: I²C, SPI, PDM (capacitance and temperature), and two independent alarm signals. The Ready pin indicates measurement completion, and EEPROM stores configuration registers and calibration coefficients.

Key Specifications

ParameterValue and Actual Design Meaning
Supply Voltage2.3 V to 5.5 V - enables direct interface with 3.3 V and 5 V microcontrollers without level-shifting.
Input Capacitance RangeUp to 260 pF - supports wide variety of MEMS and PCB-based capacitive sensors including differential configurations.
Resolution & Conversion Time8-bit @ 0.7 ms; 14-bit @ 18.5 ms - trade-off between speed and precision selectable per application timing budget.
Accuracy±0.25% FSO at –40°C to +125°C, VSUPPLY ±10% - specified for calibrated operation with stored coefficients.
Current Consumption750 μA typical active; ≤1 μA sleep at 85°C - suitable for battery-powered industrial IoT nodes with duty-cycled sensing.
Operating Temperature–40°C to +125°C - qualified for under-hood automotive, industrial control, and harsh-environment applications.
Output InterfacesI²C, SPI, PDM (ratiometric), dual alarms - provides flexible host integration and analog-like pulse outputs without ADC.

Pinout & Package

Package: 4.4 mm × 5.0 mm 14-pin TSSOP (lead-free, RoHS-compliant). Pinout validated per Renesas ZSSC3123 Datasheet Rev. Nov 2021, Page 7 (Figure 1 and Table 1).

Pin/TerminalCircuit RoleDesign Meaning
VDDSupply voltage inputPrimary power rail (2.3–5.5 V); requires local 0.1 μF decoupling to GND.
VSSGround referenceAnalog/digital common return; must be low-impedance connection to system ground plane.
C0 / C1Differential capacitive sensor inputsC0 is primary sensor terminal; C1 optional for differential mode - both require accessible terminals per sensor design.
CCReference capacitor connectionConnects external reference cap (typically 10–100 pF) for CDC ratio-metric stability and noise rejection.
SCL/SCLKClock input for I²C/SPIConfigurable as I²C SCL or SPI SCLK; internal pull-up not provided - external pull-up required for I²C.
SDA/MISOData I/O for I²C / MISO for SPIBidirectional I²C data line or SPI master-in/slave-out; shares pin with I²C SDA functionality.
SSSPI slave selectActive-low enable for SPI communication; high-impedance when unused in I²C mode.
Ready/PDM_CMeasurement status / PDM capacitance outputOpen-drain ready signal or ratiometric PDM stream - selected via EEPROM configuration.
Alarm_High / PDM_THigh-threshold alarm / PDM temperature outputProgrammable alarm output or secondary PDM channel - function determined by configuration bits.
Alarm_LowLow-threshold alarm outputDedicated open-drain/push-pull alarm pin; independently configurable thresholds and polarity.
VcoreInternal core voltage supplyInternally regulated ~1.2 V; requires 0.1 μF bypass capacitor to VSS for stable digital core operation.
NCNo connectPin 13 is unconnected - must remain floating or tied to GND per layout guidelines.
NCNo connectPin 14 is unconnected - no internal connection; avoid routing or soldering.
GNDSecondary ground padThermal and electrical ground pad (exposed die attach); must be soldered to PCB ground plane for thermal performance.

Key Features

FeatureDesign Value
Digital sensor compensationOn-chip DSP applies piecewise 1st/2nd-order or single-region 3rd-order correction to raw capacitance, eliminating need for external linearization circuitry.
Integrated temperature referenceOn-die temperature sensor with no external components required - enables simultaneous capacitance and temperature measurement with correlated drift compensation.
Configurable output modesI²C, SPI, dual PDM streams (capacitance + temperature), and two independent alarms - allows flexible host interface selection without redesigning firmware or hardware.
One-pass digital calibrationCalibration coefficients programmed via I²C into on-chip EEPROM - eliminates laser trimming, reduces test time, and enables field recalibration.
Chip-on-board optimized layoutPinout and die orientation designed for direct die-die bonding with capacitive sensor dies - minimizes parasitic capacitance and enables ultra-compact, low-cost module assembly.

Applications

Industrial Pressure SensingAutomotive HVAC Controls

Use Scenario: MEMS-based pressure transducer in industrial process monitoring, measuring 0–100 kPa with <1% nonlinearity.

IC Role / Device Role / Timing Role: Primary signal conditioner performing capacitance-to-digital conversion, temperature-compensated linearization, and I²C output to PLC controller.

Use Value: Achieves ±0.25% FSO accuracy over –40°C to +125°C without external compensation components or trimming.

Use Scenario: Cabin air flap position feedback in automotive HVAC systems using differential capacitive sensors.

IC Role / Device Role / Timing Role: Differential capacitance front-end with 10-bit resolution at 5 ms update rate, delivering PDM outputs to MCU with integrated PDM decimation.

Use Value: Enables contactless, wear-free position sensing with built-in alarm outputs for out-of-range detection.

Smart Level SensorsMedical Disposable Fluid Monitoring

Use Scenario: Conductive liquid level detection in stainless-steel tanks using fringing-field capacitive probes.

IC Role / Device Role / Timing Role: Single-ended capacitance conditioner with programmable span/offset, driving SPI interface to edge gateway.

Use Value: Supports 260 pF full-scale range and 14-bit resolution for sub-millimeter level resolution in corrosive environments.

Use Scenario: Disposable IV bag fluid volume monitoring in point-of-care devices with battery life >2 years.

IC Role / Device Role / Timing Role: Ultra-low-power signal conditioner operating in Sleep Mode (≤1 μA), waking on timer or host command to perform 12-bit measurement.

Use Value: Extends battery life while maintaining medical-grade accuracy and supporting FDA-required calibration traceability via EEPROM-stored coefficients.

Equivalent & Alternatives

The following parts are listed as comparable options for similar capacitive sensor signal conditioning applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
TDK InvenSense ICM-42688-PCombines 6-axis IMU with integrated capacitive sensing frontend; lacks dedicated EEPROM-based multi-order compensation engine and PDM outputs.Targeted at motion + proximity fusion; not optimized for high-accuracy static capacitance measurement or industrial calibration workflows.Select ZSSC3123AA6B when absolute accuracy, temperature drift compensation, and factory calibration traceability are required.
Analog Devices AD774524-bit CDC with 16 pF full-scale range; no on-chip temperature compensation logic, no EEPROM, no alarm outputs, and no PDM mode.Requires external MCU for compensation math and alarm generation; suited for lab-grade metrology, not embedded industrial modules.Select ZSSC3123AA6B for turnkey sensor conditioning with minimal host processing and robust industrial packaging.

Compared with ICM-42688-P and AD7745, the ZSSC3123AA6B uniquely integrates sensor-specific correction algorithms, dual alarm outputs, PDM ratiometric outputs, and EEPROM-based calibration storage - reducing BOM count, firmware complexity, and production calibration cost in volume OEM designs.

Availability

ZSSC3123AA6B is available at Aetrix Electronics and suitable for industrial pressure sensing, automotive HVAC controls, smart level sensors, and medical disposable fluid monitoring requiring stable component supply, long-term lifecycle support, and RoHS-compliant packaging.

Supply support for ZSSC3123AA6B includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Renesas Electronics is a global semiconductor leader delivering microcontrollers, analog, power, and SoC solutions for automotive, industrial, infrastructure, and IoT applications.

The ZSSC3123AA6B belongs to Renesas' cLite™ family of capacitive signal conditioners, engineered specifically for high-accuracy, low-power, and calibration-efficient integration with MEMS and printed capacitive sensors in harsh-environment industrial and automotive systems.

FAQ

What is the maximum sensor capacitance supported by the ZSSC3123AA6B?

The ZSSC3123AA6B supports sensor capacitances up to 260 pF when configured with the Mult8 setting. This is achieved through internal programmable gain scaling in the capacitance-to-digital converter (CDC), allowing full-scale operation across multiple ranges: 2–10 pF (Mult1), 8–32 pF (Mult2), 32–130 pF (Mult4), and 130–260 pF (Mult8). The ZSSC3123AA6B automatically adjusts resolution and conversion time based on selected range.

Does the ZSSC3123AA6B require external components for temperature compensation?

No, the ZSSC3123AA6B includes an internal temperature sensor and performs full 1st- and 2nd-order temperature gain and offset drift compensation digitally using coefficients stored in on-chip EEPROM. No external thermistor, RTD, or reference components are needed - simplifying layout and improving long-term stability in the ZSSC3123AA6B design.

Can the ZSSC3123AA6B operate in ultra-low-power modes for battery-powered applications?

Yes, the ZSSC3123AA6B supports Sleep Mode with typical current consumption ≤1 μA at 85°C. In this mode, it maintains EEPROM and configuration state while disabling the CDC and digital core. Wake-up is triggered by I²C/SPI activity or alarm events. This makes the ZSSC3123AA6B well-suited for energy-constrained applications such as portable medical devices and wireless sensor nodes.

How is calibration performed for the ZSSC3123AA6B?

Calibration of the ZSSC3123AA6B is performed digitally via I²C interface using Renesas-provided software tools. A one-pass procedure writes sensor-specific offset, sensitivity, and temperature drift coefficients into the on-chip EEPROM. Once programmed, the ZSSC3123AA6B autonomously applies correction during operation - eliminating laser trimming, external DACs, or manual potentiometer adjustments.

What output formats does the ZSSC3123AA6B support besides I²C and SPI?

In addition to I²C and SPI, the ZSSC3123AA6B supports Pulse Density Modulation (PDM) outputs for both capacitance (PDM_C) and temperature (PDM_T), delivered on dedicated pins. These ratiometric, clock-less outputs simplify interfacing with MCUs featuring PDM decimation filters - avoiding the need for additional ADC resources. The ZSSC3123AA6B also provides two configurable alarm outputs (Alarm_High and Alarm_Low) with push-pull or open-drain drive capability.

ZSSC3123AA6B Specifications

Product attributes
Attribute value
Manufacturer:
Renesas
Package/Case:
Die
Series:
cLite™
Packaging:
Tray
Product Status:
Active
Programmable:
-
Type:
Capacitive Sensor
Input Type:
Capacitive
Output Type:
I2C, SPI
Current - Supply:
1.1 mA
Operating Temperature:
-40°C ~ 125°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
Die

ZSSC3123AA6B FAQ

1.How can I place an order for ZSSC3123AA6B through Aetrix?

Please submit a Request for Quotation (RFQ) for ZSSC3123AA6B on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for ZSSC3123AA6B reliable?

The price and inventory of ZSSC3123AA6B are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for ZSSC3123AA6B is usually 5 days.

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We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for ZSSC3123AA6B transactions.

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ZSSC3123AA6B orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your ZSSC3123AA6B order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for ZSSC3123AA6B?

For technical support, including ZSSC3123AA6B datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your ZSSC3123AA6B requirements.

6.How does Aetrix verify that ZSSC3123AA6B is sourced from the original manufacturer or authorized distributors?

All ZSSC3123AA6B products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that ZSSC3123AA6B meets industry standards.

7.What is the process for return or replacement of ZSSC3123AA6B?

All ZSSC3123AA6B units undergo pre-shipment inspection (PSI). If there is an issue with ZSSC3123AA6B, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The ZSSC3123AA6B part is unused and in its original packaging.

Return procedure for ZSSC3123AA6B:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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