Renesas ZSSC3123AA6C
- Part No.:
- ZSSC3123AA6C
- Manufacturer:
- Renesas
- Category:
- Sensor and Detector Interfaces
- Package:
- Die
- Datasheet:
-
ZSSC3123AA6C.pdf
- Description:
- DICE (WAFER SAWN) - FRAME
- Quantity:
- Payment:

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Product details
Overview
ZSSC3123AA6C from Renesas Electronics is a CMOS capacitive sensor signal conditioner IC that performs high-accuracy capacitance-to-digital conversion with on-chip digital compensation for offset, sensitivity, and temperature drift. It supports single or differential capacitive sensors up to 260 pF, delivers ±0.25% FSO accuracy from –40°C to +125°C, and outputs corrected values via I²C, SPI, or PDM-enabling precision pressure, level, or proximity sensing in automotive and industrial modules.
For engineers reviewing the ZSSC3123AA6C datasheet, ZSSC3123AA6C pinout, ZSSC3123AA6C application, or ZSSC3123AA6C equivalent, key selection considerations include its 14-TSSOP package, programmable resolution (8–14 bit), dual alarm outputs, internal temperature reference, and support for die-bonded chip-on-board assembly without external trimming components.
Technical Context
The ZSSC3123AA6C integrates a capacitance-to-digital converter (CDC) with configurable multiplier settings (Mult1–Mult8) to match sensor capacitance ranges from 2 pF to 260 pF. Its digital signal processor applies piece-wise 1st/2nd-order or single-region 3rd-order correction using EEPROM-stored calibration coefficients, enabling sensor-specific linearization without analog trimming.
It features dual independent alarm outputs (Alarm_High/Alarm_Low) configurable as push-pull or open-drain, plus PDM outputs for ratiometric capacitance and temperature signals. The device operates across 2.3 V–5.5 V supply and achieves ≤1 μA sleep current at 85°C, supporting battery-powered sensing nodes requiring long-term stability and low-power wake-up capability.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Supply Voltage | 2.3 V to 5.5 V - enables direct interface with common microcontrollers and battery systems without LDO overhead. |
| Max Input Capacitance | 260 pF - supports wide-range MEMS and PCB-based capacitive sensors including differential configurations. |
| Accuracy | ±0.25% FSO at –40°C to +125°C, VSUPPLY ±10% - ensures stable measurement performance across automotive and industrial thermal environments. |
| Resolution & Speed | 8-bit @ 0.7 ms, 10-bit @ 1.6 ms, 12-bit @ 5.0 ms, 14-bit @ 18.5 ms - allows trade-off between update rate and noise floor per application need. |
| Interface Options | I²C, SPI, and PDM - provides flexible host connectivity: I²C/SPI for digital readout and configuration, PDM for analog-ratiometric output without ADC. |
| Alarm Outputs | Two independent outputs (Alarm_High/Alarm_Low), push-pull or open-drain - enables direct control of external circuitry (e.g., relays, LEDs) without additional drivers. |
| Current Consumption | 750 μA typical active, ≤1 μA sleep at 85°C - supports multi-year operation in energy-constrained IoT and portable sensor nodes. |
Pinout & Package
Package: 4.4 mm × 5.0 mm 14-pin TSSOP (RoHS-compliant, lead-free).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDD | Power supply input | Primary supply rail (2.3–5.5 V); requires local 0.1 μF decoupling to GND. |
| VSS | Ground reference | Analog and digital ground return; must be low-impedance and connected near VDD decoupling. |
| C0 / C1 | Capacitive sensor inputs | C0 is primary sensor terminal; C1 enables differential mode (C0–C1) or optional reference path. |
| CC | Reference capacitor connection | Connects external reference capacitor for CDC gain calibration; value selected per Mult setting. |
| SCL/SCLK | Clock input | I²C clock (SCL) or SPI clock (SCLK); shared pin with mode auto-detected on power-up. |
| SDA/MISO | Data bidirectional I/O | I²C data (SDA) or SPI master-in/slave-out (MISO); supports standard/fast-mode I²C and 4-wire SPI. |
| SS | SPI slave select | Active-low enable for SPI communication; pulled high internally when not used. |
| Ready/PDM_C | Status or PDM output | Indicates measurement completion (Ready) or outputs ratiometric capacitance PDM stream. |
| Alarm_High | Programmable alarm output | Configurable high-threshold alarm; push-pull or open-drain; drives external loads directly. |
| Alarm_Low | Programmable alarm output | Configurable low-threshold alarm; independent of Alarm_High; same drive options. |
| PDM_T | Temperature PDM output | Outputs ratiometric temperature signal as pulse density modulated waveform. |
| Vcore | Internal core voltage | Internally regulated core supply; no external connection required. |
| NC | No connect | Pin 13 is unconnected; must remain floating or tied to GND per layout guidelines. |
Key Features
| Feature | Design Value |
|---|---|
| Digital sensor compensation | On-chip DSP applies piece-wise 1st/2nd-order or 3rd-order single-region correction using EEPROM-stored coefficients-eliminates analog trimming and enables one-pass digital calibration. |
| Integrated temperature reference | On-die temperature sensor with <±0.5°C nonlinearity and digital compensation-no external thermistor or reference needed for full thermal drift correction. |
| Flexible output architecture | Simultaneous I²C/SPI digital readout + dual PDM streams (capacitance & temperature) + two independent alarms-reduces system BOM and simplifies firmware integration. |
| Chip-on-board optimized layout | Pinout and die design support direct die-to-die bonding with capacitive sensor elements-minimizes parasitic capacitance and enables ultra-compact, low-cost sensor modules. |
| Low-power operation modes | Configurable Update Mode (750 μA typical) and Sleep Mode (≤1 μA) with programmable wake-up intervals-extends battery life in wireless sensor nodes and portable instrumentation. |
Applications
| Automotive Occupancy Detection | Industrial Level Sensing |
|---|---|
|
Use Scenario: Detecting seat occupancy via embedded capacitive electrodes in vehicle seats under varying cabin temperatures and humidity. IC Role / Device Role / Timing Role: Primary signal conditioner performing real-time capacitance-to-digital conversion and 2nd-order temperature-compensated offset/sensitivity correction. Use Value: Delivers ±0.25% FSO accuracy over –40°C to +125°C without external calibration hardware, meeting ASIL-B functional safety readiness for occupant classification. |
Use Scenario: Monitoring liquid level in stainless-steel tanks using coaxial capacitive probes exposed to wide temperature swings and chemical vapors. IC Role / Device Role / Timing Role: Front-end conditioner converting probe capacitance changes into calibrated digital values while rejecting EMI and compensating for thermal expansion effects. Use Value: Supports differential input mode and 260 pF full-scale range to handle probe parasitics and long cable runs; PDM outputs simplify isolation in hazardous-area designs. |
| Medical Disposable Pressure Sensors | Smart Appliance Touch Controls |
|
Use Scenario: Single-use blood pressure transducers requiring factory-calibrated, low-power, and miniaturized signal conditioning for disposable cartridges. IC Role / Device Role / Timing Role: Integrated signal chain with EEPROM-stored calibration coefficients and die-bondable layout-enables chip-on-flex or chip-on-ceramic assembly. Use Value: Eliminates laser trimming and reduces calibration time by >90%; 1 μA sleep current extends shelf life and enables pre-sterilized storage. |
Use Scenario: Waterproof touch-sensitive controls on washing machines and dishwashers where moisture and detergent exposure degrade conventional solutions. IC Role / Device Role / Timing Role: Capacitive front-end with programmable sensitivity and dual alarm outputs driving status LEDs or buzzer feedback directly. Use Value: Configurable 8–14-bit resolution adapts to varying electrode size and overlay thickness; internal temperature compensation maintains consistent touch response across ambient conditions. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar capacitive sensor signal conditioning applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| TDK InvenSense ICM-42688-P | Combines 6-axis IMU with integrated capacitive interface; lacks dedicated EEPROM-based sensor-specific correction and PDM outputs. | Targeted at motion + proximity fusion; not optimized for high-accuracy static capacitance measurement or industrial-level calibration traceability. | Choose only if motion sensing is co-required; ZSSC3123AA6C offers superior linearity, lower power in pure capacitance mode, and simpler calibration workflow. |
| Analog Devices AD7745 | 24-bit CDC with 17 pF max input range and no on-chip temperature compensation algorithm; requires external MCU for correction math. | Requires external processing for sensor linearization and thermal drift correction-increasing firmware complexity and BOM cost. | Select AD7745 only for ultra-high-resolution single-point measurements below 20 pF; ZSSC3123AA6C provides broader range, integrated correction, and lower total system power. |
Compared with ICM-42688-P and AD7745, the ZSSC3123AA6C uniquely combines wide-input-range CDC, on-chip 3rd-order correction, dual PDM outputs, and EEPROM-based digital mating-making it optimal for production-ready, calibrated capacitive sensor modules where accuracy, power, and calibration simplicity are critical.
Availability
ZSSC3123AA6C is available at Aetrix Electronics and suitable for automotive occupancy detection, industrial tank level monitoring, medical disposable pressure transducers, and smart appliance touch interfaces requiring stable component supply, long-term calibration retention, and RoHS-compliant packaging.
Supply support for ZSSC3123AA6C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Renesas Electronics is a global semiconductor leader delivering microcontrollers, analog power, and SoC solutions for automotive, industrial, and IoT applications-with emphasis on functional safety, reliability, and embedded intelligence.
The ZSSC3123AA6C belongs to Renesas' cLite™ family of highly integrated sensor signal conditioners, designed specifically for production-grade capacitive sensing systems requiring factory-calibrated accuracy, minimal external components, and seamless integration into chip-on-board or module-level assemblies.
FAQ
What is the maximum sensor capacitance supported by the ZSSC3123AA6C?
The ZSSC3123AA6C supports capacitive sensors up to 260 pF using the Mult8 configuration. This is confirmed in the datasheet's Table 9 and Section 9.2.1, which defines full-scale ranges per multiplier setting. The device automatically scales resolution and conversion time based on selected Mult mode, ensuring optimal SNR across the entire range without external component changes.
Does the ZSSC3123AA6C require an external temperature sensor for compensation?
No, the ZSSC3123AA6C includes an on-die temperature sensor with digital compensation logic. As stated in the Features section and Section 9.2.2, it performs 1st- and 2nd-order temperature gain and offset drift correction using internal references-no external thermistor, RTD, or temperature IC is needed for full thermal compensation.
Can the ZSSC3123AA6C operate in both single-ended and differential capacitive sensor configurations?
Yes, the ZSSC3123AA6C supports both configurations. Pin C0 serves as the primary input; C1 enables differential mode (C0–C1) or acts as an optional reference path. The datasheet's Application Circuit Examples (Section 14.4) and Block Diagram (Page 2) explicitly confirm differential input capability for improved noise immunity and common-mode rejection.
How is calibration performed for the ZSSC3123AA6C?
Calibration is performed digitally via I²C using the ZSSC3123 SSC Evaluation Kit. A PC-based tool writes sensor-specific correction coefficients (offset, sensitivity, temperature drift) into the on-chip EEPROM. As described on Page 1, this "digital mating" eliminates laser trimming and enables one-pass calibration-ensuring repeatability and traceability without analog adjustments.
What output formats does the ZSSC3123AA6C provide for sensor data?
The ZSSC3123AA6C provides three concurrent output formats: digital values via I²C or SPI, ratiometric pulse density modulation (PDM) for capacitance (Ready/PDM_C) and temperature (PDM_T), and two programmable alarm signals (Alarm_High/Alarm_Low). These are detailed in Sections 10.5, 10.7, and 10.8 of the datasheet and allow flexible system-level integration without additional signal conditioning.
ZSSC3123AA6C Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Renesas
- Package/Case:
- Die
- Series:
- cLite™
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- -
- Type:
- Capacitive Sensor
- Input Type:
- Capacitive
- Output Type:
- I2C, SPI
- Current - Supply:
- 1.1 mA
- Operating Temperature:
- -40°C ~ 125°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- Die
ZSSC3123AA6C FAQ
1.How can I place an order for ZSSC3123AA6C through Aetrix?
Please submit a Request for Quotation (RFQ) for ZSSC3123AA6C on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for ZSSC3123AA6C reliable?
The price and inventory of ZSSC3123AA6C are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for ZSSC3123AA6C is usually 5 days.
3.What payment methods are accepted for ZSSC3123AA6C?
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4.How is shipping managed for ZSSC3123AA6C?
ZSSC3123AA6C orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your ZSSC3123AA6C order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for ZSSC3123AA6C?
For technical support, including ZSSC3123AA6C datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your ZSSC3123AA6C requirements.
6.How does Aetrix verify that ZSSC3123AA6C is sourced from the original manufacturer or authorized distributors?
All ZSSC3123AA6C products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that ZSSC3123AA6C meets industry standards.
7.What is the process for return or replacement of ZSSC3123AA6C?
All ZSSC3123AA6C units undergo pre-shipment inspection (PSI). If there is an issue with ZSSC3123AA6C, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The ZSSC3123AA6C part is unused and in its original packaging.
Return procedure for ZSSC3123AA6C:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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