My Inquiry
My Account
Renesas ZSSC3123AA7R
- Part No.:
- ZSSC3123AA7R
- Manufacturer:
- Renesas
- Category:
- Sensor and Detector Interfaces
- Package:
- 14-TSSOP (0.173", 4.40mm Width)
- Datasheet:
-
ZSSC3123AA7R.pdf
- Description:
- TSSOP / 14 / 4,4MM G1 - TAPE&REE
- Quantity:
- Payment:
- Shipping:
Inventory:1,390
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
ZSSC3123AA7R from Renesas Electronics is a CMOS capacitive sensor signal conditioner IC that performs high-accuracy capacitance-to-digital conversion and digital correction of offset, sensitivity, and temperature drift using on-chip EEPROM-stored calibration coefficients. It supports single or differential capacitive sensors up to 260 pF, offers I²C/SPI/PDM outputs, and operates from 2.3 V to 5.5 V across –40°C to +125°C - used in industrial pressure and level sensing systems.
For engineers reviewing the ZSSC3123AA7R datasheet, ZSSC3123AA7R pinout, ZSSC3123AA7R application, or ZSSC3123AA7R equivalent, key selection factors include its 14-TSSOP package, programmable resolution (8–14 bit), dual alarm outputs, internal temperature reference, and support for die-bonded chip-on-board assembly with minimal external components.
Technical Context
The ZSSC3123AA7R integrates a capacitance-to-digital converter (CDC) with configurable multiplier settings (Mult1–Mult8), enabling full-scale input ranges from 2 pF to 260 pF. Its digital signal processor executes piecewise 1st/2nd-order or single-region 3rd-order sensor compensation algorithms using coefficients stored in on-chip EEPROM.
Temperature compensation is performed digitally using an internal reference sensor, eliminating external components. Output modes include I²C (up to 400 kHz), SPI (mode 0/3), pulse density modulation (PDM) for ratiometric analog-like signals, and two configurable alarm outputs supporting push-pull or open-drain operation.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Supply Voltage | 2.3 V to 5.5 V - enables direct interface with 3.3 V and 5 V microcontrollers without level-shifting. |
| Input Capacitance Range | Up to 260 pF - supports wide variety of MEMS and printed capacitive sensors including differential configurations. |
| Resolution & Conversion Time | 8-bit @ 0.7 ms; 14-bit @ 18.5 ms - trade-off between speed and precision selectable per application timing budget. |
| Accuracy | ±0.25% FSO over –40°C to +125°C at 3 V/5 V, VSUPPLY ±10% - specified under defined calibration and operating conditions. |
| Current Consumption | 750 μA typical active; ≤1 μA sleep at 85°C - suitable for battery-powered industrial monitoring nodes. |
| Operating Temperature | –40°C to +125°C - qualified for under-hood automotive and harsh industrial environments. |
| Digital Interfaces | I²C (standard/fast mode), SPI (mode 0/3), PDM - provides flexible host MCU integration options. |
Pinout & Package
Package: 4.4 mm × 5.0 mm 14-pin TSSOP (RoHS-compliant, lead-free).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDD | Power supply input | Primary supply rail (2.3–5.5 V); requires local 0.1 μF decoupling. |
| VSS | Ground reference | Analog/digital ground common return; must be low-impedance connection. |
| C0 / C1 | Capacitive sensor inputs | Differential or single-ended sensor terminals; C1 optional for differential mode. |
| CC | Reference capacitor connection | Connects external reference cap (typically 10–100 pF) for CDC gain calibration. |
| SCL/SCLK | Clock input | I²C clock (SCL) or SPI clock (SCLK); shared pin with mode auto-detection. |
| SDA/MISO | Data I/O | I²C bidirectional data (SDA) or SPI master-in/slave-out (MISO); auto-detected interface. |
| SS | SPI slave select | Active-low chip select for SPI communication only; high-Z when unused. |
| Alarm_High / Alarm_Low | Configurable alarm outputs | Push-pull or open-drain digital alarms; independently programmable thresholds. |
| Ready / PDM_C | Status or PDM output | Indicates measurement completion (Ready) or outputs capacitance PDM stream. |
| PDM_T | Temperature PDM output | Separate pulse-density modulated output for temperature readings. |
| Vcore | Internal core voltage | Internally regulated supply; no external connection required. |
| GND | Ground | Second ground pin for improved noise immunity in mixed-signal layout. |
| NC | No connect | Pin 13 is unconnected; must remain floating or tied to GND per layout guidelines. |
| NC | No connect | Pin 14 is unconnected; must remain floating or tied to GND per layout guidelines. |
Key Features
| Feature | Design Value |
|---|---|
| Digital sensor compensation | On-chip DSP applies piecewise linear or 3rd-order polynomial correction to raw capacitance data using EEPROM-stored coefficients. |
| Integrated temperature reference | On-die temperature sensor eliminates need for external thermistors or RTDs in thermal drift compensation. |
| Multi-interface output flexibility | I²C, SPI, and dual PDM outputs allow seamless integration into resource-constrained or analog-compatible systems. |
| Dual independent alarms | Two fully configurable digital alarm outputs support high/low threshold detection with push-pull or open-drain drive capability. |
| Chip-on-board optimization | Pin layout and die design support direct die-to-die bonding with capacitive sensor elements, reducing parasitics and BOM cost. |
Applications
| Industrial Pressure Transducers | Automotive HVAC Sensors |
|---|---|
Use Scenario: MEMS-based pressure transducer in factory automation or process control requiring stable output over wide temperature range. IC Role / Device Role / Timing Role: Primary signal conditioner converting differential capacitance changes into calibrated digital values via I²C. Use Value: ±0.25% FSO accuracy and internal temperature compensation eliminate need for external calibration hardware or software correction tables. | Use Scenario: Cabin air quality and temperature sensing module in automotive HVAC systems with space and power constraints. IC Role / Device Role / Timing Role: Capacitive humidity and temperature signal conditioner delivering PDM outputs compatible with low-cost analog front-ends. Use Value: ≤1 μA sleep current and integrated temperature reference reduce system-level power and component count. |
| Level Sensing in Harsh Environments | Medical Disposable Fluid Sensors |
Use Scenario: Non-contact liquid level detection in chemical tanks where corrosion-resistant capacitive probes are used. IC Role / Device Role / Timing Role: High-voltage-tolerant signal conditioner interfacing with isolated probe electrodes and reporting via SPI to isolated MCU. Use Value: 260 pF input range and programmable CDC multiplier enable accurate scaling for large-area or shielded probe designs. | Use Scenario: Single-use medical fluid bag level indicator with ultra-low-power requirement and small PCB footprint. IC Role / Device Role / Timing Role: Low-power capacitive sensor interface providing alarm-triggered status via open-drain outputs to microcontroller GPIO. Use Value: 750 μA typical active current and 14-TSSOP package support compact, battery-operated disposable device form factors. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar capacitive sensor signal conditioning applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| TDK InvenSense ICM-42688-P | Combines 6-axis IMU with integrated capacitive sensing frontend; lacks dedicated EEPROM-based multi-order compensation engine. | Targeted at motion + proximity fusion; not optimized for high-accuracy static capacitance measurement or industrial calibration workflows. | Select when motion sensing is co-required; avoid when pure capacitive signal conditioning with factory calibration traceability is needed. |
| Analog Devices AD7745 | 24-bit CDC with lower max input capacitance (17 pF), no on-chip temperature compensation algorithm, requires external temp sensor for drift correction. | Best suited for lab-grade precision measurements with external calibration infrastructure; lacks integrated alarm outputs and PDM mode. | Select for ultra-high-resolution single-point measurements; avoid for embedded systems needing autonomous temperature-compensated output or alarm triggering. |
Compared with ICM-42688-P and AD7745, the ZSSC3123AA7R uniquely delivers factory-programmable, EEPROM-based multi-order sensor and temperature compensation in a single-chip solution with dual alarms and PDM outputs - reducing firmware complexity and external component count in production-capable industrial sensor modules.
Availability
ZSSC3123AA7R is available at Aetrix Electronics and suitable for industrial pressure transducers, automotive HVAC sensors, harsh-environment level sensing, and medical disposable fluid sensors requiring stable component supply, long-term calibration retention, and extended temperature operation.
Supply support for ZSSC3123AA7R includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Renesas Electronics is a global semiconductor manufacturer specializing in microcontrollers, analog, power, and sensor signal conditioning solutions for industrial, automotive, and IoT applications.
The ZSSC3123 product line is designed specifically for high-accuracy, low-power capacitive sensor interfacing - targeting factory-calibrated, maintenance-free industrial and automotive sensing modules with minimal external components.
FAQ
What is the primary function of the ZSSC3123AA7R in a capacitive sensing system?
The ZSSC3123AA7R serves as a complete capacitive sensor signal conditioner: it digitizes capacitance changes, applies digital compensation for sensor nonlinearity and temperature drift using on-chip EEPROM-stored coefficients, and outputs calibrated data via I²C, SPI, or PDM. The ZSSC3123AA7R eliminates need for external trimming or analog compensation circuits, enabling one-pass digital calibration.
Does the ZSSC3123AA7R require an external temperature sensor for drift compensation?
No. The ZSSC3123AA7R includes an internal temperature sensor and performs full digital temperature compensation of both sensor offset and sensitivity drift using built-in algorithms and EEPROM-stored coefficients. No external thermistor, RTD, or temperature IC is required - simplifying layout and reducing BOM cost.
What are the supported communication interfaces for the ZSSC3123AA7R?
The ZSSC3123AA7R supports three output modes: I²C (standard and fast mode), SPI (mode 0 and mode 3), and pulse density modulation (PDM) for both capacitance and temperature. Interface selection is automatic based on signal activity on SCL/SCLK and SDA/MISO pins - no configuration register write is needed to switch protocols.
Can the ZSSC3123AA7R drive alarms directly without external circuitry?
Yes. The ZSSC3123AA7R features two dedicated alarm outputs (Alarm_High and Alarm_Low) that can be configured as either push-pull or open-drain drivers. Each alarm supports independent high/low threshold programming and can directly interface with microcontroller GPIOs, LEDs, or relay drivers without additional discrete components.
Is the ZSSC3123AA7R suitable for battery-powered applications?
Yes. The ZSSC3123AA7R draws as little as ≤1 μA in Sleep Mode at 85°C and 750 μA typical in active Update Mode - making it well-suited for battery-operated industrial monitors and portable medical devices. Its wide 2.3–5.5 V supply range also supports direct use with primary lithium or coin-cell sources.
ZSSC3123AA7R Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Renesas
- Package/Case:
- 14-TSSOP (0.173", 4.40mm Width)
- Series:
- cLite™
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- -
- Type:
- Capacitive Sensor
- Input Type:
- Capacitive
- Output Type:
- I2C, SPI
- Current - Supply:
- 1.1 mA
- Operating Temperature:
- -40°C ~ 125°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 14-TSSOP
ZSSC3123AA7R FAQ
1.How can I place an order for ZSSC3123AA7R through Aetrix?
Please submit a Request for Quotation (RFQ) for ZSSC3123AA7R on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for ZSSC3123AA7R reliable?
The price and inventory of ZSSC3123AA7R are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for ZSSC3123AA7R is usually 5 days.
3.What payment methods are accepted for ZSSC3123AA7R?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for ZSSC3123AA7R transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for ZSSC3123AA7R?
ZSSC3123AA7R orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your ZSSC3123AA7R order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for ZSSC3123AA7R?
For technical support, including ZSSC3123AA7R datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your ZSSC3123AA7R requirements.
6.How does Aetrix verify that ZSSC3123AA7R is sourced from the original manufacturer or authorized distributors?
All ZSSC3123AA7R products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that ZSSC3123AA7R meets industry standards.
7.What is the process for return or replacement of ZSSC3123AA7R?
All ZSSC3123AA7R units undergo pre-shipment inspection (PSI). If there is an issue with ZSSC3123AA7R, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The ZSSC3123AA7R part is unused and in its original packaging.
Return procedure for ZSSC3123AA7R:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
ZSSC3123AA7R Tags
-
RE46C100S8TF
Microchip Technology
-
XTR111AIDRCR
Texas Instruments
-
XTR111AIDGQR
Texas Instruments
-
XTR117AIDGKR
Texas Instruments
-
XTR111AIDGQT
Texas Instruments
-
XTR115UA/2K5
Texas Instruments
-
MAX14626ETT+T
Analog Devices Inc./Maxim Integrated
-
XTR116UA/2K5
Texas Instruments
-
XTR115U/2K5
Texas Instruments
-
XTR116U/2K5
Texas Instruments
-
PGA308AIDGSR
Texas Instruments
-
XTR300AIRGWR
Texas Instruments
Tech Hub
TTL and CMOS logic families differ in thresholds, loading, output drive, power and timing. This engineering guide compares 74HC and 74HCT, calculates noise margins and checks 3.3 V/5 V compatibility.
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
