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Renesas ZSSC3123AI6C
- Part No.:
- ZSSC3123AI6C
- Manufacturer:
- Renesas
- Category:
- Sensor and Detector Interfaces
- Package:
- Die
- Datasheet:
-
ZSSC3123AI6C.pdf
- Description:
- DICE (WAFER SAWN) - FRAME
- Quantity:
- Payment:
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Product details
Overview
ZSSC3123AI6C from Renesas Electronics is a CMOS capacitive sensor signal conditioner IC that performs high-accuracy capacitance-to-digital conversion with on-chip digital compensation for offset, sensitivity, and temperature drift. It supports capacitive sensors up to 260 pF, offers resolution from 8-bit to 14-bit (conversion times 0.7 ms to 18.5 ms), and delivers calibrated outputs via I²C, SPI, or PDM - enabling precision pressure, level, and proximity sensing in industrial and automotive systems.
For engineers reviewing the ZSSC3123AI6C datasheet, ZSSC3123AI6C pinout, ZSSC3123AI6C application, or ZSSC3123AI6C equivalent, key selection considerations include its 2.3–5.5 V supply range, ≤1 μA sleep current at 85°C, ±0.25% FSO accuracy over –40°C to +125°C, dual alarm outputs, and die or 14-TSSOP packaging for chip-on-board or PCB integration.
Technical Context
The ZSSC3123AI6C integrates a capacitance-to-digital converter (CDC) with programmable gain (Mult1–Mult8), internal temperature sensor, and digital signal processor executing piece-wise 1st/2nd-order or single-region 3rd-order sensor compensation algorithms using EEPROM-stored coefficients. Its analog front end accepts single-ended (C₀/CC) or differential (C₀/C₁) capacitive inputs.
It operates in two primary modes: Update Mode (active measurement with configurable resolution/speed) and Sleep Mode (≤1 μA quiescent current, wake-on-I²C/SPI/alarm). Output options include digital (I²C/SPI packets), ratiometric PDM for capacitance and temperature, and two independently configurable push-pull or open-drain alarm outputs.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Supply Voltage | 2.3 V to 5.5 V - supports direct connection to common industrial rails (3.3 V, 5 V) and battery-powered systems without LDO overhead. |
| Capacitance Range | Up to 260 pF - accommodates wide sensor portfolio including MEMS pressure, liquid level, and touch sensors. |
| Resolution & Speed | 8-bit @ 0.7 ms, 10-bit @ 1.6 ms, 12-bit @ 5.0 ms, 14-bit @ 18.5 ms - enables trade-off between update rate and noise performance per application need. |
| Accuracy | ±0.25% FSO over –40°C to +125°C at 3 V/5 V, VSUPPLY ±10% - meets stringent requirements for automotive and industrial closed-loop control. |
| Current Consumption | 750 μA typical active; ≤1 μA in Sleep Mode at 85°C - enables multi-year operation on coin-cell batteries. |
| Output Interfaces | I²C, SPI, PDM (capacitance & temperature), dual alarms - eliminates need for external ADC, microcontroller, or analog filtering in many designs. |
| Operating Temperature | –40°C to +125°C - qualified for under-hood automotive, industrial motor control, and harsh-environment sensing. |
Pinout & Package
Package: 14-pin TSSOP (4.4 × 5.0 mm), RoHS-compliant, lead-free. Also available in die form for chip-on-board bonding.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDD | Power supply input | Primary supply rail (2.3–5.5 V); requires local 0.1 μF decoupling to GND. |
| VSS | Ground reference | Analog/digital ground return; must be low-impedance and separated from noisy system grounds. |
| C0 | Sensor capacitance input (single-ended) | Connects to one terminal of single capacitive sensor; used with CC for reference path. |
| CC | Capacitor common/reference node | Reference terminal for single-ended mode; also serves as second input in differential C₀/C₁ configuration. |
| C1 | Differential sensor input | Second sensor terminal for differential capacitance measurement (C₀ − C₁), improving noise immunity. |
| SCL/SCLK | Clock input for I²C/SPI | Configurable interface clock; supports standard/fast-mode I²C (100/400 kHz) and SPI up to 10 MHz. |
| SDA/MISO | Data I/O for I²C / MISO for SPI | Bidirectional data line for I²C; output-only for SPI read operations. |
| SS | SPI slave select | Active-low chip select; required only when SPI interface is enabled. |
| Alarm_High | Programmable high-threshold alarm | Push-pull or open-drain output; asserts when corrected capacitance exceeds user-defined upper limit. |
| Alarm_Low | Programmable low-threshold alarm | Push-pull or open-drain output; asserts when corrected capacitance falls below user-defined lower limit. |
| Ready/PDM_C | Measurement ready flag / PDM capacitance output | Drives high after conversion completes; doubles as pulse-density modulated capacitance output when configured. |
| PDM_T | Pulse-density modulated temperature output | Ratiometric PDM signal proportional to on-chip temperature - usable with simple RC filter for analog voltage output. |
| Vcore | Internal core voltage supply | Internally regulated supply; requires external 0.1 μF capacitor to stabilize internal LDO output. |
Key Features
| Feature | Design Value |
|---|---|
| Digital sensor compensation | On-chip DSP applies piece-wise 1st/2nd-order or single-region 3rd-order correction using EEPROM-stored coefficients - eliminates analog trimming and factory calibration hardware. |
| Integrated temperature reference | On-die temperature sensor with no external components required - enables full 2D (capacitance + temp) compensation without added BOM cost or layout area. |
| Multi-interface output | I²C, SPI, and dual PDM outputs provide flexibility: digital interfaces simplify MCU integration; PDM enables low-cost analog reconstruction without ADC. |
| Ultra-low-power sleep mode | ≤1 μA current draw at 85°C with wake-on-command capability - extends battery life in wireless sensor nodes and portable instrumentation. |
| Configurable alarm outputs | Two independent, polarity-selectable alarms with push-pull or open-drain drive - directly drives LEDs, relays, or MCU interrupt pins without external logic. |
| Chip-on-board optimized layout | Die version designed for direct die-die bonding with capacitive sensor elements - reduces parasitic capacitance, improves SNR, and lowers assembly cost in high-volume modules. |
Applications
| Industrial Pressure Sensing | Automotive HVAC Control |
|---|---|
|
Use Scenario: Monitoring diaphragm deflection in stainless-steel MEMS pressure transducers for pump control and leak detection in factory automation. IC Role / Device Role / Timing Role: Primary signal conditioner converting sensor capacitance to calibrated digital output with temperature-compensated accuracy better than ±0.25% FSO. Use Value: Eliminates manual trim pots and external temperature sensors, reducing calibration time by >90% and enabling one-pass digital calibration during final test. |
Use Scenario: Detecting cabin air flap position and humidity-coupled condensation risk in automotive climate control systems. IC Role / Device Role / Timing Role: Dual-role conditioner: measures capacitance for position and on-chip temperature for dew-point estimation, both output via PDM for low-pin-count MCU interface. Use Value: Single-chip solution replaces discrete ADC + temp sensor + compensation firmware, cutting BOM count by 3 components and PCB area by 25 mm². |
| Water Level Monitoring | Touchless Proximity Switching |
|
Use Scenario: Capacitive tank-level sensing in agricultural chemical tanks exposed to wide ambient temperature swings (–40°C to +85°C). IC Role / Device Role / Timing Role: High-stability conditioner applying 2nd-order temperature drift compensation to maintain accuracy across operating range without recalibration. Use Value: Achieves ±0.25% FSO error over full temperature range - meets ISO 11452-2 EMC robustness and long-term drift requirements for field-deployed equipment. |
Use Scenario: Replacing mechanical buttons with capacitive proximity detection on medical device housings requiring IP65 sealing and ESD immunity. IC Role / Device Role / Timing Role: Low-power signal conditioner driving dual alarms to indicate near/far proximity states, with <1 μA sleep current enabling always-on operation. Use Value: Enables battery-powered, maintenance-free operation for >5 years on CR2032; alarm outputs directly drive indicator LEDs without driver transistors. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar capacitive sensor signal conditioning applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| TDK InvenSense ICM-42688-P | MEMS IMU with integrated capacitive interface; lacks dedicated EEPROM-based sensor-specific compensation and PDM output. | Targeted at motion sensing; not optimized for static or slow-varying capacitive measurements like pressure or level. | Choose ZSSC3123AI6C for high-accuracy static capacitance measurement with factory-programmable compensation; choose ICM-42688-P only if motion sensing is co-required. |
| Analog Devices AD7745 | 24-bit CDC with 12-bit temperature channel; no on-chip DSP for multi-order sensor compensation; requires external microcontroller for correction. | Requires host MCU to run calibration algorithms; no native alarm outputs or PDM - adds firmware and component overhead. | Choose ZSSC3123AI6C when autonomous, self-contained signal conditioning with minimal host interaction is needed; AD7745 suits designs with existing processing resources and flexible calibration workflows. |
Compared with the AD7745 and ICM-42688-P, the ZSSC3123AI6C uniquely integrates EEPROM-stored, sensor-specific correction math, dual alarm outputs, and ratiometric PDM - delivering a complete, calibration-ready solution with no host firmware dependency for capacitive sensing.
Availability
ZSSC3123AI6C is available at Aetrix Electronics and suitable for industrial pressure sensing, automotive HVAC control, water level monitoring, and touchless proximity switching requiring stable component supply, extended temperature operation, and low-power design.
Supply support for ZSSC3123AI6C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Renesas Electronics is a global semiconductor leader delivering microcontrollers, analog, power, and SoC solutions for automotive, industrial, and IoT markets, with emphasis on reliability, functional safety, and energy efficiency.
The ZSSC3123AI6C belongs to Renesas' cLite™ family of highly integrated sensor signal conditioners, designed specifically to replace analog front ends and reduce calibration complexity in capacitive sensing systems across harsh-environment applications.
FAQ
What is the primary function of the ZSSC3123AI6C?
The ZSSC3123AI6C is a dedicated capacitive sensor signal conditioner IC that converts sensor capacitance into a calibrated digital or PDM output. It performs on-chip digital compensation for sensor offset, sensitivity, and temperature drift using EEPROM-stored coefficients - eliminating external trimming and analog calibration components. The ZSSC3123AI6C supports single-ended and differential capacitive inputs up to 260 pF and operates across –40°C to +125°C.
Does the ZSSC3123AI6C require an external temperature sensor?
No, the ZSSC3123AI6C includes an integrated temperature sensor with no external components required. It uses this on-die reference to perform 1st- and 2nd-order temperature compensation of both sensor offset and sensitivity drift. The temperature value is also available as a separate PDM output (PDM_T), enabling simultaneous capacitance and temperature reporting without additional ICs.
What output interfaces does the ZSSC3123AI6C support?
The ZSSC3123AI6C supports four output modalities: I²C (standard/fast-mode), SPI (up to 10 MHz), pulse density modulation for capacitance (PDM_C), and pulse density modulation for temperature (PDM_T). It also provides two programmable alarm outputs (Alarm_High and Alarm_Low) configurable as push-pull or open-drain. These interfaces allow flexible integration - from microcontroller-based digital systems to ultra-low-cost analog-reconstructed outputs.
How is calibration performed for the ZSSC3123AI6C?
Calibration is performed digitally via the I²C interface using the ZSSC3123 SSC Evaluation Kit. A PC-based tool programs sensor-specific correction coefficients (for offset, sensitivity, and temperature drift) into the on-chip EEPROM. Once programmed, the ZSSC3123AI6C autonomously applies correction during operation - requiring no laser trimming, no external DACs, and no host MCU involvement in real-time compensation. This enables one-pass calibration during final test.
What package options are available for the ZSSC3123AI6C?
The ZSSC3123AI6C is offered in a 14-pin TSSOP package (4.4 × 5.0 mm) and as a bare die. The TSSOP variant is RoHS-compliant and suitable for standard SMT assembly. The die version is optimized for chip-on-board integration with capacitive sensor dies, minimizing parasitic capacitance and improving signal integrity in high-density modules - a key advantage for automotive and industrial OEMs pursuing miniaturization.
ZSSC3123AI6C Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Renesas
- Package/Case:
- Die
- Series:
- cLite™
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- -
- Type:
- Capacitive Sensor
- Input Type:
- Capacitive
- Output Type:
- I2C, SPI
- Current - Supply:
- 1.1 mA
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- Die
ZSSC3123AI6C FAQ
1.How can I place an order for ZSSC3123AI6C through Aetrix?
Please submit a Request for Quotation (RFQ) for ZSSC3123AI6C on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for ZSSC3123AI6C reliable?
The price and inventory of ZSSC3123AI6C are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for ZSSC3123AI6C is usually 5 days.
3.What payment methods are accepted for ZSSC3123AI6C?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for ZSSC3123AI6C transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for ZSSC3123AI6C?
ZSSC3123AI6C orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your ZSSC3123AI6C order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for ZSSC3123AI6C?
For technical support, including ZSSC3123AI6C datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your ZSSC3123AI6C requirements.
6.How does Aetrix verify that ZSSC3123AI6C is sourced from the original manufacturer or authorized distributors?
All ZSSC3123AI6C products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that ZSSC3123AI6C meets industry standards.
7.What is the process for return or replacement of ZSSC3123AI6C?
All ZSSC3123AI6C units undergo pre-shipment inspection (PSI). If there is an issue with ZSSC3123AI6C, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The ZSSC3123AI6C part is unused and in its original packaging.
Return procedure for ZSSC3123AI6C:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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