Renesas ZSSC3138BA1B
- Part No.:
- ZSSC3138BA1B
- Manufacturer:
- Renesas
- Category:
- Sensor and Detector Interfaces
- Package:
- -
- Datasheet:
-
ZSSC3138BA1B.pdf
- Description:
- WAFER (UNSAWN) - BOX
- Quantity:
- Payment:

- Shipping:

Inventory:1,506
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
ZSSC3138BA1B from Integrated Device Technology (IDT) is a CMOS sensor signal conditioner IC designed for ceramic thick-film and strain gauge bridge sensors in automotive/industrial applications. It provides 16-bit RISC-based digital compensation of offset, sensitivity, temperature drift, and non-linearity; supports analog gain up to 420; delivers 0.5% FSO accuracy over −40°C to +125°C; and features ratiometric analog voltage output or ZACwire™ digital interface.
For engineers reviewing the ZSSC3138BA1B datasheet, ZSSC3138BA1B pinout, ZSSC3138BA1B application, or ZSSC3138BA1B equivalent, key selection criteria include its dual offset compensation (analog XZC + digital), 7.8 kHz max sample rate in 2-step ADC mode, 12.4-bit analog output resolution, AEC-Q100 qualification, and JEDEC-SSOP14 packaging with high-voltage (33 V) and reverse-polarity protection.
Technical Context
The ZSSC3138BA1B implements a fully differential analog front-end with programmable gain amplifier (PGA), multiplexer-controlled dual-input sequencing (bridge sensor + on-chip diode temperature sensor), and full-differential switched-capacitor ADC. Its calibration microcontroller executes ROM-stored correction algorithms using EEPROM-stored coefficients from one-pass end-of-line calibration.
It supports two ADC operating modes: 1-step (up to 16-bit resolution, 200 Hz bandwidth) and 2-step (13-bit resolution, 7.8 kHz bandwidth). Output is configurable as ratiometric analog voltage (5–95% VDDE, 12-bit DAC) or ZACwire™ One-Wire digital interface, both accessible via I²C™ during configuration.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Supply Voltage | 4.5–5.5 V - Enables direct connection to standard 5 V automotive/industrial rails without external regulation. |
| Analog Gain Range | 2.8–420 - Configurable PGA gain supports wide span of ceramic sensor outputs without external amplification. |
| ADC Resolution | 13–16 bit - Higher resolution enables sub-0.1% FSO error budget allocation for system-level accuracy. |
| Output Accuracy | 0.5% FSO @ −40°C to +125°C - Guaranteed total error includes INL, gain, offset, and temperature effects - no laser trimming required. |
| Operating Temp | −40°C to +125°C - Matches extended industrial and automotive under-hood environments per AEC-Q100 Grade 1. |
| Interface Options | I²C™ and ZACwire™ - Dual serial interfaces support PC-based calibration (I²C) and low-pin-count field readout (ZACwire). |
| Protection Features | 33 V absolute max rating, reverse polarity, short-circuit, and sensor open/short detection - eliminates need for external protection circuitry. |
Pinout & Package
Package: RoHS-compliant JEDEC-SSOP14 (5.3 mm × 6.2 mm, 0.635 mm pitch), qualified for −40°C to +125°C operation.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1 (VDDA) | Analog supply input | Separate analog rail (4.5–5.5 V) decoupled with 100 nF capacitor - isolates noise-sensitive AFE from digital domains. |
| 2 (VSSA) | Analog ground reference | Dedicated analog return path - must be star-connected to minimize common-mode errors in bridge measurement. |
| 3 (SDA) | I²C™ data line | Open-drain bidirectional interface with internal 25–100 kΩ pull-up - supports up to 400 kHz clock for calibration and configuration. |
| 4 (SCL) | I²C™ clock line | Input-only clock line - synchronizes EEPROM programming and register reads/writes during setup phase. |
| 5 (n.c.) | No connect | Internally unused pin - must remain unconnected per datasheet; no routing or soldering required. |
| 6 (VDD) | Digital core supply | Shared with VDDA in most designs - allows single 5 V supply if noise coupling is controlled via layout. |
| 7 (VDDE) | Output driver supply | Provides power for analog output buffer - sets full-scale range (5–95% VDDE) and current drive capability (±5 mA). |
| 8 (VSSE) | Output ground reference | Separate output return - enables ratiometric output stability independent of analog ground disturbances. |
| 9 (VBR_T) | Bridge top terminal input | Differential positive input for resistive bridge - accepts common-mode voltages from 0.29×VDDA to 0.65×VDDA. |
| 10 (VBP) | Bridge positive bias | Supplies excitation voltage to bridge top - internally regulated; used with VBN for constant-current or constant-voltage biasing. |
| 11 (VBR_B) | Bridge bottom terminal input | Differential negative input - paired with VBR_T for true differential acquisition rejecting common-mode noise. |
| 12 (VBN) | Bridge negative bias | Completes bridge bias path - enables symmetric excitation critical for minimizing thermal EMF and offset drift. |
| 13 (AOUT) | Analog output | Ratiometric voltage output (5–95% VDDE) with 12-bit DAC resolution - loadable up to 2 kΩ with ≤10 mVpp noise. |
| 14 (GND) | Power ground | Primary substrate reference - tied to VSSE and VSSA at single point to prevent ground loops in mixed-signal layout. |
Key Features
| Feature | Design Value |
|---|---|
| Dual offset compensation (XZC + digital) | Supports ceramic sensors with offsets up to 300% of signal span - eliminates need for external nulling circuitry or laser trimming. |
| One-pass end-of-line calibration | Stores all sensor-specific coefficients in on-chip EEPROM via I²C™ or ZACwire™ - reduces production test time and fixture complexity. |
| Integrated temperature sensing | On-chip pn-junction diode with 700–2700 ppm/°C sensitivity - enables real-time thermal compensation without external thermistors. |
| Fail-safe sensor diagnostics | Detects open-circuit (>100 kΩ), short-circuit (<50 Ω), and asymmetry faults - provides diagnostic output mode for system-level fault reporting. |
| AEC-Q100 Grade 1 qualification | Validated for automotive applications up to +125°C ambient - includes HTOL, TC, ESD, and EMC testing per AEC standards. |
| ZACwire™ One-Wire interface | Single-pin digital readout supporting device ID, calibration data, and conditioned output - ideal for space-constrained modules with minimal interconnect. |
Applications
| Automotive Pressure Sensing | Industrial Load Cell Interface |
|---|---|
|
Use Scenario: Monitoring manifold absolute pressure (MAP) in engine control units using ceramic thick-film piezoresistive sensors. IC Role / Device Role / Timing Role: Signal conditioner performing real-time offset/temperature compensation and ratiometric analog output generation synchronized to ECU sampling clocks. Use Value: Achieves 0.5% FSO accuracy across −40°C to +125°C without external trimming - improves air-fuel ratio control robustness and emissions compliance. |
Use Scenario: Converting mV/V output from stainless-steel strain gauge load cells in factory floor weighing systems. IC Role / Device Role / Timing Role: Bridge signal amplifier, 16-bit digitizer, and digital compensator delivering calibrated 12-bit analog output at 7.8 kHz sample rate. Use Value: Enables high-speed dynamic weighing with <10 µVpp noise floor - supports ISO 9001-certified process control without recalibration between shifts. |
| Ceramic Level Transmitter | Off-Highway Hydraulic Sensor Module |
|
Use Scenario: Measuring liquid level in fuel tanks using ceramic capacitive or piezoresistive elements exposed to wide thermal cycling. IC Role / Device Role / Timing Role: Front-end conditioner executing polynomial temperature compensation and storing calibration in EEPROM for field-replaceable modules. Use Value: Maintains long-term zero stability (<0.1% FSO/year) due to on-chip XZC and digital correction - eliminates tank re-zeroing maintenance. |
Use Scenario: Conditioned output for hydraulic pressure feedback in agricultural tractors operating in −40°C winter to +85°C cab environments. IC Role / Device Role / Timing Role: AEC-Q100-qualified signal processor providing fail-safe diagnostics (open/short detection) and ZACwire™ digital readout for CAN bus gateway integration. Use Value: Reduces BOM count by 4 components (no external op-amps, references, or protection diodes) while meeting ISO 11452-2 EMC requirements. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar sensor signal conditioning applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MAX1452ACM+ (Analog Devices) | 16-bit DAC, 24-bit ADC, but no integrated temperature sensor or ZACwire™; requires external EEPROM and separate biasing circuitry. | Targeted at high-precision lab instrumentation rather than automotive-grade embedded modules. | Choose when ultra-high-resolution (24-bit) digitization is prioritized over integration, cost, and AEC-Q100 compliance. |
| ASDXRRX015PD2A (TE Connectivity) | Integrated MEMS pressure sensor + ASIC in single package; fixed 15 psi range; no programmable gain or user EEPROM. | Pre-calibrated, drop-in pressure transducer - not a standalone signal conditioner IC. | Choose only for fixed-range, volume OEM pressure sensing where customization and calibration flexibility are unnecessary. |
Compared with MAX1452ACM+, ZSSC3138BA1B reduces system-level component count by integrating temperature sensing, EEPROM, biasing, and diagnostics - while offering AEC-Q100 qualification and ZACwire™ for compact module designs. Compared with ASDXRRX015PD2A, it provides full programmability and multi-sensor compatibility at the cost of requiring external bridge elements.
Availability
ZSSC3138BA1B is available at Aetrix Electronics and suitable for automotive pressure monitoring, industrial load cell interfacing, ceramic level transmitter design, and off-highway hydraulic sensor modules requiring stable component supply across extended temperature ranges and long production lifecycles.
Supply support for ZSSC3138BA1B includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Integrated Device Technology (IDT), now part of Renesas Electronics, is a fabless semiconductor company specializing in timing, memory interface, RF, and sensor signal processing ICs for communications, computing, and industrial markets.
The ZSSC313x product line was engineered specifically for high-accuracy, AEC-Q100-qualified conditioning of resistive bridge sensors in harsh automotive and industrial environments - emphasizing integration, calibration efficiency, and long-term stability without trimming.
FAQ
What is the maximum operating temperature range supported by the ZSSC3138BA1B?
The ZSSC3138BA1B is specified for operation from −40°C to +125°C ambient temperature, matching AEC-Q100 Grade 1 requirements. This version (BA1B) uses the SSOP14 package and is distinct from the BE1/BE2 variants rated to +150°C. The device maintains 0.5% FSO accuracy across this full range, validated through HTOL and temperature cycling tests.
Does the ZSSC3138BA1B require external components for basic operation?
Yes, but minimally: two 100 nF decoupling capacitors (C1, C2) on VDDA and VDD, one 47 nF capacitor (C3) on AOUT, and optional RC filters on bridge inputs. No external op-amps, voltage references, trimming resistors, or EEPROM are needed - all signal conditioning, calibration storage, and temperature compensation are integrated into the ZSSC3138BA1B die.
How is calibration performed for the ZSSC3138BA1B?
Calibration is executed as a one-pass, end-of-line procedure using either I²C™ or ZACwire™ interface. The host controller applies known pressure/force stimuli while the ZSSC3138BA1B captures raw bridge and temperature data. Its internal RISC microcontroller computes correction coefficients and writes them directly to on-chip EEPROM - no external computation or algorithm licensing is required.
Can the ZSSC3138BA1B interface with a CAN bus system?
The ZSSC3138BA1B does not include native CAN physical layer or protocol handling. However, its ZACwire™ or I²C™ digital outputs can be read by a microcontroller with CAN peripheral (e.g., NXP S32K or Renesas RH850), which then formats and transmits conditioned sensor data over CAN. This two-chip architecture maintains signal integrity while enabling flexible network integration.
What protection features does the ZSSC3138BA1B include against electrical overstress?
The ZSSC3138BA1B integrates 33 V absolute maximum rating on all pins, reverse-polarity protection on VDDE/VSSE, short-circuit current limiting (±25 mA) on AOUT, and active sensor open/short detection (100 kΩ open threshold, <50 Ω short threshold). These features eliminate the need for external TVS diodes, series resistors, or fuse networks in typical 12/24 V automotive and industrial installations.
ZSSC3138BA1B Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Renesas
- Package/Case:
- -
- Series:
- *
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Type:
- -
- Input Type:
- -
- Output Type:
- -
- Current - Supply:
- -
- Operating Temperature:
- -
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- -
- Supplier Device Package:
- -
ZSSC3138BA1B FAQ
1.How can I place an order for ZSSC3138BA1B through Aetrix?
Please submit a Request for Quotation (RFQ) for ZSSC3138BA1B on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for ZSSC3138BA1B reliable?
The price and inventory of ZSSC3138BA1B are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for ZSSC3138BA1B is usually 5 days.
3.What payment methods are accepted for ZSSC3138BA1B?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for ZSSC3138BA1B transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for ZSSC3138BA1B?
ZSSC3138BA1B orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your ZSSC3138BA1B order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for ZSSC3138BA1B?
For technical support, including ZSSC3138BA1B datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your ZSSC3138BA1B requirements.
6.How does Aetrix verify that ZSSC3138BA1B is sourced from the original manufacturer or authorized distributors?
All ZSSC3138BA1B products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that ZSSC3138BA1B meets industry standards.
7.What is the process for return or replacement of ZSSC3138BA1B?
All ZSSC3138BA1B units undergo pre-shipment inspection (PSI). If there is an issue with ZSSC3138BA1B, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The ZSSC3138BA1B part is unused and in its original packaging.
Return procedure for ZSSC3138BA1B:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
ZSSC3138BA1B Tags

-
RE46C100S8TF
Microchip Technology

-
XTR111AIDRCR
Texas Instruments

-
XTR111AIDGQR
Texas Instruments
-
XTR117AIDGKR
Texas Instruments

-
XTR111AIDGQT
Texas Instruments

-
XTR115UA/2K5
Texas Instruments

-
MAX14626ETT+T
Analog Devices Inc./Maxim Integrated

-
XTR116UA/2K5
Texas Instruments

-
XTR115U/2K5
Texas Instruments

-
XTR116U/2K5
Texas Instruments
-
PGA308AIDGSR
Texas Instruments

-
XTR300AIRGWR
Texas Instruments
Tech Hub
TTL and CMOS logic families differ in thresholds, loading, output drive, power and timing. This engineering guide compares 74HC and 74HCT, calculates noise margins and checks 3.3 V/5 V compatibility.
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…

