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Renesas ZSSC3138BA1D
- Part No.:
- ZSSC3138BA1D
- Manufacturer:
- Renesas
- Category:
- Sensor and Detector Interfaces
- Package:
- -
- Datasheet:
-
ZSSC3138BA1D.pdf
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- DICE (WAFER SAWN) - WAFFLE PACK
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Product details
Overview
ZSSC3138BA1D from Integrated Device Technology (IDT) is a CMOS sensor signal conditioner IC designed for ceramic thick-film and strain gauge bridge sensors in automotive and industrial applications. It provides 16-bit RISC-based digital compensation of offset, sensitivity, temperature drift, and non-linearity; supports up to 420× analog gain and 12.4-bit ratiometric analog voltage output; and operates across –40°C to +125°C with AEC-Q100 qualification.
For engineers reviewing the ZSSC3138BA1D datasheet, ZSSC3138BA1D pinout, ZSSC3138BA1D application, or ZSSC3138BA1D equivalent, key selection considerations include its dual-output capability (ratiometric analog voltage or ZACwire™ One-Wire), internal temperature sensing, EEPROM-stored calibration coefficients, and high-voltage protection up to 33 V.
Technical Context
The ZSSC3138BA1D integrates a three-stage programmable gain amplifier (PGA), full-differential switched-capacitor ADC (13–16 bit), on-chip temperature diode, and 16-bit RISC calibration microcontroller. Its signal path processes differential bridge inputs with configurable gain (2.8–420×), extended analog zero compensation (XZC), and two-step ADC mode enabling 7.8 kHz sample rate.
Digital conditioning applies sensor-specific correction algorithms stored in ROM, using coefficients written to on-chip EEPROM via I²C™ or ZACwire™. Output options include ratiometric analog voltage (5–95% VDDE, 12-bit DAC resolution) or digital readout, with built-in sensor connection loss detection (≥100 kΩ) and short-circuit monitoring (≤50 Ω).
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Supply Voltage | 4.5–5.5 V - Enables direct compatibility with standard 5 V automotive/industrial rails without external regulation. |
| Analog Gain Range | 2.8× to 420× - Supports wide span matching for ceramic thick-film sensors with low mV/V outputs (1–275 mV/V). |
| ADC Resolution | 13–16 bit - Configurable resolution enables trade-off between noise immunity (13-bit, 200 Hz BW) and speed (16-bit, 7.8 kHz BW). |
| Output Type | Ratiometric analog voltage (5–95% VDDE) or ZACwire™ One-Wire - Provides flexible interface options without requiring external ADC or microcontroller GPIO overhead. |
| Temperature Range | –40°C to +125°C - Qualified per AEC-Q100 Grade 1, supporting under-hood and industrial control environments. |
| Calibration Storage | On-chip EEPROM - Stores one-pass calibration coefficients, eliminating need for external NVM or factory programming infrastructure. |
| Protection Features | 33 V absolute max rating, reverse polarity & short-circuit protection - Reduces need for external TVS, fuses, or discrete protection circuitry. |
Pinout & Package
Package: RoHS-compliant JEDEC SSOP-14 (5.3 mm × 6.2 mm, 0.635 mm pitch). Pinout validated per ZSSC3138 Datasheet Figure 4.1 and Table 4.1.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDDA | Analog supply input | Provides dedicated 4.5–5.5 V rail for analog front-end; decoupling required per datasheet (C1 = 100 nF). |
| VSSA | Analog ground reference | Separate analog ground plane required to maintain 16-bit ADC integrity and minimize coupling noise. |
| SDA | I²C™ data line | Open-drain bidirectional interface for configuration and calibration; internal 25–100 kΩ pull-up enabled. |
| SCL | I²C™ clock line | Supports up to 400 kHz clock; timing compliant with standard I²C™ fast-mode specifications. |
| n.c. | No-connect | Unbonded pin; must remain unconnected per datasheet to avoid parasitic coupling or latch-up risk. |
| VDD | Digital core supply | Internally regulated from VDDE; not externally accessible on SSOP-14 package (tied internally). |
| VDDE | Primary power supply | Main 4.5–5.5 V input powering digital logic, EEPROM, and output buffer; rated for 33 V abs max. |
| N.C. | No-connect | Unused pin; electrically isolated and must be left floating per layout guidelines. |
| VBR_T | Bridge top input | Differential positive input for resistive bridge; accepts common-mode range of 29–65% VDDA depending on PGA gain. |
| VBP | Bridge positive bias | Supplies excitation voltage to bridge top node; configured via internal biasing circuitry. |
| VBR_B | Bridge bottom input | Differential negative input for resistive bridge; matched impedance and layout critical for common-mode rejection. |
| VBN | Bridge negative bias | Supplies excitation return path; referenced to VSSE and synchronized with VBP for ratiometric accuracy. |
| AOUT | Analog output | Ratiometric voltage output (5–95% VDDE); 12-bit DAC resolution, 2.5 mA drive capability into ≥2 kΩ load. |
| VSSE | Signal ground | Reference for AOUT and sensor bias; separate from VSSA to isolate analog output return path. |
Key Features
| Feature | Design Value |
|---|---|
| Programmable Gain Amplifier (PGA) | 12 gain steps (2.8×–420×) with auto-configurable common-mode range - Enables precise span matching for diverse ceramic sensor outputs without external op-amps. |
| Extended Analog Zero Compensation (XZC) | Up to ±388% of signal span compensation at highest gain - Eliminates need for laser trimming or external offset nulling circuits in high-offset ceramic sensors. |
| Dual-Mode ADC Architecture | 1-step (200 Hz BW) or 2-step (7.8 kHz BW) conversion - Allows real-time dynamic response tuning for pressure transients or slow-temperature drift compensation. |
| Integrated Temperature Sensing | On-chip pn-junction diode with 700–2700 ppm/°C sensitivity - Provides direct die-temperature measurement for accurate thermal drift modeling without external sensor. |
| Failsafe Sensor Diagnostics | Real-time open-circuit detection (≥100 kΩ) and short-circuit verification (≤50 Ω) - Enables ISO 26262 ASIL-B compatible functional safety monitoring without host MCU intervention. |
| ZACwire™ One-Wire Interface | Single-pin digital communication with 96–455 ms start window - Reduces wiring complexity in space-constrained modules versus I²C™ or SPI solutions. |
Applications
| Automotive Pressure Sensing | Industrial Load Cell Conditioning |
|---|---|
|
Use Scenario: Monitoring intake manifold or brake fluid pressure in engine control units under harsh thermal cycling (–40°C to +125°C). IC Role / Device Role / Timing Role: Primary signal conditioner performing real-time offset/temperature compensation and ratiometric analog output generation. Use Value: Achieves 0.5% FSO accuracy over full temperature range without external trimming, reducing calibration labor and long-term drift in safety-critical systems. |
Use Scenario: Converting mV/V output from metal foil strain gauges in industrial weighing platforms with EMI exposure. IC Role / Device Role / Timing Role: High-immunity analog front-end with 2-step ADC mode (7.8 kHz) for rapid weight update rates and digital diagnostics. Use Value: Enables >100 kΩ open-load detection and <50 Ω short detection, allowing automatic fault reporting before mechanical failure occurs. |
| Ceramic-Based Tire Pressure Sensors | Harsh-Environment Level Transmitters |
|
Use Scenario: Embedding in TPMS modules where size, self-calibration, and long-term stability are critical. IC Role / Device Role / Timing Role: Single-chip solution integrating PGA, ADC, correction algorithm, EEPROM, and ZACwire™ output for minimal BOM count. Use Value: One-pass end-of-line calibration stores coefficients permanently, eliminating field recalibration and supporting 15-year data retention at 125°C. |
Use Scenario: Signal conditioning for submersible pressure sensors in oil/gas wellheads exposed to vibration and thermal shock. IC Role / Device Role / Timing Role: High-voltage protected (33 V abs max) signal conditioner with reverse polarity and short-circuit protection. Use Value: Withstands transient surges and wiring faults common in remote installations, reducing field returns and maintenance downtime. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar sensor signal conditioning applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MAX1452ACM+T | 16-bit DAC, 20-bit ADC, but no integrated microcontroller or EEPROM; requires external processor for compensation math. | Lacks on-chip correction algorithm and one-pass calibration - demands host MCU firmware development and external NVM. | Choose when custom compensation algorithms or multi-sensor fusion are required beyond fixed ZSSC3138BA1D ROM routines. |
| AD8422ARZ | Instrumentation amplifier only (no ADC, no digital processing, no EEPROM); 0.0005% nonlinearity, 120 dB CMRR. | Requires external ADC, microcontroller, and calibration infrastructure - increases BOM, layout area, and validation effort. | Choose when ultra-low-noise analog amplification is primary requirement and digital signal conditioning is handled elsewhere. |
Compared with MAX1452ACM+T and AD8422ARZ, the ZSSC3138BA1D delivers fully integrated signal conditioning-including PGA, ADC, correction engine, EEPROM, and dual-output interface-in a single SSOP-14 package, reducing total system cost, board space, and time-to-market for ceramic and strain gauge applications.
Availability
ZSSC3138BA1D is available at Aetrix Electronics and suitable for automotive pressure sensing, industrial load cell interfaces, ceramic-based TPMS modules, and harsh-environment level transmitters requiring stable component supply across extended temperature ranges and long product lifecycles.
Supply support for ZSSC3138BA1D includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Integrated Device Technology (IDT), now part of Renesas Electronics, is a semiconductor company specializing in timing, memory interface, RF, and sensor signal conditioning ICs for automotive, industrial, and communications markets.
The ZSSC313x product line was designed specifically for high-accuracy resistive bridge sensor applications-enabling laser-trimming-free calibration, AEC-Q100 compliance, and robust operation in demanding environments.
FAQ
What is the maximum operating temperature range supported by the ZSSC3138BA1D?
The ZSSC3138BA1D is specified for operation from –40°C to +125°C (Advanced-Performance Temperature Range, TQA), with AEC-Q100 Grade 1 qualification. This range is confirmed in the datasheet Section 1.2 and Ordering Information table, where "BA" suffix denotes the –40°C to +125°C version. The device maintains 0.5% FSO overall accuracy across this full range.
Does the ZSSC3138BA1D support both I²C™ and ZACwire™ interfaces simultaneously?
No - the ZSSC3138BA1D supports either I²C™ or ZACwire™ for configuration and readout, but not concurrently. The interface is selected during EEPROM programming; SDA/SCL pins function as I²C™ only when ZACwire™ is disabled, and vice versa. Both interfaces share the same physical pins (SDA/SCL for I²C™, AOUT for ZACwire™), requiring exclusive use per application setup.
How does the extended analog zero compensation (XZC) feature improve ceramic sensor performance in the ZSSC3138BA1D?
The XZC feature in the ZSSC3138BA1D compensates large sensor offsets-up to ±388% of signal span at PGA gain = 420-by injecting an analog correction voltage into the second amplification stage. This prevents saturation of the analog signal path and eliminates the need for external laser trimming, directly improving long-term stability and reducing manufacturing cost for ceramic thick-film sensors with inherent high offset.
Can the ZSSC3138BA1D operate with a 3.3 V supply voltage?
No - the ZSSC3138BA1D requires a minimum supply voltage of 4.5 V and maximum of 5.5 V per Section 1.2 of the datasheet. Operation below 4.5 V violates the specified operating conditions and may result in undefined behavior, including incorrect ADC conversion, failed EEPROM writes, or unstable analog output. A dedicated 5 V regulator is required.
What is the purpose of the VBP and VBN pins on the ZSSC3138BA1D?
VBP and VBN provide programmable excitation bias to the resistive bridge sensor: VBP supplies positive bias to the bridge top node, while VBN supplies the return path referenced to VSSE. Their synchronized operation ensures ratiometric accuracy by maintaining proportional relationship between bridge excitation and AOUT scaling, which is essential for rejecting supply voltage variations in precision pressure and force measurements.
ZSSC3138BA1D Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Renesas
- Package/Case:
- -
- Series:
- *
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Type:
- -
- Input Type:
- -
- Output Type:
- -
- Current - Supply:
- -
- Operating Temperature:
- -
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- -
- Supplier Device Package:
- -
ZSSC3138BA1D FAQ
1.How can I place an order for ZSSC3138BA1D through Aetrix?
Please submit a Request for Quotation (RFQ) for ZSSC3138BA1D on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for ZSSC3138BA1D reliable?
The price and inventory of ZSSC3138BA1D are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for ZSSC3138BA1D is usually 5 days.
3.What payment methods are accepted for ZSSC3138BA1D?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for ZSSC3138BA1D transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for ZSSC3138BA1D?
ZSSC3138BA1D orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your ZSSC3138BA1D order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for ZSSC3138BA1D?
For technical support, including ZSSC3138BA1D datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your ZSSC3138BA1D requirements.
6.How does Aetrix verify that ZSSC3138BA1D is sourced from the original manufacturer or authorized distributors?
All ZSSC3138BA1D products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that ZSSC3138BA1D meets industry standards.
7.What is the process for return or replacement of ZSSC3138BA1D?
All ZSSC3138BA1D units undergo pre-shipment inspection (PSI). If there is an issue with ZSSC3138BA1D, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The ZSSC3138BA1D part is unused and in its original packaging.
Return procedure for ZSSC3138BA1D:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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