Renesas ZSSC3170EA2R

Overview

ZSSC3170EA2R from Integrated Device Technology (IDT) is an AEC-Q100-qualified automotive sensor signal conditioner IC designed to condition resistive bridge sensor outputs with digital LIN or PWM interface output. It delivers ±0.50% FSO accuracy over −40°C to +125°C, supports up to 420× analog gain, and performs 16-bit digital compensation of offset, sensitivity, temperature drift (up to 2nd order), and nonlinearity (up to 3rd order) for pressure, force, and level sensing in engine manifolds and brake systems.

For engineers reviewing the ZSSC3170EA2R datasheet, ZSSC3170EA2R pinout, ZSSC3170EA2R application, or ZSSC3170EA2R equivalent, key selection considerations include its dual-output capability (LIN 2.1/PWM), integrated diagnostics (sensor short/connection check), load-dump protected LIN pin (±40 V), SSOP20 RoHS-compliant package, and support for end-of-line calibration using the sensor's own output signal.

Technical Context

The ZSSC3170EA2R integrates a programmable gain amplifier (PGA) with 12 selectable gain stages (2× to 420×), a 14-bit ADC, and a 16-bit RISC microcontroller executing ROM-resident conditioning algorithms. Its analog front-end handles differential bridge inputs (VBP/VBN) with common-mode range from 29–65% of VDDA and supports XZC-based analog offset compensation.

Digital signal conditioning applies stored EEPROM coefficients to correct bridge output for temperature-induced errors using internal or external diode/RTD sensors. Output is delivered via configurable LIN publisher frames (compliant with LIN 1.3/2.0/2.1) or PWM high-side/low-side switch signals (HOUT/LOUT), both supporting real-time end-of-line calibration without analog trimming components.

Key Specifications

Pinout & Package

Package: SSOP20 (RoHS-compliant, 0.65 mm pitch, 7.2 mm × 5.3 mm footprint).

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar sensor signal conditioning applications.

Compared with MAX1452AUA+ and AD8422ARZ, the ZSSC3170EA2R uniquely integrates complete signal chain - from PGA and 14-bit ADC through 16-bit digital correction to LIN/PWM output - enabling single-chip, AEC-Q100-compliant solutions for automotive pressure sensing without external processing or interface components.

Availability

ZSSC3170EA2R is available at Aetrix Electronics and suitable for engine manifold pressure sensing, brake fluid pressure monitoring, transmission oil pressure sensing, and EV battery coolant pressure monitoring requiring stable component supply across automotive production lifecycles.

Supply support for ZSSC3170EA2R includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Integrated Device Technology (IDT), now part of Renesas Electronics, is a fabless semiconductor company specializing in timing, memory interface, RF, and sensor signal conditioning ICs for automotive, industrial, and communications markets.

The ZSSC3170 product line was designed specifically for high-accuracy, AEC-Q100-qualified bridge sensor conditioning in harsh automotive environments - emphasizing integrated diagnostics, LIN/PWM output flexibility, and end-of-line calibration capability.

FAQ

What is the operating temperature range supported by the ZSSC3170EA2R?

The ZSSC3170EA2R operates from −40°C to +125°C with guaranteed performance, and supports extended operation up to +150°C for 1000 hours. This range is validated per AEC-Q100 Grade 0 requirements and enables use in under-hood applications such as engine manifold and transmission pressure sensing where ambient thermal stress is extreme. The ZSSC3170EA2R maintains ±0.50% FSO accuracy across the full −40°C to +125°C range.

Does the ZSSC3170EA2R support both LIN and PWM output simultaneously?

No, the ZSSC3170EA2R supports either LIN or PWM output mode - selected at configuration time via EEPROM programming - but not both simultaneously. In LIN mode, corrected sensor data is transmitted in standardized LIN frames compliant with versions 1.3, 2.0, and 2.1. In PWM mode, the ZSSC3170EA2R drives HOUT (high-side) or LOUT (low-side) with a configurable 11-bit resolution duty cycle. The ZSSC3170EA2R does not multiplex or time-share these interfaces.

How is end-of-line calibration performed on the ZSSC3170EA2R?

End-of-line calibration for the ZSSC3170EA2R uses the device's own LIN or PWM output as the reference signal - eliminating need for external DAQ equipment. During calibration, known pressure points are applied, and the ZSSC3170EA2R's output is measured while its internal microcontroller calculates and stores correction coefficients in EEPROM. This process is supported by IDT's ZSSC3170 SSC Evaluation Kit and proprietary software tools, and is enabled by the ZSSC3170EA2R's integrated LIN transceiver and PWM drivers.

What diagnostic functions are built into the ZSSC3170EA2R?

The ZSSC3170EA2R includes sensor connection loss detection (RSCCTH = 20–100 kΩ), sensor short detection (RSSCTH = 50–1000 Ω), and sensor aging monitoring. It also features LIN bus diagnostics (dominant/recessive state monitoring), watchdog timer supervision, and internal voltage/temperature monitoring. These diagnostics are accessible via I²C or reported in LIN status frames, enabling ASIL-B–compatible fault reporting without additional external circuitry. All diagnostics are implemented in hardware/firmware within the ZSSC3170EA2R.

Is the ZSSC3170EA2R pin-compatible with other revisions like ZSSC3170EE2 or ZSSC3170FE2?

Yes, the ZSSC3170EA2R is pin-compatible with ZSSC3170EE2 and ZSSC3170FE2 - all share identical SSOP20 pinout, electrical interface definitions, and register mapping. Differences lie in silicon revision (E vs. F), temperature grade (125°C vs. 150°C), and EEPROM endurance (100 vs. 1000 write cycles at 150°C). System-level design using ZSSC3170EA2R can be upgraded to EE2 or FE2 without PCB changes, provided thermal and reliability requirements align with the target revision's qualification scope.