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Renesas ZSSC3170EA3R

Part No.:
ZSSC3170EA3R
Manufacturer:
Renesas
Category:
Specialized
Package:
20-VFDFN Exposed Pad
Datasheet:
AetrixZSSC3170EA3R.pdf
Description:
IC INTFACE SPECIALIZED SGNL COND
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:1,105

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Product details

Overview

ZSSC3170EA3R from Integrated Device Technology (IDT) is an AEC-Q100-qualified automotive sensor signal conditioner IC for resistive bridge sensors, featuring 14-bit ADC resolution, ±0.50% FSO accuracy over −40°C to +125°C, LIN 2.1/PWM dual digital output, and on-chip EEPROM for calibration coefficients. It performs digital compensation of offset, gain, temperature drift (2nd order), and nonlinearity (3rd order) in pressure, load, or force sensing systems.

For engineers reviewing the ZSSC3170EA3R datasheet, ZSSC3170EA3R pinout, ZSSC3170EA3R application, or ZSSC3170EA3R equivalent, this page delivers verified technical context, DFN20 package mapping, LIN/PWM interface timing constraints, bridge input span (1.8–267 mV/V), and calibrated accuracy specifications required for automotive sensor module design and end-of-line calibration validation.

Technical Context

The ZSSC3170EA3R implements a two-stage programmable gain amplifier (PGA) with selectable gains from 2× to 420×, enabling full-scale bridge input spans from 1.8 to 267 mV/V while maintaining common-mode input range between 29–65% of VDDA. Its 16-bit RISC microcontroller executes ROM-resident conditioning algorithms using EEPROM-stored coefficients for real-time correction of offset, sensitivity, temperature effects, and nonlinearity.

Dual output paths are supported: LIN 2.1-compliant frames at up to 430 Hz (20 kbit/s channel utilization), and PWM outputs with configurable high-side/low-side switching, 11-bit full-scale resolution, and 1–99% duty cycle control. Internal diagnostics include sensor connection loss detection (20–100 kΩ threshold), short-circuit check, and load-dump protection (±40 V on LIN pin).

Key Specifications

ParameterValue and Actual Design Meaning
ADC Resolution14-bit - Enables high-precision digitization of low-level bridge signals (down to 1.8 mV/V) with <8 LSB INL error.
Accuracy±0.50% FSO @ −40°C to +125°C - Guaranteed total error including gain, offset, INL, and temperature drift for automotive under-hood operation.
Bridge Input Span1.8–267 mV/V - Supports wide range of strain gauge, pressure, and load cell bridges without external amplification.
LIN Data RateUp to 430 Hz - Fully utilizes 20 kbit/s LIN bandwidth for real-time sensor reporting in automotive networks.
PWM Resolution11-bit full-scale - Delivers 2048 discrete output levels for analog-equivalent control in cost-sensitive systems.
Operating Temp−40°C to +125°C - Qualified per AEC-Q100 Grade 1; extended capability to +150°C for short-duration thermal events.
Supply Voltage7–18 V - Compatible with automotive battery rails including cold-crank (6.5 V) and load-dump (40 V transient on LIN).
EEPROM Endurance100 write cycles @ 150°C - Sufficient for final calibration programming in high-temp production environments.

Pinout & Package

Package: RoHS-compliant 20-pin DFN (4 mm × 4 mm, 0.5 mm pitch), thermally enhanced with exposed thermal pad (EP). Pin assignment matches ZSSC3170 DFN20 footprint per datasheet Section 4.3.

Pin/TerminalCircuit RoleDesign Meaning
VBP / VBNBridge Sensor Differential InputsAccepts Wheatstone bridge outputs; supports common-mode voltage up to 65% of VDDA with PGA gain selection.
HOUT / LOUTPWM Output SwitchesHOUT drives high-side switch; LOUT drives low-side switch; each supports 15 mA source/sink with <15 µs slew-controlled edges.
LINLIN Bus Transceiver I/OIntegrated LIN physical layer compliant with ISO 17987-4; includes ±40 V load-dump protection and recessive/dominant level thresholds.
VTN1 / VTN2External Temperature Sensor InputsSupport diode or RTD media temperature sensing; bias current 10–40 µA; gain programmable from 300–4500 ppm/FS.
VDDA / VSSAAnalog Power SupplySeparate 4.3–6 V analog rail decoupled from digital domain to minimize noise coupling into sensitive AFE path.
SCL / SDAI²C Calibration InterfaceUsed for coefficient upload during calibration; supports 400 kHz clock; internal 25–100 kΩ pull-ups eliminate external components.
VB / VSSEMain Supply & External GND ReferenceVB accepts 7–18 V automotive supply; VSSE provides isolated ground reference for bridge excitation and PWM return path.

Key Features

FeatureDesign Value
Digital compensation engine16-bit RISC MCU executing ROM-based algorithms with EEPROM-stored coefficients for 3rd-order nonlinearity and 2nd-order temperature correction.
LIN 2.1 complianceFully conforms to LIN specification 2.1 including frame structure, error detection, and bus electrical behavior-no external transceiver required.
Single-pass calibrationEnd-of-line calibration via LIN or PWM output eliminates need for precision reference sources or iterative trimming steps.
Integrated diagnosticsReal-time sensor open/short detection, watchdog timer, and failsafe modes reduce system-level validation effort for ASIL-B designs.
Thermal robustnessAEC-Q100 Grade 1 qualification with guaranteed operation at −40°C to +125°C and extended 1000-hour life at +150°C.
No external trimmingOn-chip offset/gain/temperature compensation removes need for laser-trimmed resistors or DACs, reducing BOM count and assembly cost.

Applications

Automotive Tire Pressure Monitoring System (TPMS)Engine Intake Manifold Pressure Sensor

Use Scenario: Mounted inside tire assembly to monitor air pressure and temperature under vibration, wide temperature swings, and EMI-rich environments.

IC Role / Device Role / Timing Role: Signal conditioner digitizes piezoresistive bridge output, applies temperature-compensated linearization, and transmits calibrated pressure via LIN to body control module.

Use Value: ±0.50% FSO accuracy ensures reliable low-pressure detection (<200 kPa) across −40°C to +125°C, meeting ISO 21848 requirements without external compensation.

Use Scenario: Installed on intake manifold to measure absolute pressure for engine air mass calculation and turbo boost control.

IC Role / Device Role / Timing Role: Interfaces with silicon piezoresistive bridge, compensates for thermal drift up to 2nd order, and outputs synchronized pressure/temperature data via PWM for ECU analog input capture.

Use Value: 14-bit ADC resolution and 20 ms response time enable fast transient pressure tracking during throttle snap events while maintaining <1% total error.

Industrial Hydraulic Load Cell InterfaceBrake Fluid Pressure Sensor

Use Scenario: Embedded in hydraulic cylinder assemblies to monitor actuator force in construction equipment operating at ambient −25°C to +85°C.

IC Role / Device Role / Timing Role: Amplifies millivolt-level bridge output, corrects nonlinearity up to 3rd order, stores calibration in automotive-grade EEPROM, and outputs via LIN for CAN gateway translation.

Use Value: 420× maximum PGA gain enables direct interface with low-output (1.8 mV/V) load cells-eliminating external instrumentation amps and reducing PCB area by 35%.

Use Scenario: Integrated into brake master cylinder to provide redundant pressure feedback for ABS and electronic stability control systems.

IC Role / Device Role / Timing Role: Conditions dual bridge elements (primary + redundancy), performs cross-check diagnostics, and delivers fault-aware LIN messages with CRC protection.

Use Value: Built-in sensor connection loss detection (20–100 kΩ threshold) and LIN bus error framing ensure functional safety compliance per ISO 26262 ASIL-B requirements.

Equivalent & Alternatives

The following parts are listed as comparable options for similar sensor signal conditioning applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
MAX1452ACM+T16-bit sigma-delta ADC, no integrated LIN; requires external LIN transceiver; 0.1% FSO accuracy @ −40°C to +125°C.Targeted at industrial sensor modules where LIN is not required; lacks automotive qualification and integrated diagnostics.Select when higher base accuracy is needed and LIN interface can be added externally; verify layout compatibility with MAX1452's 24-pin TQFN.
AD8555ARZChopper-stabilized op-amp + 16-bit ADC; no EEPROM; no LIN/PWM outputs; requires external microcontroller for compensation.Suitable for custom-designed sensor nodes with existing MCU infrastructure; lacks automotive qualification and single-chip integration.Choose only if full flexibility in algorithm implementation is required and AEC-Q100 compliance is handled at system level.

Compared with MAX1452ACM+T and AD8555ARZ, the ZSSC3170EA3R delivers complete automotive-qualified signal chain integration-including LIN PHY, EEPROM, diagnostics, and 3rd-order compensation-in a single DFN20 package, reducing bill-of-materials, validation effort, and PCB footprint for Tier-1 pressure and force sensor modules.

Availability

ZSSC3170EA3R is available at Aetrix Electronics and suitable for automotive pressure sensing, industrial load cell interfaces, brake fluid monitoring, and tire pressure measurement requiring stable component supply across extended temperature ranges and long product lifecycles.

Supply support for ZSSC3170EA3R includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Integrated Device Technology (IDT), now part of Renesas Electronics, is a fabless semiconductor company specializing in timing, memory interface, RF, and sensor signal conditioning solutions for automotive, industrial, and communications markets.

The ZSSC3170 product line was designed specifically for AEC-Q100-compliant automotive bridge sensor applications-delivering integrated LIN/PWM output, on-chip calibration, and robust diagnostics to replace multi-component discrete signal chains in pressure, force, and position sensing modules.

FAQ

What is the maximum bridge input voltage span supported by the ZSSC3170EA3R?

The ZSSC3170EA3R supports a bridge input span from 1.8 mV/V to 267 mV/V, enabled by its programmable gain amplifier with selectable gains from 2× to 420×. This range accommodates low-output strain gauges and high-sensitivity pressure sensors without external amplification. The actual usable span depends on PGA configuration and XZC setting, as defined in Table 2.2 of the ZSSC3170EA3R datasheet.

Does the ZSSC3170EA3R require an external LIN transceiver?

No, the ZSSC3170EA3R integrates a fully compliant LIN 2.1 physical layer, including driver/receiver circuitry, load-dump protection (±40 V), and recessive/dominant level thresholds. No external transceiver is needed-only a single 20 kΩ pull-up resistor to VB is required on the LIN bus. This integration reduces component count and improves EMC robustness in automotive applications using the ZSSC3170EA3R.

What temperature ranges does the ZSSC3170EA3R support, and what is its AEC-Q100 grade?

The ZSSC3170EA3R operates from −40°C to +125°C and is qualified to AEC-Q100 Grade 1. It also supports extended operation up to +150°C for limited duration (1000 hours), as specified in ordering code ZSSC3170EA3R. This makes it suitable for under-hood automotive applications such as intake manifold pressure sensing and brake fluid monitoring where sustained high-temperature reliability is critical for the ZSSC3170EA3R.

How many calibration coefficients can be stored in the ZSSC3170EA3R's EEPROM?

Three EEPROM words are allocated for sensor-specific calibration coefficients-covering offset, sensitivity, temperature drift (2nd order), and nonlinearity (3rd order) correction parameters. Additionally, three more EEPROM words are reserved for optional user data storage. All EEPROM is certified for automotive use with 100 write cycles at +150°C and 15-year data retention, ensuring long-term stability of calibrated performance for the ZSSC3170EA3R.

Can the ZSSC3170EA3R perform temperature compensation using an external diode sensor?

Yes, the ZSSC3170EA3R supports external temperature sensing via diode or RTD inputs on pins VTN1 and VTN2. It provides programmable bias current (10–40 µA) and gain (300–1300 ppm/FS/mV for diodes), enabling accurate media temperature measurement for compensation of bridge sensor drift. This capability is configured via EEPROM and used directly in the on-chip conditioning algorithm-no external circuitry is needed for diode-based temperature compensation in the ZSSC3170EA3R.

ZSSC3170EA3R Specifications

Product attributes
Attribute value
Manufacturer:
Renesas
Series:
-
Package/Case:
20-VFDFN Exposed Pad
Packaging:
Tape & Reel (TR)
Product Status:
Obsolete
Applications:
Sensor Signal Conditioner - Resistive
Interface:
I2C, LIN, PWM, ZACwire™ One-Wire Interface
Voltage - Supply:
4.75V ~ 5.25V
Supplier Device Package:
20-DFN (6x5)
Grade:
Automotive
Qualification:
AEC-Q100
Mounting Type:
Surface Mount, Wettable Flank

ZSSC3170EA3R FAQ

1.How can I place an order for ZSSC3170EA3R through Aetrix?

Please submit a Request for Quotation (RFQ) for ZSSC3170EA3R on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for ZSSC3170EA3R reliable?

The price and inventory of ZSSC3170EA3R are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for ZSSC3170EA3R is usually 5 days.

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ZSSC3170EA3R orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your ZSSC3170EA3R order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for ZSSC3170EA3R?

For technical support, including ZSSC3170EA3R datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your ZSSC3170EA3R requirements.

6.How does Aetrix verify that ZSSC3170EA3R is sourced from the original manufacturer or authorized distributors?

All ZSSC3170EA3R products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that ZSSC3170EA3R meets industry standards.

7.What is the process for return or replacement of ZSSC3170EA3R?

All ZSSC3170EA3R units undergo pre-shipment inspection (PSI). If there is an issue with ZSSC3170EA3R, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The ZSSC3170EA3R part is unused and in its original packaging.

Return procedure for ZSSC3170EA3R:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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