Renesas ZSSC3170EE2R

Overview

ZSSC3170EE2R from Integrated Device Technology (IDT) is an AEC-Q100-qualified automotive sensor signal conditioner IC designed to digitize, linearize, and temperature-compensate resistive bridge sensors. It delivers ±0.50% FSO accuracy from −40°C to +125°C, supports up to 430 Hz data conversion, and integrates LIN 2.1 and PWM output interfaces with high-side/low-side switch capability for pressure, force, or level sensing in engine, brake, and HVAC systems.

For engineers reviewing the ZSSC3170EE2R datasheet, ZSSC3170EE2R pinout, ZSSC3170EE2R application, or ZSSC3170EE2R equivalent, this page provides verified technical context, validated pin functions, confirmed automotive-grade compensation capabilities, and real-world interface timing constraints - all specific to the SSOP20-packaged ZSSC3170EE2R revision E device.

Technical Context

The ZSSC3170EE2R implements a dual-stage analog front end with programmable gain amplifier (PGA) supporting 12 gain settings (2× to 420×), enabling precise amplification of bridge signals from 1.8 mV/V to 267 mV/V. Its 14-bit ADC feeds a 16-bit RISC microcontroller that executes digital compensation for offset, sensitivity, 2nd-order temperature drift, and 3rd-order nonlinearity using EEPROM-stored coefficients.

Digital outputs are delivered via either LIN 2.1-compliant frames (up to 20 kbit/s, 430 Hz update rate) or configurable PWM (11-bit full-scale resolution, adjustable 1–99% duty cycle). The device includes integrated LIN bus protection (±40 V load dump), internal/external temperature sensing (diode or RTD), and diagnostic features including sensor connection loss and short detection.

Key Specifications

Pinout & Package

ZSSC3170EE2R is supplied in a RoHS-compliant 20-pin SSOP package (5.3 mm × 7.2 mm, 0.65 mm pitch), optimized for automotive PCB layouts with thermal and EMI robustness.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar sensor signal conditioning applications.

Compared with MAX1452ACM+T and AD8555ARZ, the ZSSC3170EE2R uniquely integrates LIN 2.1 transceiver, PWM drivers, EEPROM-based 3rd-order compensation, and AEC-Q100 qualification in a single SSOP20 package - eliminating external components and software development for automotive pressure sensor modules.

Availability

ZSSC3170EE2R is available at Aetrix Electronics and suitable for engine management, brake control, HVAC actuation, and transmission monitoring requiring stable component supply across automotive production lifecycles.

Supply support for ZSSC3170EE2R includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Integrated Device Technology (IDT), now part of Renesas Electronics, designs high-performance timing, memory interface, RF, and sensor signal conditioning ICs for communications, computing, and automotive markets.

The ZSSC3170 product line was developed specifically for automotive bridge sensor signal conditioning - delivering integrated LIN/PWM outputs, AEC-Q100 reliability, and factory-calibrated digital compensation to accelerate Tier-1 pressure and force sensor module development.

FAQ

What is the maximum operating temperature supported by ZSSC3170EE2R?

ZSSC3170EE2R is rated for continuous operation from −40°C to +125°C, with extended functionality validated up to +150°C for 1000 hours. Its EEPROM retains data for 15 years at 125°C, and the device maintains ±1.00% FSO accuracy across the full −40°C to +150°C range - making it suitable for under-hood and transmission-mounted applications where thermal stress is critical. This rating applies specifically to the ZSSC3170EE2R SSOP20 revision E variant.

Does ZSSC3170EE2R support both high-side and low-side PWM switching?

Yes, ZSSC3170EE2R supports both configurations via EEPROM-programmable mode selection. HOUT serves as a high-side switch capable of sourcing 15 mA at ≥4 V, while LOUT functions as a low-side switch sinking 12 mA at ≤0.5 V. The device includes slew-rate control (2 V/µs rise/fall) and short-circuit protection on both outputs. This dual-switch capability allows direct drive of solenoids or valves without external drivers - a feature confirmed in the ZSSC3170EE2R datasheet section 2.6.1 and Figure 3.1–3.2.

How does ZSSC3170EE2R perform end-of-line calibration without external equipment?

ZSSC3170EE2R enables end-of-line calibration using its own LIN or PWM output as feedback. During calibration, the device streams raw or partially conditioned values via LIN frame or PWM duty cycle, allowing host equipment to compute correction coefficients and write them directly to its automotive-grade EEPROM via I²C or one-wire interface. This eliminates analog test fixtures and reduces calibration time by up to 60% - a capability explicitly documented in the ZSSC3170EE2R datasheet "Brief Description" and section 2.7.

Is ZSSC3170EE2R pin-compatible with earlier ZSSC3170 revisions like ZSSC3170FE2?

No, ZSSC3170EE2R is not pin-compatible with ZSSC3170FE2. While both share the SSOP20 package and identical pinout mapping, revision E and revision F differ in diagnostic feature availability: sensor connection check (SCC) and sensor short check (SSC) are only enabled in silicon revision F and later. Using ZSSC3170EE2R in a design relying on those diagnostics may result in undetected faults. Always verify silicon revision against functional requirements per datasheet Table 1.3 notes.

What external components are required for basic LIN interface operation of ZSSC3170EE2R?

ZSSC3170EE2R requires only a single external 20–47 kΩ pull-up resistor between the LIN pin and VB (battery rail), as specified in datasheet Table 1.3.7.4. No external transceiver, TVS diode, or level shifter is needed - the device integrates LIN physical layer compliance, ±40 V load-dump protection, and recessive/dominant voltage thresholds per LIN 2.1. Additional passive filtering (e.g., 220 pF capacitor to ground) is optional for EMI suppression but not mandatory for functional operation.