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Renesas ZSSC3170FE2R
- Part No.:
- ZSSC3170FE2R
- Manufacturer:
- Renesas
- Category:
- Specialized
- Package:
- 20-SSOP (0.209", 5.30mm Width)
- Datasheet:
-
ZSSC3170FE2R.pdf
- Description:
- IC INTFACE SPECIALIZED SGNL COND
- Quantity:
- Payment:
- Shipping:
Inventory:1,542
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Product details
Overview
ZSSC3170FE2R from Integrated Device Technology (IDT) is an AEC-Q100-qualified automotive sensor signal conditioner IC designed to condition resistive bridge sensor outputs with digital compensation for offset, sensitivity, temperature drift (up to 2nd order), and nonlinearity (up to 3rd order). It delivers ±0.50% FSO accuracy over −40°C to +125°C, supports LIN 1.3/2.0/2.1 and PWM output interfaces, and integrates a 16-bit RISC microcontroller with automotive-grade EEPROM. It is used in automotive pressure, force, and level sensing systems requiring end-of-line calibration and robust EMC performance.
For engineers reviewing the ZSSC3170FE2R datasheet, ZSSC3170FE2R pinout, ZSSC3170FE2R application, or ZSSC3170FE2R equivalent, key selection considerations include its dual LIN/PWM interface flexibility, 14-bit ADC resolution, −40°C to +125°C operating range, integrated diagnostics (sensor connection loss, short check), and SSOP20 RoHS-compliant packaging for automotive PCB layouts.
Technical Context
The ZSSC3170FE2R implements a two-stage analog front-end with programmable gain amplifier (PGA) offering 12 selectable gain settings (2× to 420×), enabling support for input spans from 1.8 to 267 mV/V. Its 14-bit ADC operates with ≤8 LSB INL and 0.95 LSB DNL, feeding a ROM-resident conditioning algorithm executed by an on-chip 16-bit RISC microcontroller.
Digital compensation uses coefficients stored in automotive-qualified EEPROM (100 write cycles at 150°C, 15-year data retention), supporting simultaneous correction of bridge signal and temperature sensor (diode or RTD) outputs. The LIN interface complies with specifications 1.3/2.0/2.1 and includes load-dump protection up to ±40 V on the LIN pin; PWM mode provides configurable high-side or low-side switching with 11-bit full-scale resolution and ≤20 ms response time.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Accuracy | ±0.50% FSO over −40°C to +125°C - guarantees calibrated measurement fidelity across full automotive ambient range |
| ADC Resolution | 14-bit - enables high-resolution digitization of small bridge signals (e.g., <10 mV/V) without external amplification |
| Interface Options | LIN 1.3/2.0/2.1 and PWM - allows direct integration into LIN-based vehicle networks or simple duty-cycle–based control systems |
| Operating Temp Range | −40°C to +125°C (extended to +150°C) - meets under-hood thermal requirements for engine bay and transmission applications |
| Supply Voltage | 7 V to 18 V - compatible with 12 V automotive battery systems including cold-crank and load-dump transients |
| EEPROM Endurance | 100 write cycles at 150°C - sufficient for factory calibration and limited field reprogramming in high-temp environments |
| Diagnostic Coverage | Sensor connection loss, short detection, and aging checks - reduces need for external fault monitoring circuitry |
Pinout & Package
Package: SSOP20 (RoHS-compliant, 0.65 mm pitch, 7.2 mm × 5.3 mm body).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VBP / VBN | Bridge sensor differential inputs | Accepts Wheatstone bridge outputs; supports common-mode range of 29–65% VDDA with XZC disabled |
| HOUT / LOUT | PWM output drivers | HOUT = high-side switch (4 V min @ 15 mA); LOUT = low-side switch (0.5 V max @ 12 mA); configurable for active-high or active-low signaling |
| LIN | LIN bus transceiver I/O | Compliant LIN physical layer with ±40 V load-dump protection; supports dominant/recessive level detection per LIN spec |
| VTN1 / VTN2 | External temperature sensor inputs | Support diode or RTD connections; enable media temperature sensing independent of bridge channel |
| VDDA / VSSA | Analog supply and ground | Separate analog domain (4.3–6 V internal VVDA) isolates sensitive AFE from digital noise |
| SCL / SDA | I²C interface pins | Used for calibration setup, coefficient programming, and debug readout; 400 kHz max clock rate |
Key Features
| Feature | Design Value |
|---|---|
| Dual-output interface | LIN and PWM outputs are independently configurable - eliminates need for external protocol translators in mixed-network vehicles |
| On-chip digital compensation | Corrects offset, gain, 2nd-order temperature drift, and 3rd-order nonlinearity using EEPROM-stored coefficients - removes trimming resistors and manual calibration steps |
| Integrated diagnostics | Detects open-circuit, short-circuit, and aging of bridge sensors via programmable thresholds - reduces BOM count and improves functional safety compliance |
| Automotive-qualified EEPROM | 100 write cycles at 150°C with 15-year data retention - enables reliable one-time factory calibration and optional field updates in harsh thermal environments |
| Media temperature sensing | Supports external diode or RTD on VTN1/VTN2 - allows simultaneous measurement of process temperature (e.g., oil, coolant) alongside pressure/force |
Applications
| Automotive Tire Pressure Monitoring System (TPMS) | Engine Oil Pressure Sensor |
|---|---|
Use Scenario: Real-time monitoring of tire inflation pressure in passenger vehicles using MEMS piezoresistive bridge sensors. IC Role / Device Role / Timing Role: Signal conditioner and LIN transmitter - digitizes bridge output, applies temperature-compensated correction, and publishes calibrated pressure value via LIN frame every 100–500 ms. Use Value: Enables single-chip solution with AEC-Q100 qualification, eliminating external ADC, MCU, and LIN transceiver while maintaining ±0.5% FSO accuracy across −40°C to +125°C. | Use Scenario: Closed-loop oil pressure feedback in engine control units for variable displacement oil pumps. IC Role / Device Role / Timing Role: High-reliability bridge signal conditioner with PWM output - delivers fast-response (≤20 ms), duty-cycle–modulated signal directly to ECU PWM input. Use Value: Supports high-speed PWM mode with 11-bit resolution and diagnostic coverage (short/open detection), reducing system latency versus LIN and simplifying ECU interface design. |
| Brake Fluid Level Sensor | Transmission Force Sensor |
Use Scenario: Contactless fluid level detection using strain-gauge–based diaphragm sensors in brake reservoirs. IC Role / Device Role / Timing Role: Low-power signal conditioner with LIN publisher - operates in LIN Sleep Mode (≤100 µA) between periodic wake-up events for level reporting. Use Value: Meets automotive sleep-current budgets while delivering calibrated level data via standardized LIN frames, easing integration with existing body control modules. | Use Scenario: Gearshift actuator force feedback in dual-clutch transmissions using thin-film resistive bridge sensors. IC Role / Device Role / Timing Role: Precision conditioner with dual temperature sensing - corrects bridge output using internal die temperature and external media temperature (via VTN1/VTN2 diode). Use Value: Compensates for both silicon self-heating and oil-temperature–induced drift simultaneously, achieving stable force measurement across wide thermal gradients (−40°C to +150°C). |
Equivalent & Alternatives
The following parts are listed as comparable options for similar sensor signal conditioning applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MAX1452ACM+T | 24-bit sigma-delta ADC, no integrated LIN interface, requires external microcontroller for digital compensation | Targeted at high-precision industrial sensors; lacks automotive qualification and built-in diagnostics | Choose when ultra-high resolution (>20-bit) is required and system-level MCU resources are available for compensation logic |
| AD8555ARZ | Chopper-stabilized instrumentation amp + 16-bit ADC + EEPROM; no LIN/PWM output, only analog/digital outputs | Designed for general-purpose bridge conditioning; not AEC-Q100 qualified and lacks automotive protection features | Choose for cost-sensitive non-automotive applications where analog output suffices and EMC robustness is less critical |
Compared with MAX1452ACM+T and AD8555ARZ, the ZSSC3170FE2R uniquely integrates LIN/PWM output, AEC-Q100 qualification, and automotive-grade diagnostics in a single SSOP20 package-reducing system complexity, validation effort, and PCB area for automotive Tier-1 suppliers.
Availability
ZSSC3170FE2R is available at Aetrix Electronics and suitable for automotive pressure sensing, engine management, and transmission control applications requiring stable component supply, long-term lifecycle support, and RoHS-compliant SSOP20 packaging.
Supply support for ZSSC3170FE2R includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Integrated Device Technology (IDT), now part of Renesas Electronics, is a fabless semiconductor company specializing in timing, memory interface, RF, and sensor signal conditioning solutions for communications, computing, and automotive markets.
The ZSSC3170 product line was engineered specifically for automotive bridge sensor signal conditioning - emphasizing AEC-Q100 reliability, integrated diagnostics, LIN/PWM interoperability, and zero-trimming operation in harsh under-hood environments.
FAQ
What is the maximum operating temperature range supported by the ZSSC3170FE2R?
The ZSSC3170FE2R is rated for continuous operation from −40°C to +125°C, with extended capability up to +150°C for limited-duration exposure (e.g., 1000 hours). This rating is validated per AEC-Q100 stress testing and applies to the SSOP20 packaged variant. The device maintains ±0.50% FSO accuracy across the full −40°C to +125°C range, making it suitable for engine bay and transmission control applications where thermal stability is critical. The ZSSC3170FE2R datasheet specifies absolute maximum storage temperature up to +170°C for short durations.
Does the ZSSC3170FE2R require external components for basic operation?
No, the ZSSC3170FE2R is designed for minimal external component count: only decoupling capacitors (e.g., 100 nF on VDD, 220 nF on VBAT) and optional pull-up resistors for LIN or I²C are required for standard operation. It integrates a programmable gain amplifier, 14-bit ADC, 16-bit RISC microcontroller, automotive EEPROM, LIN transceiver, and PWM drivers - eliminating external op-amps, ADCs, MCUs, and communication transceivers. The ZSSC3170FE2R supports single-pass calibration, removing the need for trimming potentiometers or laser adjustment during manufacturing.
How does the ZSSC3170FE2R handle temperature compensation for bridge sensors?
The ZSSC3170FE2R performs digital compensation of temperature-induced errors using sensor-specific coefficients stored in its automotive-qualified EEPROM. It corrects offset, sensitivity, and nonlinearity up to 3rd order, and temperature drift up to 2nd order, based on either its internal die temperature sensor or an external diode/RTD connected to VTN1/VTN2. The conditioning algorithm runs on the on-chip 16-bit RISC microcontroller and applies corrections in real time before outputting via LIN or PWM. This enables the ZSSC3170FE2R to achieve ±0.50% FSO accuracy from −40°C to +125°C without external compensation circuitry.
Can the ZSSC3170FE2R be calibrated using the LIN interface?
Yes, the ZSSC3170FE2R supports end-of-line calibration using its LIN interface - the LIN bus serves both as a data output channel and a bidirectional calibration interface. During calibration, the host tool sends configuration commands and reads raw or conditioned sensor values over LIN, allowing full coefficient programming (offset, gain, temperature terms) into the EEPROM without requiring separate I²C hardware access. This capability is explicitly enabled in LIN Mode and leverages the ZSSC3170FE2R's digital mating architecture, which minimizes noise susceptibility compared to analog calibration methods. The ZSSC3170FE2R datasheet confirms LIN-based calibration is supported per LIN specification 2.1.
What diagnostic functions are built into the ZSSC3170FE2R?
The ZSSC3170FE2R integrates multiple hardware-based diagnostics: sensor connection loss detection (threshold: 20–100 kΩ), sensor short detection (threshold: 50–1000 Ω), and sensor aging monitoring. It also includes LIN bus voltage monitoring, PWM driver fault detection (open-load, short-to-battery/ground), and internal supply/temperature watchdogs. These diagnostics are configurable via EEPROM registers and generate status flags accessible through LIN or I²C. All diagnostics meet automotive functional safety requirements and reduce the need for external monitoring circuitry - a key design advantage of the ZSSC3170FE2R in ASIL-B–capable systems.
ZSSC3170FE2R Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Renesas
- Series:
- -
- Package/Case:
- 20-SSOP (0.209", 5.30mm Width)
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Applications:
- Sensor Signal Conditioner - Resistive
- Interface:
- I2C, LIN, PWM, ZACwire™ One-Wire Interface
- Voltage - Supply:
- 4.75V ~ 5.25V
- Supplier Device Package:
- 20-SSOP
- Grade:
- Automotive
- Qualification:
- AEC-Q100
- Mounting Type:
- Surface Mount
ZSSC3170FE2R FAQ
1.How can I place an order for ZSSC3170FE2R through Aetrix?
Please submit a Request for Quotation (RFQ) for ZSSC3170FE2R on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for ZSSC3170FE2R reliable?
The price and inventory of ZSSC3170FE2R are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for ZSSC3170FE2R is usually 5 days.
3.What payment methods are accepted for ZSSC3170FE2R?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for ZSSC3170FE2R transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for ZSSC3170FE2R?
ZSSC3170FE2R orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your ZSSC3170FE2R order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for ZSSC3170FE2R?
For technical support, including ZSSC3170FE2R datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your ZSSC3170FE2R requirements.
6.How does Aetrix verify that ZSSC3170FE2R is sourced from the original manufacturer or authorized distributors?
All ZSSC3170FE2R products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that ZSSC3170FE2R meets industry standards.
7.What is the process for return or replacement of ZSSC3170FE2R?
All ZSSC3170FE2R units undergo pre-shipment inspection (PSI). If there is an issue with ZSSC3170FE2R, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The ZSSC3170FE2R part is unused and in its original packaging.
Return procedure for ZSSC3170FE2R:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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