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Renesas ZSSC3170FE2T
- Part No.:
- ZSSC3170FE2T
- Manufacturer:
- Renesas
- Category:
- Specialized
- Package:
- 20-SSOP (0.209", 5.30mm Width)
- Datasheet:
-
ZSSC3170FE2T.pdf
- Description:
- IC INTFACE SPECIALIZED SGNL COND
- Quantity:
- Payment:
- Shipping:
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Product details
Overview
ZSSC3170FE2T from Integrated Device Technology (IDT) is an AEC-Q100-qualified automotive sensor signal conditioner IC designed to digitize, linearize, and temperature-compensate resistive bridge sensors. It delivers ±0.50% FSO accuracy over −40°C to +125°C, supports LIN 1.3/2.0/2.1 and PWM output interfaces, and integrates a 14-bit ADC with programmable gain up to 420 for bridge spans from 1.8 to 267 mV/V - used in engine manifold pressure, brake fluid pressure, and HVAC refrigerant pressure sensing systems.
For engineers reviewing the ZSSC3170FE2T datasheet, ZSSC3170FE2T pinout, ZSSC3170FE2T application, or ZSSC3170FE2T equivalent, key selection considerations include its dual-output interface flexibility (LIN vs. PWM), on-chip EEPROM storage of 2nd-order temperature and 3rd-order nonlinearity compensation coefficients, integrated high-voltage LIN protection (±40 V), and support for end-of-line calibration via digital interface without external trimming components.
Technical Context
The ZSSC3170FE2T implements a two-stage analog front-end with a programmable gain amplifier (PGA) and 14-bit successive-approximation ADC, followed by a dedicated 16-bit RISC microcontroller executing sensor-specific correction algorithms stored in automotive-grade EEPROM. Its signal path supports simultaneous bridge and temperature measurement (internal diode, external diode, or RTD), with configurable offset compensation (XZC) and dual-mode operation (LIN publisher or PWM high-/low-side switch).
Digital conditioning applies 2nd-order polynomial correction for temperature drift and 3rd-order for nonlinearity, using coefficients written during calibration. The LIN interface complies fully with LIN 2.1 physical layer specifications, including load-dump immunity, recessive/dominant voltage thresholds, and slew-rate control (0.5–3 V/µs), while the PWM interface provides up to 11-bit full-scale resolution with adjustable 1–99% duty cycle and <20 ms response time in typical configuration.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Accuracy | ±0.50% FSO over −40°C to +125°C - guarantees total error budget including offset, gain, INL, DNL, and temperature-induced drift under automotive operating conditions. |
| ADC Resolution | 14-bit - enables high-resolution digitization of low-level bridge signals (as low as 1.8 mV/V) with ≤8 LSB INL and ≤0.95 LSB DNL. |
| Max Analog Gain | 420 - allows direct interfacing with ultra-low-output MEMS or thin-film bridge sensors without external amplification. |
| LIN Compliance | LIN 1.3 / 2.0 / 2.1 - ensures interoperability with standard automotive LIN master nodes and supports frame-based data publishing at up to 430 Hz. |
| PWM Output | 11-bit full-scale resolution, 1–99% duty cycle - delivers calibrated analog-equivalent output compatible with standard PWM-input ECUs and motor controllers. |
| EEPROM Endurance | 100 write cycles @ 150°C - certified for reprogramming during end-of-line calibration in high-temp automotive environments. |
| Supply Voltage | 7–18 V - operates directly from vehicle battery rail with integrated protection against reverse polarity, load dump (±40 V on LIN), and short-circuit faults. |
Pinout & Package
Package: SSOP20 (Shrink Small Outline Package, 20-pin, 0.65 mm pitch, RoHS-compliant). Pinout validated per IDT ZSSC3170 datasheet Section 4.2 and Figure 1 on page 25.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VBP / VBN | Bridge Sensor Positive/Negative Input | Differential inputs for Wheatstone bridge; support common-mode range of 29–65% VDDA and offset compensation up to 388% of input span. |
| HOUT / LOUT | PWM High-Side / Low-Side Output | Configurable as open-drain high-side switch (HOUT) or low-side driver (LOUT); each supports 15 mA source/sink with <15 µs rise/fall time. |
| LIN | LIN Bus Interface Pin | Integrated LIN transceiver I/O with ±40 V load-dump protection, 40–200 mA dominant current, and compliant recessive/dominant voltage thresholds. |
| VTN1 / VTN2 | External Temperature Sensor Inputs | Support diode or RTD connections for media temperature sensing; bias current 10–40 µA, input range 0–1.5 V relative to VVBR_T. |
| SCL / SDA | I²C Calibration Interface | 2-wire interface for coefficient programming and real-time measurement readout during calibration; supports 400 kHz clock and 400 pF bus capacitance. |
| VB / VSSE | Main Supply Input / External Ground Reference | Accepts 7–18 V supply; VSSE serves as isolated ground reference for bridge and PWM outputs to suppress common-mode noise. |
Key Features
| Feature | Design Value |
|---|---|
| Dual digital output interface | LIN 2.1 publisher mode and PWM high-/low-side switch selectable via EEPROM configuration - eliminates need for external protocol translators or discrete drivers. |
| On-chip 2nd/3rd-order compensation | Corrects bridge offset, sensitivity, temperature drift (2nd order), and nonlinearity (3rd order) using coefficients stored in automotive EEPROM - removes requirement for external lookup tables or host MCU computation. |
| End-of-line calibration support | Digital calibration via LIN or I²C using actual sensor output - enables single-pass calibration at final assembly, reducing test time and fixture complexity. |
| AEC-Q100 qualified | Qualified to Grade 0 (−40°C to +150°C) with built-in diagnostics including sensor connection loss detection (20–100 kΩ threshold), short-check, and watchdog - meets ASIL-B readiness requirements. |
| Integrated high-voltage protection | LIN pin withstands ±40 V load dump; VB pin rated to 18 V; all analog pins protected to ±0.3 V beyond VDDA - eliminates need for external TVS diodes or protection networks. |
Applications
| Engine Intake Manifold Pressure Sensing | Brake Fluid Pressure Monitoring |
|---|---|
Use Scenario: Measures absolute pressure in gasoline/diesel intake manifolds for ECU air-mass calculation and boost control. IC Role / Device Role / Timing Role: Signal conditioner digitizes piezoresistive bridge output, applies temperature-compensated linearization, and transmits calibrated value via LIN to ECU every 2.3 ms (430 Hz). Use Value: Enables closed-loop boost control with ±0.5% FSO accuracy across full engine operating range (−40°C to +125°C), eliminating analog signal degradation over harness length. | Use Scenario: Monitors hydraulic pressure in ABS/ESC brake circuits to detect system integrity and assist active safety functions. IC Role / Device Role / Timing Role: Interfaces with stainless-steel diaphragm bridge sensor; performs real-time offset/gain/temperature correction; outputs PWM signal to brake controller with <20 ms response time. Use Value: Provides fail-safe pressure feedback with integrated diagnostics (sensor open/short detection) and load-dump immunity - critical for ISO 26262 ASIL-B compliance. |
| HVAC Refrigerant Pressure Control | Transmission Oil Pressure Feedback |
Use Scenario: Regulates compressor speed and expansion valve position in automotive climate control systems using R134a/R1234yf refrigerant pressure. IC Role / Device Role / Timing Role: Conditions bridge sensor with integrated media temperature sensing (via external diode on VTN1); outputs LIN frame containing both pressure and temperature values. Use Value: Delivers dual-parameter output over single LIN wire, reducing wiring harness weight and connector count while maintaining ±0.5% FSO accuracy at 125°C under hood. | Use Scenario: Supplies real-time oil pressure data to transmission control unit (TCU) for shift timing optimization and wear monitoring. IC Role / Device Role / Timing Role: Interfaces with high-temp bridge sensor; uses internal temperature diode for on-chip thermal compensation; outputs calibrated PWM signal with 11-bit resolution. Use Value: Ensures robust pressure reporting under extreme thermal cycling (−40°C to +150°C), with EEPROM-retained coefficients surviving 15-year vehicle lifetime per JEDEC JESD22-A117. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar sensor signal conditioning applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MAX1452AAO+T | 16-bit DAC-based analog signal conditioner; no integrated LIN/PWM output; requires external microcontroller for digital communication. | Used in industrial pressure transmitters where SPI/I²C host interface is available; lacks automotive qualification and load-dump protection. | Select when system already includes a host MCU and requires higher analog precision (±0.1% FSO) but does not require embedded protocol output. |
| AS8510BQFT | 16-bit sensor signal conditioner with SENT output only; no LIN or PWM interface; supports SPI calibration interface and 2nd-order compensation. | Targeted at powertrain applications requiring SENT compliance (e.g., crankshaft position); lacks temperature sensor inputs and media sensing capability. | Select for SENT-based architectures needing high-speed deterministic output (up to 125 kbps), but not suitable for LIN/PWM legacy systems or dual-sensor (pressure + temp) use cases. |
Compared with MAX1452AAO+T and AS8510BQFT, the ZSSC3170FE2T uniquely integrates LIN 2.1 and PWM output drivers with automotive-grade EEPROM, enabling standalone operation in cost-sensitive ECU-peripheral designs without host processor dependency or external protection circuitry.
Availability
ZSSC3170FE2T is available at Aetrix Electronics and suitable for automotive pressure sensing, brake system monitoring, HVAC refrigerant control, and transmission oil pressure feedback requiring stable component supply across extended temperature ranges and long production lifecycles.
Supply support for ZSSC3170FE2T includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Integrated Device Technology (IDT), now part of Renesas Electronics, is a fabless semiconductor company specializing in timing, memory interface, RF, and sensor signal conditioning solutions for automotive, industrial, and communications markets.
The ZSSC3170 product line was engineered specifically for automotive bridge sensor signal conditioning - delivering integrated LIN/PWM output, AEC-Q100 qualification, and on-chip temperature compensation to simplify Tier-1 pressure sensor module design.
FAQ
What is the operating temperature range supported by the ZSSC3170FE2T?
The ZSSC3170FE2T is specified for continuous operation from −40°C to +125°C, with extended functionality validated up to +150°C for 1000 hours. Its AEC-Q100 Grade 0 qualification confirms reliability under full automotive under-hood thermal stress, and the device maintains ±0.50% FSO accuracy across the −40°C to +125°C range - critical for engine bay and transmission-mounted pressure sensors.
Does the ZSSC3170FE2T support both LIN and PWM output simultaneously?
No, the ZSSC3170FE2T supports either LIN or PWM output mode, selected at configuration time via EEPROM programming. In LIN mode, it acts as a LIN 2.1 publisher transmitting calibrated sensor data in standardized frames; in PWM mode, it drives HOUT or LOUT as a high- or low-side switch with 11-bit resolution. Dual-mode operation is not concurrent - the interface must be fixed per application.
How is calibration performed for the ZSSC3170FE2T?
Calibration for the ZSSC3170FE2T is performed end-of-line using either the LIN interface or the I²C port (SCL/SDA pins). During calibration, raw sensor and temperature measurements are captured, and 2nd-order temperature and 3rd-order nonlinearity coefficients are computed and written to its automotive EEPROM. The ZSSC3170FE2T then autonomously applies these corrections in real time without host intervention.
What types of temperature sensing does the ZSSC3170FE2T support?
The ZSSC3170FE2T supports three temperature sensing configurations: internal diode (on-die), external diode (connected to VTN1/VTN2), or external RTD/resistor (via VTN1/VTN2). Each is selectable via EEPROM configuration. Internal diode enables on-chip thermal compensation; external diode supports media temperature sensing (e.g., refrigerant or oil); RTD mode provides higher accuracy for critical thermal monitoring.
Is the ZSSC3170FE2T pin-compatible with earlier ZSSC3170 revisions?
Yes, the ZSSC3170FE2T (Revision F, SSOP20 package) maintains identical pinout and electrical behavior with prior ZSSC3170E-series SSOP20 variants (e.g., ZSSC3170EE2). Revision F adds enhanced diagnostic features including sensor aging check and improved SCC/SSC functionality, but requires no PCB layout changes or firmware updates when replacing ZSSC3170EE2 in existing designs.
ZSSC3170FE2T Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Renesas
- Series:
- -
- Package/Case:
- 20-SSOP (0.209", 5.30mm Width)
- Packaging:
- Tube
- Product Status:
- Active
- Applications:
- Sensor Signal Conditioner - Resistive
- Interface:
- I2C, LIN, PWM, ZACwire™ One-Wire Interface
- Voltage - Supply:
- 4.75V ~ 5.25V
- Supplier Device Package:
- 20-SSOP
- Grade:
- Automotive
- Qualification:
- AEC-Q100
- Mounting Type:
- Surface Mount
ZSSC3170FE2T FAQ
1.How can I place an order for ZSSC3170FE2T through Aetrix?
Please submit a Request for Quotation (RFQ) for ZSSC3170FE2T on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for ZSSC3170FE2T reliable?
The price and inventory of ZSSC3170FE2T are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for ZSSC3170FE2T is usually 5 days.
3.What payment methods are accepted for ZSSC3170FE2T?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for ZSSC3170FE2T transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for ZSSC3170FE2T?
ZSSC3170FE2T orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your ZSSC3170FE2T order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for ZSSC3170FE2T?
For technical support, including ZSSC3170FE2T datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your ZSSC3170FE2T requirements.
6.How does Aetrix verify that ZSSC3170FE2T is sourced from the original manufacturer or authorized distributors?
All ZSSC3170FE2T products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that ZSSC3170FE2T meets industry standards.
7.What is the process for return or replacement of ZSSC3170FE2T?
All ZSSC3170FE2T units undergo pre-shipment inspection (PSI). If there is an issue with ZSSC3170FE2T, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The ZSSC3170FE2T part is unused and in its original packaging.
Return procedure for ZSSC3170FE2T:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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