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Renesas ZSSC3224BI1C
- Part No.:
- ZSSC3224BI1C
- Manufacturer:
- Renesas
- Category:
- Sensor and Detector Interfaces
- Package:
- -
- Datasheet:
-
ZSSC3224BI1C.pdf
- Description:
- DICE (WAFER SAWN) - FRAME
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Product details
Overview
ZSSC3224BI1C from Integrated Device Technology (IDT) is a 24-bit sensor signal conditioner IC designed for high-accuracy amplification, digitization, and digital compensation of resistive bridge or absolute voltage sensors. It integrates a programmable gain amplifier (6.6–216×), 26-bit DSP-based correction engine, internal 18-bit temperature sensor, and dual-mode I²C (≤3.4 MHz) / SPI (≤20 MHz) interface - enabling ±0.10% FSO accuracy from –40°C to +85°C in barometric pressure and thermopile-based radiation sensing.
For engineers reviewing the ZSSC3224BI1C datasheet, ZSSC3224BI1C pinout, ZSSC3224BI1C application, or ZSSC3224BI1C equivalent, this page delivers verified technical context on its analog front-end configuration, 24-PQFN package layout, calibration memory architecture, and real-world use in calibrated industrial pressure modules and portable altitude measurement systems.
Technical Context
The ZSSC3224BI1C implements a two-stage programmable gain amplifier followed by a 24-bit sigma-delta ADC with auto-zero and offset cancellation. Its 26-bit DSP executes configurable 1st/2nd-order temperature compensation for both sensor offset and span drift, using coefficients stored in on-chip MTP memory.
Digital output supports either I²C or SPI protocols with dedicated EOC interrupt signaling and RES-controlled hardware reset. The device operates from 1.68 V to 3.6 V, draws 1.05 mA typical active current, and achieves 20 nA sleep current - optimized for battery-powered precision sensor modules requiring die-level integration via wafer bonding or 4.0 mm × 4.0 mm PQFN packaging.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| ADC Resolution | 24-bit sigma-delta with 12-bit raw mode; enables <0.7 mK/LSB temperature resolution and ±0.10% FSO total error. |
| Programmable Gain Range | 6.6× to 216× in 64 discrete steps; allows direct interface with low-output mV/V bridge sensors without external amplification. |
| Temperature Sensor | Integrated 18-bit auto-compensated sensor; provides on-chip reference for simultaneous dual-signal correction (sensor + temp). |
| Digital Interface | I²C (≤3.4 MHz) or SPI (≤20 MHz); supports command-mode configuration, status polling, and conditioned data readout with EOC interrupt. |
| Supply Voltage | 1.68 V to 3.6 V; compatible with single-cell Li-ion, coin-cell, and low-voltage industrial rails. |
| Active Current | 1.05 mA typical at 3.3 V; supports >200 conditioned measurements per second at 18-bit resolution. |
| Sleep Current | 20 nA typical; enables multi-year operation in battery-powered environmental monitoring nodes. |
| Operating Temperature | –40°C to +85°C; qualified for automotive cabin, industrial pneumatic, and consumer navigation applications. |
Pinout & Package
Package: 4.0 mm × 4.0 mm × 0.85 mm, 24-pin PQFN with exposed thermal pad (non-electrical). Pinout validated per IDT datasheet Rev. Nov 2018, Table 1.2 and Figure 1.2.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1, 7, 16, 18, 19 | ZMDI-test | Factory test pads - must remain unconnected in production design. |
| 2 | RES | Active-low hardware reset; internal pull-up; enables deterministic power-on initialization independent of VDD ramp rate. |
| 3 | VDDB | Positive bridge-sensor supply output; programmable 1.60–1.75 V; powers external resistive sensor elements directly. |
| 4 | INN | Negative input for differential bridge or ground reference for absolute voltage sensors (e.g., thermopiles). |
| 5 | EOC | Open-drain end-of-conversion interrupt; signals completion of full signal conditioning pipeline (ADC + DSP + compensation). |
| 6 | MISO | SPI data output only; tri-stated when I²C mode is selected. |
| 12 | SCLK/SCL | Shared clock input for SPI (SCLK) or I²C (SCL); supports dual-interface flexibility without PCB redesign. |
| 13 | MOSI/SDA | Bidirectional data line: MOSI in SPI mode, SDA in I²C mode; eliminates need for protocol-switching logic. |
| 14 | VSSB | Negative bridge-sensor supply return; isolated analog ground for sensor biasing to minimize coupling noise. |
| 15 | INP | Positive input for differential bridge or signal source for absolute voltage sensors. |
| 17 | SS | SPI slave select; enables multi-device daisy-chaining or shared bus arbitration. |
| 22 | VDD | Main IC supply input; powers digital core, DSP, and interface logic. |
| 24 | VSS | Digital/analog common ground reference; separate from VSSB to support split-ground sensor architectures. |
Key Features
| Feature | Design Value |
|---|---|
| One-pass calibration | Reduces factory test time by eliminating iterative trimming; all coefficients programmed once via serial interface. |
| No external components required | Eliminates external filters, buffers, or trimming resistors - reduces BOM count and PCB area in space-constrained modules. |
| Dual-sensor correction math | Simultaneously corrects primary sensor signal and internal temperature reading using shared 26-bit DSP resources. |
| Die-bonding optimized layout | Pad arrangement matches standard wafer-level stacking for chip-on-board integration with MEMS pressure dies or thermopiles. |
| Low-energy conversion | Consumes <100 pJ/step at 18-bit resolution - critical for energy harvesting and ultra-low-power IoT edge nodes. |
| Multiple-time programmable memory | On-chip MTP stores calibration coefficients with >100 write cycles; enables field recalibration or firmware updates. |
Applications
| Barometric Altitude Measurement | Industrial Pressure Sensing |
|---|---|
|
Use Scenario: Portable emergency call systems and automotive navigation units require precise altitude estimation from ambient air pressure. IC Role / Device Role / Timing Role: ZSSC3224BI1C conditions piezoresistive bridge output, applies temperature-compensated span/offset correction, and outputs calibrated digital pressure value via I²C. Use Value: Achieves ±0.10% FSO accuracy across –40°C to +85°C without external compensation circuitry, enabling sub-1-meter altitude resolution. |
Use Scenario: Factory pneumatic control systems monitor compressed air line pressure with long-term stability and minimal drift. IC Role / Device Role / Timing Role: ZSSC3224BI1C interfaces with stainless-steel strain-gauge bridges, performs 2nd-order temperature drift correction, and delivers SPI-streamed 24-bit readings at >200 Hz. Use Value: Eliminates manual calibration labor and external op-amps, reducing module cost while maintaining <0.15% total error over 10-year service life. |
| Thermopile-Based Object Temperature | Weather Station Barometry |
|
Use Scenario: Contactless infrared thermometers measure surface temperature of machinery or human skin using thermopile voltage output. IC Role / Device Role / Timing Role: ZSSC3224BI1C accepts absolute millivolt-level thermopile signal, applies cold-junction compensation using its internal temperature sensor, and outputs corrected temperature in digital format. Use Value: Delivers <0.7 mK/LSB resolution and ±0.5°C system accuracy without external thermistor networks or analog multiplexers. |
Use Scenario: Consumer weather stations track atmospheric pressure trends for short-term forecasting with high repeatability. IC Role / Device Role / Timing Role: ZSSC3224BI1C digitizes low-noise MEMS barometer bridge output, applies factory-calibrated 2nd-order polynomial compensation, and reports I²C data every 100 ms. Use Value: Enables 0.01 hPa pressure resolution and <1 Pa/h drift specification - meeting WMO Class II requirements for personal weather instrumentation. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar sensor signal conditioning applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| TDK InvenSense ICM-20948 | Integrated 9-axis IMU with embedded DMP; lacks dedicated 24-bit bridge ADC and programmable analog front-end. | Targets motion sensing, not high-accuracy static pressure/temperature; no MTP-based sensor-specific calibration math. | Choose ICM-20948 only if motion fusion is required alongside basic pressure sampling - not for standalone precision SSC replacement. |
| Analog Devices AD7798 | 24-bit ΣΔ ADC with PGA but no integrated DSP, temperature sensor, or MTP memory; requires external microcontroller for compensation. | Needs host MCU to run correction algorithms; increases firmware complexity and fails to match ZSSC3224BI1C's one-pass calibration workflow. | AD7798 suits designs where algorithm flexibility outweighs time-to-market - not for drop-in replacement in calibrated sensor modules. |
Compared with ICM-20948 and AD7798, the ZSSC3224BI1C uniquely integrates sensor-specific correction math, factory-programmable MTP coefficients, and dual-sensor (bridge + temp) compensation in a single die - reducing system-level BOM, firmware overhead, and calibration labor for high-volume pressure and thermopile modules.
Availability
ZSSC3224BI1C is available at Aetrix Electronics and suitable for barometric altitude measurement, industrial pressure monitoring, and thermopile-based object temperature sensing requiring stable component supply, long-lifecycle support, and calibrated performance traceability.
Supply support for ZSSC3224BI1C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Integrated Device Technology (IDT), acquired by Renesas in 2019, specializes in high-performance timing, memory interface, RF, and sensor signal processing ICs for communications, computing, and industrial markets.
The ZSSC3224BI1C belongs to IDT's precision sensor signal conditioner product line, engineered specifically for factory-calibrated resistive bridge and thermopile sensor modules demanding integrated compensation, ultra-low power, and wafer-level integration capability.
FAQ
What is the primary function of the ZSSC3224BI1C in a sensor system?
The ZSSC3224BI1C serves as a complete sensor signal conditioner IC that acquires, amplifies, digitizes, and digitally compensates analog signals from resistive bridge or absolute voltage sensors. It performs offset, span, and 1st/2nd-order temperature compensation using on-chip 26-bit DSP and stores calibration coefficients in MTP memory - delivering fully corrected digital output via I²C or SPI without external processing. This makes ZSSC3224BI1C ideal for high-accuracy pressure and temperature modules where analog signal integrity and factory calibration reproducibility are critical.
Does the ZSSC3224BI1C support both I²C and SPI communication simultaneously?
No, the ZSSC3224BI1C supports I²C or SPI operation - not both simultaneously. Interface selection is determined during power-up via the state of the SS pin: SS held high selects I²C mode; SS pulled low selects SPI mode. Once initialized, the interface remains fixed until reset. The ZSSC3224BI1C shares pins (MOSI/SDA and SCLK/SCL) between protocols, allowing flexible board design with single-footprint compatibility for either interface - but only one can be active per power cycle.
How does the ZSSC3224BI1C handle temperature compensation for bridge sensors?
The ZSSC3224BI1C uses its integrated 18-bit temperature sensor to measure die temperature and applies 1st- and 2nd-order digital compensation to both sensor offset and sensitivity drift across –40°C to +85°C. Compensation coefficients are pre-programmed into on-chip MTP memory during factory calibration and applied in real time by the 26-bit DSP. This eliminates need for external thermistors or lookup tables, and enables ZSSC3224BI1C to achieve ±0.10% FSO total error in pressure modules without post-assembly calibration.
What is the role of the VDDB and VSSB pins on the ZSSC3224BI1C?
VDDB (Pin 3) and VSSB (Pin 14) form an isolated analog power pair that supplies and returns current to external resistive bridge sensors. VDDB outputs a regulated 1.60–1.75 V, while VSSB provides a dedicated low-noise ground return - electrically separated from the main VDD/VSS supply domain. This separation prevents digital switching noise from coupling into the sensitive bridge measurement path, preserving ZSSC3224BI1C's 24-bit effective resolution and enabling accurate low-mV/V signal conditioning in high-EMI industrial environments.
Can the ZSSC3224BI1C operate from a 1.8 V supply, and what is its typical current draw?
Yes, the ZSSC3224BI1C operates across 1.68 V to 3.6 V, including standard 1.8 V rails. At 1.8 V and typical operating conditions, it draws 1.05 mA in active measurement mode and only 20 nA in Sleep Mode - making it suitable for battery-powered applications like portable altimeters and wireless weather sensors. Its energy efficiency is quantified as <100 pJ/step at 18-bit resolution, ensuring minimal impact on battery lifetime even with frequent measurement cycles.
ZSSC3224BI1C Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Renesas
- Package/Case:
- -
- Series:
- -
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- -
- Type:
- -
- Input Type:
- -
- Output Type:
- -
- Current - Supply:
- -
- Operating Temperature:
- -
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- -
- Supplier Device Package:
- -
ZSSC3224BI1C FAQ
1.How can I place an order for ZSSC3224BI1C through Aetrix?
Please submit a Request for Quotation (RFQ) for ZSSC3224BI1C on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for ZSSC3224BI1C reliable?
The price and inventory of ZSSC3224BI1C are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for ZSSC3224BI1C is usually 5 days.
3.What payment methods are accepted for ZSSC3224BI1C?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for ZSSC3224BI1C transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for ZSSC3224BI1C?
ZSSC3224BI1C orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your ZSSC3224BI1C order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for ZSSC3224BI1C?
For technical support, including ZSSC3224BI1C datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your ZSSC3224BI1C requirements.
6.How does Aetrix verify that ZSSC3224BI1C is sourced from the original manufacturer or authorized distributors?
All ZSSC3224BI1C products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that ZSSC3224BI1C meets industry standards.
7.What is the process for return or replacement of ZSSC3224BI1C?
All ZSSC3224BI1C units undergo pre-shipment inspection (PSI). If there is an issue with ZSSC3224BI1C, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The ZSSC3224BI1C part is unused and in its original packaging.
Return procedure for ZSSC3224BI1C:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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